Non-isothermal phase-field simulations of laser-written in-plane SiGe heterostructures for photonic applications

Advanced solid-state devices, including lasers and modulators, require semiconductor heterostructures for nanoscale engineering of the electronic bandgap and refractive index. However, existing epitaxial growth methods are limited to fabrication of vertical heterostructures grown layer by layer. Here, we report the use of finite-element-method-based phase-field modelling with thermocapillary convection to investigate laser inscription of in-plane heterostructures within silicon-germanium films. The modelling is supported by experimental work using epitaxially-grown Si0.5Ge0.5 layers. The phase-field simulations reveal that various in-plane heterostructures with single or periodic interfaces can be fabricated by controlling phase segregation through modulation of the scan speed, power, and beam position. Optical simulations are used to demonstrate the potential for two devices: graded-index waveguides with Ge-rich (>70%) cores, and waveguide Bragg gratings with nanoscale periods (100–500 nm). Periodic heterostructure formation via sub-millisecond modulation of the laser parameters opens a route for post-growth fabrication of in-plane quantum wells and superlattices in semiconductor alloy films

Characterization of an embedded RF-MEMS switch

An RF-MEMS capacitive switch for mm-wave integrated circuits, embedded in the BEOL of 0.25μm BiCMOS process, has been characterized. First, a mechanical model based on Finite-Element-Method (FEM) was developed by taking the residual stress of the thin film membrane into account. The pull-in voltage and the capacitance values obtained with the mechanical model agree very well with the measured values. Moreover, S-parameters were extracted using Electromagnetic (EM) solver. The data observed in this way also agree well with the experimental ones measured up to 110GHz. The developed RF model was applied to a transmit/receive (T/R) antenna switch design. The results proved the feasibility of using the FEM model in circuit simulations for the development of RF-MEMS switch embedded, single-chip multi-band RF ICs

Biological Cell Discrimination Based on Their High Frequency Dielectropheretic Signatures at UHF Frequencies

2017 International Microwave Symposium paper entitled "Biological Cell Discrimination Based on Their High Frequency Dielectropheretic Signatures at UHF Frequencies". Honolulu June 4-9th 2017. Amended version: see additional notes.This version amends the wrong naming in the previous record: the conference is the IEEE IMS 2017, not 2018

Relativistic Lee Model on Riemannian Manifolds

We study the relativistic Lee model on static Riemannian manifolds. The model is constructed nonperturbatively through its resolvent, which is based on the so-called principal operator and the heat kernel techniques. It is shown that making the principal operator well-defined dictates how to renormalize the parameters of the model. The renormalization of the parameters are the same in the light front coordinates as in the instant form. Moreover, the renormalization of the model on Riemannian manifolds agrees with the flat case. The asymptotic behavior of the renormalized principal operator in the large number of bosons limit implies that the ground state energy is positive. In 2+1 dimensions, the model requires only a mass renormalization. We obtain rigorous bounds on the ground state energy for the n-particle sector of 2+1 dimensional model.Comment: 23 pages, added a new section, corrected typos and slightly different titl

Characterization of conductive polyprrole coated wool yarns

Wool yarns were coated with conducting polypyrrole by chemical synthesis methods. Polymerization of pyrrole was carried out in the presence of wool yarn at various concentrations of the monomer and dopant anion. The changes in tensile, moisture absorption, and electrical properties of the yarn upon coating with conductive polypyrrole are presented. Coating the wool yarns with conductive polypyrrole resulted in higher tenacity, higher breaking strain, and lower initial modulus. The changes in tensile properties are attributed to the changes in surface morphology due to the coating and reinforcing effect of conductive polypyrrole. The thickness of the coating increased with the concentration of p-toluene sulfonic acid, which in turn caused a reduction in the moisture regain of the wool yarn. Reducing the synthesis temperature and replacing p-toluenesulfonic acid by anthraquinone sulfonic acid resulted in a large reduction in the resistance of the yarn. <br /

Scanning Microwave Microscopy of Aluminum CMOS Interconnect Lines Buried in Oxide and Water

Using a scanning microwave microscope, we imaged in water aluminum interconnect lines buried in aluminum and silicon oxides fabricated through a state-of-the-art 0.13 um SiGe BiCMOS process. The results were compared with that obtained by using atomic force microscopy both in air and water. It was found the images in water was degraded by only approximately 60% from that in air.Comment: 3 pages, 5 figures, conferenc

Review of current best-practices in machinability evaluation and understanding for improving machining performance

Machinability is a generalized framework that attempts to quantify the response of a workpiece material to mechanical cutting, which has been developed as one of the key factors that drive the final selection of cutting parameters, tools, and coolant applications. Over the years, there are many attempts have been made to develop a standard evaluation method of machinability. However, due to the complexity of the influence factors, i.e., from work material and cutting tool to machine tool, that can affect the materials machinability, currently there is no uniquely defined quantification of machinability. As one of the outcomes from the CIRP's Collaborative Working Group on “Integrated Machining Performance for Assessment of Cutting Tools (IMPACT)”, this paper conducts an extensive study to learn interacting machinability parameters to evaluate the overall machining performance. Specifically, attention is focused on recent advances made towards the determination of the machinability through tool wear, cutting force and temperature, chip form and breakability, as well as the surface integrity. Furthermore, the advanced methods that have been developed over the years to enable the improvement of machinability have been reviewed