Creep behavior of copper-chromium in-situ composite

Creep deformation and fracture behaviors were investigated on a deformation-processed Cu-Cr in-situ composite over a temperature range of 200 °C to 650 °C. It was found that the creep resistance increases significantly with the introduction of Cr fibers into Cu. The stress exponent and the activation energy for creep of the composite at high temperatures (≥400 °C) were observed to be 5.5 and 180 to 216 kJ/mol, respectively. The observation that the stress exponent and the activation energy for creep of the composite at high temperatures (≥400 °C) are close to those of pure Cu suggests that the creep deformation of the composite is dominated by the deformation of the Cu matrix. The high stress exponent at low temperatures (200 °C and 300 °C) is thought be associated with the as-swaged microstructure, which contains elongated dislocation cells and subgrains that are stable and act as strong athermal obstacles at low temperatures. The mechanism of damage was found to be similar for all the creep tests performed, but the distribution and extent of damage were found to be very sensitive to the test temperature

Relativistic K shell decay rates and fluorescence yields for Zn, Cd and Hg

In this work we use the multiconfiguration Dirac-Fock method to calculate the transition probabilities for all possible decay channels, radiative and radiationless, of a K shell vacancy in Zn, Cd and Hg atoms. The obtained transition probabilities are then used to calculate the corresponding fluorescence yields which are compared to existing theoretical, semi-empirical and experimental results