Doping and isolation of GaN, InGaN and InAlN using ion implantation

Both n- and p-type doping have been achieved in GaN using Si{sup +} or Mg{sup +}/P{sup +} implantation, respectively, followed annealing at {ge} 1050{degrees}C. Using proximity rapid thermal annealing (10sec) the GaN surface retains both smooth morphology and its original stoichiometry. Variable temperature Hall measurements reveal approximate energy levels of 62meV for the implanted Si and 171meV for the Mg, which are similar to their values in epitaxially grown GaN. Implant isolation of both n- and p-type GaN, and n-type In{sub 0.75}Al{sub 0.25}N with multiple energy inert species (e.g. N{sup +} or F{sup +}) produces high resistivity ({ge}10{sup 8}{omega}/{open_square}) after subsequent annealing in the range 600-700{degrees}C. Smaller increases in sheet resistance are observed for In{sub x}Ga{sup 1-x}N (x=0.33-0.75) under the same conditions due to the smaller energy bandgaps and the shallower energy levels of the damage-related states controlling the resistivity

High temperature surface degradation of III-V nitrides

The surface stoichiometry, surface morphology and electrical conductivity of AlN, GaN, InN, InGaN and InAlN was examined at rapid thermal annealing temperatures up to 1,150 C. The sheet resistance of the AlN dropped steadily with annealing, but the surface showed signs of roughening only above 1,000 C. Auger Electronic Spectroscopy (AES) analysis showed little change in the surface stoichiometry even at 1,150 C. GaN root mean square (RMS) surface roughness showed an overall improvement with annealing, but the surface became pitted at 1,000 C, at which point the sheet resistance also dropped by several orders of magnitude, and AES confirmed a loss of N from the surface. The InN surface had roughened considerably even at 650 C, and scanning electron microscopy (SEM) showed significant degradation. In contrast to the binary nitrides the sheet resistance of InAlN was found to increase by {approximately} 10{sup 2} from the as grown value after annealing at 800 C and then remain constant up to 1,000 C, while that of InGaN increased rapidly above 700 C. The RMS roughness increased above 800 C and 700 C respectively for InAlN and InGaN samples. In droplets began to form on the surface at 900 C for InAlN and at 800 C for InGaN, and then evaporate at 1,000 C leaving pits. AES analysis showed a decrease in the N concentration in the top 500 {angstrom} of the sample for annealing {ge} 800 C in both materials

High Temperature Surface Degradation of III-V Nitrides

The surface stoichiometry, surface morphology and electrical conductivity of AlN, GaN, InN, InGaN and InAlN was examined at rapid thermal annealing temperatures up to 1,150 C. The sheet resistance of the AlN dropped steadily with annealing, but the surface showed signs of roughening only above 1,000 C. Auger Electronic Spectroscopy (AES) analysis showed little change in the surface stoichiometry even at 1,150 C. GaN root mean square (RMS) surface roughness showed an overall improvement with annealing, but the surface became pitted at 1,000 C, at which point the sheet resistance also dropped by several orders of magnitude, and AES confirmed a loss of N from the surface. The InN surface had roughened considerably even at 650 C, and scanning electron microscopy (SEM) showed significant degradation. In contrast to the binary nitrides the sheet resistance of InAlN was found to increase by {approximately} 10{sup 2} from the as grown value after annealing at 800 C and then remain constant up to 1,000 C, while that of InGaN increased rapidly above 700 C. The RMS roughness increased above 800 C and 700 C respectively for InAlN and InGaN samples. In droplets began to form on the surface at 900 C for InAlN and at 800 C for InGaN, and then evaporate at 1,000 C leaving pits. AES analysis showed a decrease in the N concentration in the top 500 {angstrom} of the sample for annealing {ge} 800 C in both materials

Chlorine-based plasma etching of GaN

The wide band gap group-III nitride materials continue to generate interest in the semiconductor community with the fabrication of green, blue, and ultraviolet light emitting diodes (LEDs), blue lasers, and high temperature transistors. Realization of more advanced devices requires pattern transfer processes which are well controlled, smooth, highly anisotropic and have etch rates exceeding 0.5 {micro}m/min. The utilization of high-density chlorine-based plasmas including electron cyclotron resonance (ECR) and inductively coupled plasma (ICP) systems has resulted in improved GaN etch quality over more conventional reactive ion etch (RIE) systems

Molecular dynamics simulation of the early stages of the synthesis of periodic mesoporous silica

We present results of detailed atomistic modeling of the early stages of the synthesis of periodic mesoporous silica using molecular dynamics. Our simulations lead to the proposal of a mechanism that validates several previous experimental and modeling studies and answers many controversial issues regarding the synthesis of mesoporous silicas. In particular, we show that anionic silicates interact very strongly with cationic surfactants and, significantly adsorb on the surface of micelles, displacing a fraction of previously bound bromide counterions. This induces an increase in micelle size and also enhances silica condensation at the micelle surface. The presence of larger silica aggregates in solution further promotes the growth of micelles and, by binding to surfactant molecules in different micelles, their aggregation. This work demonstrates the crucial role played by silica in influencing, by way of a cooperative templating mechanism, the structure of the eventual liquid-crystal phase, which in turn determines the structure of the porous material

Hydrogen incorporation into III-V nitrides during processing

Hydrogen is readily incorporated into GaN and related alloys during wet and dry etching, chemical vapor deposition of dielectric overlayers, boiling in water and other process steps, in addition to its effects during MOCVD or MOMBE growth. The hydrogen is bound at defects or impurities and passivates their electrical activity. Reactivation occurs at 450-550{degrees}C, but evolution from the crystal requires much higher temperatures ({ge} 800{degrees}C)

Current transport in W and WSI{sub x} ohmic contacts to InGaN and InN

The temperature dependence of the specific contact resistance of W and WSi{sub 0.44} contacts on n{sup +} In{sub 0.65}Ga{sub 0.35}N and InN was measured in the range -50 {degrees}C to 125 {degrees}C. The results were compared to theoretical values for different conduction mechanisms, to further elucidate the conduction mechanism in these contact schemes for all but as-deposited metal to InN where thermionic emission appears to be the dominant mechanism. The contacts were found to produce low specific resistance ohmic contacts to InGaN at room temperature, e{sup c} {approximately} 10{sup -7} {Omega} {center_dot} cm{sup 2} for W and e{sub c} of 4x 10{sup -7} {Omega} {center_dot} cm{sup 2} for WSi{sub x}. InN metallized with W produced ohmic contacts with e{sub c} {approximately} 10{sup -7} {Omega} {center_dot} cm{sup 2} and e{sub c} {approximately} 10{sup -6} {Omega} {center_dot} cm{sup 2} for WSi{sub x} at room temperature

ICP dry etching of III-V nitrides

Inductively coupled plasma etching of GaN, AlN, InN, InGaN and InAlN was investigated in CH{sub 4}/H{sub 2}/Ar plasmas as a function of dc bias, and ICP power. The etch rates were generally quite low, as is common for III-nitrides in CH{sub 4} based chemistries. The etch rates increased with increasing dc bias. At low rf power (150 W), the etch rates increased with increasing ICP power, while at 350 W rf power, a peak was found between 500 and 750 W ICP power. The etched surfaces were found to be smooth, while selectivities of etch were {le} 6 for InN over GaN, AlN, InGaN and InAlN under all conditions