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9 research outputs found
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles
Author
A Roshanghias
A Yakymovych
+41Â more
A Yakymovych
A. Roshanghias
A. Yakymovych
AK Gain
ASMA Haseeb
BA Cook
C Schmetterer
D. JaniÄŤkoviÄŤ
DA Shnawah
GK Sujan
H Ma
H. Ipser
IE Anderson
IE Anderson
K Mehrabi
KE Yazzie
L. Orovcik
LC Tsao
M Amagai
M Deanko
M. Nosko
MN Bashir
N. Beronská
P Babaghorbani
P. Ĺ ebo
P. Ĺ vec
PL Rossiter
R Kolenak
S Chellvarajoo
S Mhiaoui
SK Kang
SL Tay
T Fouzder
T Laurila
W Zhai
Y Gu
Y Plevachuk
Y Tang
Y Tang
Yu. Plevachuk
YW Wang
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
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Crossref
Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing
Author
AR Fix
B Zhang
+51Â more
CM Miller
D Li
D Suh
DA-A Shnawah
DA-A Shnawah
DA-A Shnawah
DA-A Shnawah
DA-A Shnawah
DA-A Shnawah
DA-A Shnawah
Dhafer Abdulameer Shnawah
DYR Chong
EH Wong
EH Wong
F Zhang
Fa Xing Che
GE Dieter
IE Anderson
IE Anderson
IE Anderson
IE Anderson
Irfan Anjum Badruddin
J-W Kim
JJ Sundelin
JL Pang
JW Elmer
K Mishiro
KN Subramanian
KS Kim
KW Moon
L Xu
M Reid
M Sumikawa
Mohd Faizul Mohd Sabri
R Fix
RO Ritchie
S Choi
S Terashima
S Terashima
S Terashima
S-K Seo
Suhana Binti Mohd Said
T You
Tadashi Ariga
TT Mattila
W Liu
W Peng
Y Kariya
Y Kariya
Y-S Lai
YW Wang
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
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Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles
Author
A Ting Tan
CL Chuang
+14Â more
DA Shnawah
K Mehrabi
K. Narayan Prabhu
KM Kumar
L Yang
LC Tsao
M Abtew
O Fornaro
OM Abdelhadi
S Xu
S Xu
Sanjay Tikale
SML Nai
TT Dele-Afolabi
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
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Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion
Author
A Paul
AA El-Daly
+24Â more
AA El-Daly
Anwesha Kanjilal
B Talebanpor
DA Shnawah
G Lim
I Dutta
I Dutta
J Shen
JHL Pang
K Subramanian
K Zeng
KN Tu
L Xu
L Zhang
M Jeong
MA Clarkt
P Kumar
P Vianco
Praveen Kumar
PT Vianco
R Ghosh
TT Nguyen
WJ Boettinger
Z Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
Author
AA El-Daly
C.J. Hou
+33Â more
CC Pan
CE Ho
DA Porter
DA Shnawah
DX Luo
F Cheng
G.Y. Li
GY Li
H Wang
IE Anderson
J Wu
K Kanlayasiri
K Kanlayasiri
L Zhang
LC Tsao
LC Tsao
LC Tsao
LW Lin
M Yang
N Mookam
N Mookam
RE Reed-Hill
RW Wu
S.M. Luo
WL Chiu
X Deng
X Yan
Y Gu
Y Liu
Y Tang
Y. Tang
YM Leong
Z.H. Li
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Mixing enthalpy of Ag–Sn system at 1150 °C
Author
Andrey Bykov
AT Dinsdale
+31Â more
C Luef
CY Ho
D Giuranno
DA Shnawah
E Ă–ztĂĽrk
Eduard Pastukhov
F Khodabakhshi
F Tian
F Wang
H Flandorfer
HR Kotadia
J Keller
KI Oleinik
Ksenia Oleinik
M Drienovsky
M Mouas
MFM Nazeri
MJ Pool
ML Huang
NAAM Amin
O Kubaschewski
RL Sharkey
RR Hultgren
S Cheng
S Herat
S Xu
UD Veryatin
VV Filippov
X Hu
Y Yang
Z Li
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Effects of Minute Addition of Ni on Microstructure and Mechanical Properties of Sn-Zn Eutectic Alloy
Author
BF Dyson
C. S. Tiwary
+33Â more
CML Wu
CS Tiwary
CS Tiwary
DA Shnawah
F Wang
FH Huang
G Zeng
H Ma
H Wang
JE Gruzleski
K Suganuma
K Suganuma
K Suganuma
K Zeng
K-S Kim
K. Chattopadhyay
L Liu
L Zhang
LH Qi
M Abtew
P. Pandey
S Kashyap
S Kashyap
S Kashyap
S Kim
SB Xue
SB Xue
SC Cheng
X Ren
Y Gao
Y Li
YS Kim
Z Moser
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages
Author
AU Telang
AU Telang
+43Â more
AU Telang
B DĂĽzgĂĽn
B DĂĽzgĂĽn
B Zhou
B Zhou
B Zhou
Bite Zhou
DA Shnawah
H Chen
H Chen
H Chen
H Chen
J Hokka
J Hokka
J Obinata
J Weertman
JJ Sundelin
K Honda
K Ojima
L Yin
M Fujiwara
M Nagasaka
MA Matin
MA Matin
MA Matin
QK Zhang
Quan Zhou
R Fiedler
R Fiedler
RS Sidhu
S Park
S Terashima
S Terashima
S Terashima
S Terashima
SNG Chu
T-K Lee
T-K Lee
Tae-kyu Lee
Thomas R. Bieler
TR Bieler
TR Bieler
Y Kinoshita
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Diffusivities and Atomic Mobilities of Sn-Ag and Sn-In Melts
Author
A Borgenstam
A Bruson
+52Â more
A Lodding
A Meyer
A Paoletti
AK Roy
AL Zvyagintsev
Bai-Yun Huang
C Potard
CH Ma
D Agnoux
DA Shnawah
EI Khar’kov
F Onishi
G Careri
G Ghosh
G Kaptay
G Mathiak
G Mathiak
HX Xie
J Ă…gren
JC Wenger
JO Andersson
JP Foster
K Niwa
K Niwa
KG Davis
KO Lee
L Yang
Li-Jun Zhang
LJ Zhang
M-O Fou du
P Ascarelli
R RoĹźu-Pflumm
RA Khairulin
RVG Rao
S Suzuki
SW Chen
T Iida
T Iida
T Miyake
US Mohanty
V Botton
VG Leak
W Gierlotka
W Gierlotka
WC Roberts-Austen
Wei-Min Chen
WM Chen
X Su
Y Du
Y Liu
Y Tang
Yong Du
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref