Proximity Effect of Neighbour Victim Lossy Interconnects on a Single Attacker and Vice Versa

International audienceSignal integrity on a set from three to eight lossy copper interconnects of less than one square micron is determined from a transient simulation based on electrical circuit representation. This circuit is deduced from a full wave finite element method. Our signal integrity results on numerous possible excitations show that two neighbour interconnects on both sides of a reference aggressor or victim is sufficient to predict more complex situation on largest number of wires. This means that the five interconnects case is also well appropriate. We have verified that it is the best compromise whatever the permittivity of dielectric material which filled the spacing between interconnects, as well as the width of this spacing

Parasitic influence, on signal integrity, of several victim lines placed asymmetrically beside and symmetrically at both sides of an attacker interconnect and mutually

International audienceFar end crosstalk on victim lines located near an aggressor as well as rise time and propagation delay at the end of the attacker are evaluated. It is done thanks to a home made software based on full wave electromagnetic finite element and transient analysis simulation. These investigations are carried out when the aggressor lossy interconnect of less than one micron square area is symmetrically and asymmetrically placed in an arrangement of three, five and eight copper lossy lines, in case of low, medium and strong mutual effects. Our signal integrity points out that two neighbour lines on both sides of an active interconnect (i.e. the aggressor) are a good compromise to understand more complicated situation on greatest number of unintentionally coupled interconnects. We have verified this fact even in case of small spacing or high permittivity material which filled partially the spacing between interconnects (i.e. strong mutual effects)

Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation

International audienceSignal integrity analysis on eight unintentionally coupled copper interconnects is derived from an equivalent distributed electrical multi-conductor cell. Compatible with SPICE environment, this elementary cell is calculated with a full wave analysis such as tangential vector finite element method and the transmission line theory. After R, L, C, G and mutual extraction, two types of excitation are implemented based on one aggressor and seven victims and vice versa in order to weigh the influence of parasitic mutual via crosstalk evaluation

Comparison of the benefits, from S<inf>i</inf>O<inf>2</inf> to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic&#x2019;s in a multicoupled lines system

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Victim and aggressor line electrical modelisation in an multicoupled interconnect environment for transient simulation

International audienceAn electrical modelisation of eight lossy Cu interconnects is proposed thanks to the implementation of a vector finite element method. This full wave analysis gives frequency dependence of proper or mutual inductance, capacitance or resistance from resulting transmission line equations system. Spice results are then proposed for different set of spacing and low dielectric material in case of interconnects whose area is less than 1 m2 embedded in SiO2 interlevel or other low dielectric materia