16 research outputs found

    Plastic Deformation, Residual Stress, and Crystalline Texture Measurements for In-Process Characterization of FCC Metal Alloys

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    The need for in-process characterization of metallic components is being recognized increasingly. In the field of x-ray analysis the x-ray fluorescent (spectroscopy) techniques have been successfully applied to in-process inspection, while successes in x-ray diffraction have been sparse. X-ray diffraction characterization techniques should be fast, non-contacting, and tolerant of detector to component distance variation. The Ruud-Barrett position-sensitive scintillation detector (R-B PSSD) is unique in its ability to satisfy these requirements, and has been successful in measuring plastic deformation, residual stress and crystalline texture in FCC metal alloys

    Determination of Residual Stress from Two-Dimensional Diffraction Patterns

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    Microtensile bond strengths of seven dentin adhesive systems

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    Objectives. The purpose of this study was to evaluate the microtensile bond strengths of seven dentin adhesive systems (Solid Bond, EBS-Multi, PermaQuik, One Coat Bond, Gluma One Bond, Prime & Bond NT/NRC and Clearfil Liner Bond 2V) and their respective fracture modes. Methods. Superficial occlusal dentin of extracted human molars was exposed, finished with wet 600-grit silicon carbide paper, and a block of resin composite bonded with the above adhesives according to the manufacturers' instructions. The teeth were kept in tap water for 24 h at 37°C, sectioned to obtain three or four bar-shaped specimens, which were then shaped to an hour-glass form of 1.2 ± 0.02 mm diameter. The specimens were stressed at a crosshead speed of 1 mm/min until rupture of the bond. The mean bond strengths were compared using one-way ANOVA and LSD tests. The frequency of fracture modes was compared using Kruskal-Wallis and Mann-Whitney U-tests. Results. Mean microtensile bond strengths ranged from (17.8 ± 7.0) MPa for Solid Bond to (36.0 ± 8.1) MPa for Clearfil Liner Bond 2V. The bond strength of Clearfil Liner Bond 2V and PermaQuik (30.8 ± 8.5 MPa) were not significantly different, and were higher than all other materials. Bond strengths of Solid Bond (17.8 ± 7.0) MPa, EBS-Multi (18.7 ± 5.0) MPa, One Coat Bond (21.9 ± 5.6) MPa, and Gluma One Bond (23.4 ± 5.2) MPa were not significantly different. SEM examination indicated that Solid Bond, EBS-Multi and One Coat Bond showed no significant difference in failure modes but were significantly different from PermaQuik, Prime & Bond NT/NRC and Clearfil Liner Bond 2V. Significance. The self-etching primer system, Clearfil Liner Bond 2V, provided the simplest bonding technique, and together with PermaQuik exhibited greatest bond strength to dentin. © 2000 Academy of Dental Materials. Published by Elsevier Science Ltd. All rights reserved.link_to_subscribed_fulltex

    Chinese Merchants in the Hong Kong Colonial Context, 1840s-1900s

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    The texture (preferred grain orientation) of rolled metal plates influences a number of important properties. Included are their form-ability into complex shapes such as beverage cans, vehicle bodies, or airframe skins, and their response to static or dynamic loading when the resulting components are placed into service [1–3]. Considerable benefit would be gained from the development of instrumentation which could measure texture in real time for process control applications or which could easily establish the texture of incoming materials or finished components so that their elastic or plastic mechanical properties could be estimated. As an example of the economic benefits of such a device, it has been estimated that $40 million could be saved by the aluminum can industry through adequate texture monitoring [4]

    Cooperative business-NGO partnerships in Hong Kong: NGO perspective

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    Because of their high temperature capability, strength and erosion resistance, chemical vapor deposited (CVD) beta silicon carbide coatings are of interest in tribological and protective applications. The silicon carbide is formed by a reaction between a silicon halide, such as SiCl4 and a carbon source, such as CH4
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