Low loss high index contrast nanoimprinted polysiloxane waveguides

Nanoimprint lithography is gaining rapid acceptance in fields as diverse as microelectronics and microfluidics due to its simplicity high resolution and low cost. These properties are critically important for the fabrication of photonic devices, where cost is often the major inhibiting deployment factor for high volume applications. We report here on the use of nanoimprint technology to fabricate low loss broadband high index contrast waveguides in a Polysiloxane polymer system for the first time

Preacher\u27s Magazine Volume 47 Number 08

The Resource of the Retired, General Superintendent Stowe Does the Name Make a Difference? Editorial How to Stay in the Pastorate and Like It, Milton Harrington Some Thoughts on Pastoral Priorities, G. Lewis Van Dyne A Renewed Emphasis on the Preaching of Holiness, Otho Jennings Too Busy to Be Courteous? An evangelist It Takes More than Tools, Milo L. Arnold Twenty Years of Concern Paid Off! Practical Points Classics of Devotion (II. Imitation of Christ), Ross W. Hayslip What Are We Serving? R. E. Maner A Speaking Relationship, Mrs. R. Edgar Johnson A Letter to the Bereaved, Jesse Turner A Shock That Changed My Ministry, Robert G. Green Memo to Myself, Rene Colaw The Serpent and the Sword, W. E. McCumber DEPARTMENTS Evangelistically Speaking Pastor’s Supplement The Preacher’s Wife Faith in Action Gleanings from the Greek Timely Outlines Idea Sparks Bulletin Barrel Here and There Among Books Calendar Digest Coming Next Month Among Ourselveshttps://digitalcommons.olivet.edu/cotn_pm/1541/thumbnail.jp

Cut-off Wavelength and Transient Effects in Asymmetrically Clad Single-mode Buried-channel Waveguides

The characteristics of single-mode propagation and transient effects in practical square- and rectangular-core buried-channel planar waveguides are quantified, assuming a cladding that is unbounded in one transverse dimension and bounded in the other. The wavelength cutoff condition for the fundamental mode is determined when the cladding index is asymmetric and composed of stepwise, uniform-index regions

Photosentive ormosil system for integrated optics

A photosensitive organically modified silica (ormosil) material has been developed for integrated optics applications. In this material, prepared via a simple one-step sol-gel process, the silica backbone is substituted with methacrylate groups to confe

High-quality polarization-insensitive polysiloxane waveguide gratings produced by UV nanoimprint lithography

We describe the fabrication of single-mode polarization-insensitive polysiloxane channel waveguide gratings by a single-step ultraviolet nanoimprint lithography process with a polydimethylsiloxane stamp. A 10-dB deep grating response that matches the theoretically expected response at the first-order resonant wavelength was achieved in a 2-mm-long grating with no excess loss over the intrinsic material absorption. Features down to ∼100 nm could be replicated using the soft stamp

Significant improvement of adhesion between gold thin films and a polymer

A novel technique was demonstrated for realizing extremely strong adhesion between gold thin films and a polysiloxane based polymer. The surface of the polymer was modified by using a plasma treatment. The variation of the wettability and topography of the polymer surface with the plasma conditions were investigated through water contact angle measurement and scanning electron microscope observation, respectively. It was found that the polymer surface was roughened greatly, and its water contact angle was reduced from 81 to 0° by using 1min of O2/CF4 plasma treatment. The pull-off strength of the Au film from the polymer was enhanced from 1.2 to 8.5N/mm 2 after the plasma treatment. Further improvement of the adhesion was achieved by sputter-coating two adhesion layers, Al2O 3/Al, on the polymer before coating the Au film and annealing the films at 150°C for 2h. The pull-off strength of the Au film from such a polymer/Al2O3/Al/Au system was over 35N/mm2. The extremely strong bonding between the Au and the rest layers of the system was explained mainly by the formation of Au-Al alloys at the interface between the Al and Au layers based on an analysis using chemical etch and energy dispersive X-ray spectroscopy