Study of loss in superconducting coplanar waveguide resonators

Superconducting coplanar waveguide (SCPW) resonators have a wide range of applications due to the combination of their planar geometry and high quality factors relative to normal metals. However, their performance is sensitive to both the details of their geometry and the materials and processes that are used in their fabrication. In this paper, we study the dependence of SCPW resonator performance on materials and geometry as a function of temperature and excitation power. We measure quality factors greater than $2\times10^6$ at high excitation power and $6\times10^5$ at a power comparable to that generated by a single microwave photon circulating in the resonator. We examine the limits to the high excitation power performance of the resonators and find it to be consistent with a model of radiation loss. We further observe that while in all cases the quality factors are degraded as the temperature and power are reduced due to dielectric loss, the size of this effect is dependent on resonator materials and geometry. Finally, we demonstrate that the dielectric loss can be controlled in principle using a separate excitation near the resonance frequencies of the resonator.Comment: Replacing original version. Changes made based on referee comments. Fixed typo in equation (3) and added appendi

Advanced Fabrication Processes for Superconducting Very Large Scale Integrated Circuits

We review the salient features of two advanced nodes of an 8-Nb-layer fully planarized process developed recently at MIT Lincoln Laboratory for fabricating Single Flux Quantum(SFQ) digital circuits with very large scale integration on 200-mm wafers: the SFQ4ee and SFQ5ee nodes, where 'ee' denotes the process is tuned for energy efficient SFQ circuits. The former has eight superconducting layers with 0.5 {\mu}m minimum feature size and a 2 {\Omega}/sq Mo layer for circuit resistors. The latter has nine superconducting layers: eight Nb wiring layers with the minimum feature size of 350 nm and a thin superconducting MoNx layer (Tc ~ 7.5 K) with high kinetic inductance (about 8 pH/sq) for forming compact inductors. A nonsuperconducting (Tc < 2 K) MoNx layer with lower nitrogen content is used for 6 {\Omega}/sq planar resistors for shunting and biasing of Josephson junctions. Another resistive layer is added to form interlayer, sandwich-type resistors of m{\Omega} range for releasing unwanted flux quanta from superconducting loops of logic cells. Both process nodes use Au/Pt/Ti contact metallization for chip packaging. The technology utilizes one layer of Nb/AlOx-Al/Nb JJs with critical current density, Jc of 100 {\mu}A/{\mu}m^2 and minimum diameter of 700 nm. Circuit patterns are defined by 248-nm photolithography and high density plasma etching. All circuit layers are fully planarized using chemical mechanical planarization (CMP) of SiO2 interlayer dielectric. The following results and topics are presented and discussed: the effect of surface topography under the JJs on the their properties and repeatability, critical current and Jc targeting, effect of hydrogen dissolved in Nb, MoNx properties for the resistor layer and for high kinetic inductance layer, technology of m{\Omega}-range resistors.Comment: 10 pages, 12 figures, 1 table, 27 references. The paper was presented on September 8, 2015 at the 12th European Conference on Applied Superconductivity, EUCAS 2015, 6-10 September 2015, Lyon, France, IEEE Transaction on Applied Superconductivity, 201

Progress toward superconductor electronics fabrication process with planarized NbN and NbN/Nb layers

To increase density of superconductor digital and neuromorphic circuits by 10x and reach integration scale of $10^8$ Josephson junctions (JJs) per chip, we developed a new fabrication process on 200-mm wafers, using self-shunted Nb/Al-AlOx/Nb JJs and kinetic inductors. The process has a layer of JJs, a layer of resistors, and 10 fully planarized superconducting layers: 8 Nb layers and 2 layers of high kinetic inductance materials, Mo$_2$N and NbN, with sheet inductance of 8 pH/sq and 3 pH/sq, respectively. NbN films were deposited by two methods: with $T_c$=15.5 K by reactive sputtering of a Nb target in Ar+N$_2$ mixture; with $T_c$ in the range from 9 K to 13 K by plasma-enhanced chemical vapor deposition (PECVD) using Tris(diethylamido)(tert-butylimido)niobium(V) metalorganic precursor. PECVD of NbN was investigated to obtain conformal deposition and filling narrow trenches and vias with high depth-to-width ratios, which was not possible to achieve using sputtering and other physical vapor deposition (PVD) methods at temperatures below $200 ^oC$ required to prevent degradation of Nb/Al-AlOx/Nb junctions. Nb layers with 200 nm thickness are used in the process layer stack as ground planes to maintain a high level of interlayer shielding and low intralayer mutual coupling, for passive transmission lines with wave impedances matching impedances of JJs, typically <=50 $\Omega$, and for low-value inductors. NbN and NbN/Nb bilayer are used for cell inductors. Using NbN/Nb bilayers and individual pattering of both layers to form inductors allowed us to minimize parasitic kinetic inductance associated with interlayer vias and connections to JJs as well as to increase critical currents of the vias. Fabrication details and results of electrical characterization of NbN films, wires, and vias, and comparison with Nb properties are given.Comment: 12 pages, 16 figures, 4 tables, 49 references. Submitted to IEEE TAS on Nov. 10, 202

Extremely Large Area (88 mm X 88 mm) Superconducting Integrated Circuit (ELASIC)

Superconducting integrated circuit (SIC) is a promising "beyond-CMOS" device technology enables speed-of-light, nearly lossless communications to advance cryogenic (4 K or lower) computing. However, the lack of large-area superconducting IC has hindered the development of scalable practical systems. Herein, we describe a novel approach to interconnect 16 high-resolution deep UV (DUV EX4, 248 nm lithography) full reticle circuits to fabricate an extremely large (88mm X 88 mm) area superconducting integrated circuit (ELASIC). The fabrication process starts by interconnecting four high-resolution DUV EX4 (22 mm X 22 mm) full reticles using a single large-field (44 mm X 44 mm) I-line (365 nm lithography) reticle, followed by I-line reticle stitching at the boundaries of 44 mm X 44 mm fields to fabricate the complete ELASIC field (88 mm X 88 mm). The ELASIC demonstrated a 2X-12X reduction in circuit features and maintained high-stitched line superconducting critical currents. We examined quantum flux parametron (QFP) circuits to demonstrate the viability of common active components used for data buffering and transmission. Considering that no stitching requirement for high-resolution EX4 DUV reticles is employed, the present fabrication process has the potential to advance the scaling of superconducting quantum devices

Broadband Squeezed Microwaves and Amplification with a Josephson Traveling-Wave Parametric Amplifier

Squeezing of the electromagnetic vacuum is an essential metrological technique used to reduce quantum noise in applications spanning gravitational wave detection, biological microscopy, and quantum information science. In superconducting circuits, the resonator-based Josephson-junction parametric amplifiers conventionally used to generate squeezed microwaves are constrained by a narrow bandwidth and low dynamic range. In this work, we develop a dual-pump, broadband Josephson traveling-wave parametric amplifier that combines a phase-sensitive extinction ratio of 56 dB with single-mode squeezing on par with the best resonator-based squeezers. We also demonstrate two-mode squeezing at microwave frequencies with bandwidth in the gigahertz range that is almost two orders of magnitude wider than that of contemporary resonator-based squeezers. Our amplifier is capable of simultaneously creating entangled microwave photon pairs with large frequency separation, with potential applications including high-fidelity qubit readout, quantum illumination and teleportation