Reconstruction of Cosmic and Beam-Halo Muons with the CMS Detector

The powerful muon and tracker systems of the CMS detector together with dedicated reconstruction software allow precise and efficient measurement of muon tracks originating from proton-proton collisions. The standard muon reconstruction algorithms, however, are inadequate to deal with muons that do not originate from collisions. We present the design, implementation, and performance of a dedicated cosmic muon track reconstruction algorithm, which features pattern recognition optimized for muons that are not coming from the interaction point, i.e. cosmic muons and beam-halo muons. To evaluate the performance of the new algorithm, data taken during Cosmic Challenge phases I and II as well as beam-halo muons recorded during the first LHC beam operation were studied. In addition, a variety of more general topologies of cosmic muons and beam-halo muons were studied using simulated data to demonstrate some key features of the new algorithm.Comment: Poster at ICHEP08, Philadelphia, USA, July 2008. 5 pages, 3 figure

Sealing of micromachined cavities using chemical vapor deposition methods: characterization and optimization

This paper presents results of a systematic investigation to characterize the sealing of micromachined cavities using chemical vapor deposition (CVD) methods. We have designed and fabricated a large number and variety of surface-micromachined test structures with different etch-channel dimensions. Each cavity is then subjected to a number of sequential CVD deposition steps with incremental thickness until the cavity is successfully sealed. At etch deposition interval, the sealing status of every test structure is experimentally obtained and the percentage of structures that are sealed is recorded. Four CVD sealing materials have been incorporated in our studies: LPCVD silicon nitride, LPCVD polycrystalline silicon (polysilicon), LPCVD phosphosilicate glass (PSG), and PECVD silicon nitride. The minimum CVD deposition thickness that is required to successfully seal a microstructure is obtained for the first time. For a typical Type-1 test structure that has eight etch channels-each 10 μm long, 4 μm wide, and 0.42 μm tall-the minimum required thickness (normalized with respect to the height of etch channels) is 0.67 for LPCVD silicon nitride, 0.62 for LPCVD polysilicon, 4.5 for LPCVD PSG, and 5.2 for PECVD nitride. LPCVD silicon nitride and polysilicon are the most efficient sealing materials. Sealing results with respect to etch-channel dimensions (length and width) are evaluated (within the range of current design). When LPCVD silicon nitride is used as the sealing material, test structures with the longest (38 μm) and widest (16 μm) etch channels exhibit the highest probability of sealing. Cavities with a reduced number of etch channels seal more easily. For LPCVD PSG sealing, on the other hand, the sealing performance improves with decreasing width but is not affected by length of etch channels