Blood Parasites in Owls with Conservation Implications for the Spotted Owl (Strix occidentalis)

The three subspecies of Spotted Owl (Northern, Strix occidentalis caurina; California, S. o. occidentalis; and Mexican, S. o. lucida) are all threatened by habitat loss and range expansion of the Barred Owl (S. varia). An unaddressed threat is whether Barred Owls could be a source of novel strains of disease such as avian malaria (Plasmodium spp.) or other blood parasites potentially harmful for Spotted Owls. Although Barred Owls commonly harbor Plasmodium infections, these parasites have not been documented in the Spotted Owl. We screened 111 Spotted Owls, 44 Barred Owls, and 387 owls of nine other species for haemosporidian parasites (Leucocytozoon, Plasmodium, and Haemoproteus spp.). California Spotted Owls had the greatest number of simultaneous multi-species infections (44%). Additionally, sequencing results revealed that the Northern and California Spotted Owl subspecies together had the highest number of Leucocytozoon parasite lineages (n = 17) and unique lineages (n = 12). This high level of sequence diversity is significant because only one Leucocytozoon species (L. danilewskyi) has been accepted as valid among all owls, suggesting that L. danilewskyi is a cryptic species. Furthermore, a Plasmodium parasite was documented in a Northern Spotted Owl for the first time. West Coast Barred Owls had a lower prevalence of infection (15%) when compared to sympatric Spotted Owls (S. o. caurina 52%, S. o. occidentalis 79%) and Barred Owls from the historic range (61%). Consequently, Barred Owls on the West Coast may have a competitive advantage over the potentially immune compromised Spotted Owls

Simulation of Via Interconnects using Physics-Based Models and Microwave Network Parameters

In this paper, the simulation of via interconnects in multilayered printed circuit boards (PCBs) and packages combining physics-based via models and microwave network theory will be discussed. The description of the via in terms of network parameters, partitioning of the system, and combination of partial results will be addressed. Two alternatives to combine the results are compared, namely multiplication of ABCD matrices and the segmentation method based on S-parameters. The goal of this work is to develop a fast and accurate modeling strategy for via arrays in the multi-Gigabit range, extensible to an arbitrary number of elements, and suitable for automation and design optimization. The obtained results show good agreement with respect to 3D electromagnetic field simulations and measurements up to 20 GHz. Hence, this approach is a promising technique for efficient system-level simulation of interconnects