7 research outputs found

    Microsysteemtechnologie: kleine zaken, grote gevolgen

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    Afsluiting Tot slot geef ik u een korte samenvatting van mijn openbare les. Ik ben de les begonnen met een verwijzing naar het rapport Micro Systems Technlogy, exploring opportunities van de Stichting Toekomstbeeld der Techniek. Ik heb laten zien dat er inmiddels grote markten zijn ontstaan waarin microsysteemtechnologie een essentiële rol speelt. Ik heb verteld over de wereld van de microsystemen en hoe die in onze dagelijkse omgeving een steeds belangrijker rol gaan spelen. Over microsystemen die steeds kleiner worden, zelfs de grootte van zandkorrels zullen hebben. Ik heb geprobeerd aan te geven dat er mogelijk dramatische veranderingen in onze leefomgeving en in onze levensstijl kunnen gaan optreden. Kleine zaken, grote gevolgen. Tot slot heb ik u mijn plannen ontvouwd voor een tweetal concrete projecten. Hiermee wil ik proberen te helpen met het toepassen van MST-technologie bij bedrijven en in de medische wereld. Door het onderwijs aan concrete projecten te koppelen, wil ik het onderwerp MST aantrekkelijk maken voor de studenten. Studenten die kiezen voor een vak met toekomst. Die toekomst begint nu

    Active microvalves for micro-fluidic networks in plastics - selecting suitable actuation schemes

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    Using active microvalves liquid flow in microsystems can be precisely controlled and timed. Plastic microfluidic networks offer high flexibility in the material selection and potentially also allow for low cost mass fabrication. For selecting a suitable micro-actuation scheme, the different options are compared on the basis of actuation performance parameters. For thermal-expansion, electrostatic, electroactive, piezoelectric and shape memory actuation principles the work density is derived from basic actuator physics and literature material parameters. For the targeted actuator dimensions also frequency, stroke and force characteristics are calculated. These are compared with actuator performance targets typical for micro-fluidic networks: forces between 160µN and 16mN, stroke of 50µm, repetition frequencies ranging from 100Hz to few mHz. As a result, only electroactive polymer and thermal actuation principles remain as viable options and shall in further work be experimentally evaluated using a modular design with interchangeable actuators

    A lightweight suction gripper for micro assembly

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    Assembly is a crucial part in the realization of a product. Compared to assembly in the macro world, assembly in the micro world is influenced by scaling effects. These include surface forces, high requirements on placement uncertainty and small product dimensions. Conventional high-speed assembly in many cases utilizes suction grippers. However, their large moving mass results in high collision forces during product placement. Therefore, they are unsuitable for assembling micro products. This paper will discuss problems during assembly in the micro world with an emphasis on forces during the assembly process. A new design is proposed for a gripper with a moving mass less than 1 g for a pick up needle with a 6 mm diameter. In the design friction and hysteresis are neglectable. The paper focus is on gripper design, realization and experimental results

    Combination of Bayesian networks and FEM models to predict reliability of LED systems

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    Intelligent LED lighting systems can save up to 80% of energy compared to incandescent lighting systems. In order to provide these products at reasonable costs, integration and miniaturization are important steps [1]. Another attractive feature of LED systems is the claimed long life expectancy. The design lifetime of LED luminaries is typically 25 to 50 thousand hours [2, 3]. The long design lifetime, in combination with short-cycled technological innovations in LED packaging, pose challenges to traditional test-in reliability engineering approaches. Innovations in LED packaging are required to meet future cost target requirements at proven and designed-in lifetimes. Integral design of complex systems - such as LED systems merging optical, thermal, electrical, and mechanical disciplines - becomes more difficult [4, 9] as reliability engineering builds on the higher specialization per discipline. In this work we explore novel approaches for reliability engineering

    Active microvalves for micro-fluidic networks in plastics - selecting suitable actuation schemes

    No full text
    Using active microvalves liquid flow in microsystems can be precisely controlled and timed. Plastic microfluidic networks offer high flexibility in the material selection and potentially also allow for low cost mass fabrication. For selecting a suitable micro-actuation scheme, the different options are compared on the basis of actuation performance parameters. For thermal-expansion, electrostatic, electroactive, piezoelectric and shape memory actuation principles the work density is derived from basic actuator physics and literature material parameters. For the targeted actuator dimensions also frequency, stroke and force characteristics are calculated. These are compared with actuator performance targets typical for micro-fluidic networks: forces between 160µN and 16mN, stroke of 50µm, repetition frequencies ranging from 100Hz to few mHz. As a result, only electroactive polymer and thermal actuation principles remain as viable options and shall in further work be experimentally evaluated using a modular design with interchangeable actuators

    Microfluidic standardization: Past, present and future

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    This paper addresses the issue of standardization in microfluidics. It contains the main points of an industry wide agreement about microfluidic port pitches and port nomenclature. It also addresses device classification and future steps

    Technology alternatives towards low-cost and high-speed interconnect manufacturing

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    In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described
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