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1 research outputs found
Interfacial Strength Between Single Wall Carbon Nanotubes and Copper Material: Molecular Dynamics Simulation
Author
Center for Atomic-Scale Materials Design (CAMd) 2012, ATOMIC SIMULATION ENVIRONMENT, DTU Physics, Technical University of Denmark, Lyngby, Denmark.
Ibrahim Awad
+3Â more
Leila Ladani
Yhteenveto suomeksi
“Temp/Berendsen—LAMMPS Documentation
Publication venue
'ASME International'
Publication date
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