Beam Test Performance Studies of CMS Phase-2 Outer Tracker Module Prototypes

International audienceA new tracking detector will be installed as part of the Phase-2 upgrade of the CMS detector for the high-luminosity LHC era. This tracking detector includes the Inner Tracker, equipped with silicon pixel sensor modules, and the Outer Tracker, consisting of modules with two parallel stacked silicon sensors. The Outer Tracker front-end ASICs will be able to correlate hits from charged particles in these two sensors to perform on-module discrimination of transverse momenta $p_\mathrm{T}$. The $p_\mathrm{T}$ information is generated at a frequency of 40 MHz and will be used in the Level-1 trigger decision of CMS. Prototypes of the so-called 2S modules were tested at the Test Beam Facility at DESY Hamburg between 2019 and 2020. These modules use the final front-end ASIC, the CMS Binary Chip (CBC), and for the first time the Concentrator Integrated Circuit (CIC), optical readout and on-module power conversion. In total, seven modules were tested, one of which was assembled with sensors irradiated with protons. An important aspect was to show that it is possible to read out modules synchronously. A cluster hit efficiency of about 99.75% was achieved for all modules. The CBC $p_\mathrm{T}$ discrimination mechanism has been verified to work together with the CIC and optical readout. The measured module performance meets the requirements for operation in the upgraded CMS tracking detector

Measurement of the fractional radiation length of a pixel module for the CMS Phase-2 upgrade via the multiple scattering of positrons

International audienceHigh-luminosity particle collider experiments such as the ones planned at the High-Luminosity Large Hadron Collider require ever-greater vertexing precision of the tracking detectors, necessitating also reductions in the material budget of the detectors. Traditionally, the fractional radiation length ($x/X_0$) of detectors is either estimated using known properties of the constituent materials, or measured in dedicated runs of the final detector. In this paper, we present a method of direct measurement of the material budget of a CMS prototype module designed for the Phase-2 upgrade of the CMS detector using a 40-65 MeV positron beam. A total of 630 million events were collected at the Paul Scherrer Institut PiE1 experimental area using a three-plane telescope consisting of the prototype module as the central plane, surrounded by two MALTA monolithic pixel detectors. Fractional radiation lengths were extracted from scattering angle distributions using the Highland approximation for multiple scattering. A statistical technique recovered runs suffering from trigger desynchronisation, and several corrections were introduced to compensate for local inefficiencies related to geometric and beam shape constraints. An overall average $x/X_0$ of (0.84 $\pm$ 0.10)% across the surveyed regions was measured, which is compatible with an empirical estimate of 0.825% computed from known material properties. Higher-granularity maps of the fractional radiation length were produced for both rectangular regions and regions of uniform material composition. The results bode well for the CMS Phase-2 upgrade modules, which will play a key role in the minimisation of the material budget of the upgraded detector

Evaluation of HPK n+n^+-pp planar pixel sensors for the CMS Phase-2 upgrade

International audienceTo cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), sched-uled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determinedby the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034 cm−2 s−1 in the ultimate perfor-mance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluencecorresponding to a non-ionizing energy loss of up to Φeq = 3.5 × 1016 cm−2. This paper focuses on planar pixel sensor design andqualification up to a fluence of Φeq = 1.4 × 1016 cm−2.For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150 mm(6”) wafers with an active thickness of 150 μm with pixel sizes of 100 × 25 μm2 and 50 × 50 μm2 manufactured by Hamamatsu.Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was anextensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly withROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakagecurrent and efficiency. The single point resolution for 50 × 50 μm2 pixels is measured as 4.0 μm for non-irradiated samples, and6.3 μm after irradiation to Φeq = 7.2 × 1015 cm−2

Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade

International audienceThe Short Strip ASIC (SSA) is one of the four front-endchips designed for the upgrade of the CMS Outer Tracker for the HighLuminosity LHC. Together with the Macro-Pixel ASIC (MPA) it willinstrument modules containing a strip and a macro-pixel sensorstacked on top of each other. The SSA provides both full readout ofthe strip hit information when triggered, and, together with theMPA, correlated clusters called stubs from the two sensors for useby the CMS Level-1 (L1) trigger system. Results from the firstprototype module consisting of a sensor and two SSA chips arepresented. The prototype module has been characterized at theFermilab Test Beam Facility using a 120 GeV proton beam

Evaluation of HPK n+n^+-pp planar pixel sensors for the CMS Phase-2 upgrade

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10~years with an instantaneous peak luminosity of up to $7.5\times 10^{34}$~cm$^{-2}$s$^{-1}$ in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionizing energy loss of up to $\Phi_{\text{eq}} = 3.5\times 10^{16}$~cm$^{-2}$. This paper focuses on planar pixel sensor design and qualification up to a fluence of $\Phi_{\text{eq}} = 1.4\times 10^{16}$~cm$^{-2}$. For the development of appropriate planar pixel sensors an R\&D program was initiated, which includes $n^+$-$p$ sensors on 150 mm (6'') wafers with an active thickness of 150~$\mu$m with pixel sizes of $100\times 25$~$\mu$m$^2$ and $50\times 50$~$\mu$m$^2$ manufactured by Hamamatsu Photonics K.K.\ (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for $50\times 50$~$\mu$m$^2$ pixels is measured as 4.0~$\mu$m for non-irradiated samples, and 6.3~$\mu$m after irradiation to $\Phi_{\text{eq}} = 7.2\times 10^{15}$~cm$^{-2}$.To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), sched- uled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034 cm−2 s−1 in the ultimate perfor- mance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionizing energy loss of up to Φeq = 3.5 × 1016 cm−2. This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq = 1.4 × 1016 cm−2. For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150 mm (6”) wafers with an active thickness of 150 μm with pixel sizes of 100 × 25 μm2 and 50 × 50 μm2 manufactured by Hamamatsu. Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50 × 50 μm2 pixels is measured as 4.0 μm for non-irradiated samples, and 6.3 μm after irradiation to Φeq = 7.2 × 1015 cm−2.To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034cm−2s−1 in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionising energy loss of up to Φeq= 3.5 × 1016cm−2. This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq = 1.4 × 1016cm−2. For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150mm (6”) wafers with an active thickness of 150µm with pixel sizes of 100×25 µm2 and 50×50 µm2 manufactured by Hamamatsu Photonics K.K. (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfil the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×50 µm2 pixels is measured as 4.0µm for non-irradiated samples, and 6.3µm after irradiation to Φeq = 7.2 × 1015cm−2

Strategies and performance of the CMS silicon tracker alignment during LHC Run 2

The strategies for and the performance of the CMS silicon tracking system alignment during the 2015–2018 data-taking period of the LHC are described. The alignment procedures during and after data taking are explained. Alignment scenarios are also derived for use in the simulation of the detector response. Systematic effects, related to intrinsic symmetries of the alignment task or to external constraints, are discussed and illustrated for different scenarios

Measurement of the tt¯ charge asymmetry in events with highly Lorentz-boosted top quarks in pp collisions at s=13 TeV

The measurement of the charge asymmetry in top quark pair events with highly Lorentz-boosted top quarks decaying to a single lepton and jets is presented. The analysis is performed using proton-proton collisions at s=13TeV with the CMS detector at the LHC and corresponding to an integrated luminosity of 138 fb−1. The selection is optimized for top quarks produced with large Lorentz boosts, resulting in nonisolated leptons and overlapping jets. The top quark charge asymmetry is measured for events with a tt¯ invariant mass larger than 750 GeV and corrected for detector and acceptance effects using a binned maximum likelihood fit. The measured top quark charge asymmetry of (0.42−0.69+0.64)% is in good agreement with the standard model prediction at next-to-next-to-leading order in quantum chromodynamic perturbation theory with next-to-leading-order electroweak corrections. The result is also presented for two invariant mass ranges, 750–900 and >900GeV