Excited Heavy Baryon Masses from the 1/N_c Expansion of HQET

The mass spectra of the L=1 orbitally excited heavy baryons with light quarks in both the spin-flavor symmetric and the mixed representations are studied by the $1/N_c$ expansion method in the framework of the heavy quark effective theory. The mixing effect between the baryons in the two representations is also considered. The general pattern of the spectrum is predicted which will be verified by the experiments in the near future.Comment: 9 pages, latex, no figure, uses sprocl.sty (included). Talk by Chun Liu at the workshop on Non-Perturbative Methods and Lattice QCD (Guangzhou, May 15-21, 2000

Effects of motion on jet exhaust noise from aircraft

The various problems involved in the evaluation of the jet noise field prevailing between an observer on the ground and an aircraft in flight in a typical takeoff or landing approach pattern were studied. Areas examined include: (1) literature survey and preliminary investigation, (2) propagation effects, (3) source alteration effects, and (4) investigation of verification techniques. Sixteen problem areas were identified and studied. Six follow-up programs were recommended for further work. The results and the proposed follow-on programs provide a practical general technique for predicting flyover jet noise for conventional jet nozzles

Breakdown of the lattice polaron picture in La0.7Ca0.3MnO3 single crystals

When heated through the magnetic transition at Tc, La0.7Ca0.3MnO3 changes from a band metal to a polaronic insulator. The Hall constant R_H, through its activated behavior and sign anomaly, provides key evidence for polaronic behavior. We use R_H and the Hall mobility to demonstrate the breakdown of the polaron phase. Above 1.4Tc, the polaron picture holds in detail, while below, the activation energies of both R_H and the mobility deviate strongly from their polaronic values. These changes reflect the presence of metallic, ferromagnetic fluctuations, in the volume of which the Hall effect develops additional contributions tied to quantal phases.Comment: 11 pages, 3 figures, final version to appear in Phys. Rev. B Rapi

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn. The Au-Sn flip-chip joints were formed at 300 and 400 degrees without using any flux. In the case where the samples were reflowed at 300 degrees, only an (Au,Ni)3Sn2 IMC layer formed at the interface between the Au-Sn solder and Ni UBM. On the other hand, two IMC layers, (Au,Ni)3Sn2 and (Au,Ni)3Sn, were found at the interfaces of the samples reflowed at 400 degrees. As the reflow time increased, the thickness of the (Au,Ni)3Sn2 and (Au,Ni)3Sn IMC layers formed at the interface increased and the eutectic lamellae in the bulk solder coarsened.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions