Hybrid Porous Silicon - Silicon substrate for RF devices integration

International audienc

RF performances of inductors integrated on localized p⁺</var>-type porous silicon regions

International audienceTo study the influence of localized porous silicon regions on radiofrequency performances of passive devices, inductors were integrated on localized porous silicon regions, full porous silicon sheet, bulk silicon and glass substrates. In this work, a novel strong, resistant fluoropolymer mask is introduced to localize the porous silicon on the silicon wafer. Then, the quality factors and resonant frequencies obtained with the different substrates are presented. A first comparison is done between the performances of inductors integrated on same-thickness localized and full porous silicon sheet layers. The effect of the silicon regions in the decrease of performances of localized porous silicon is discussed. Then, the study shows that the localized porous silicon substrate significantly reduces losses in comparison with high-resistivity silicon or highly doped silicon bulks. These results are promising for the integration of both passive and active devices on the same silicon/porous silicon hybrid substrate

Porous Silicon/Silicon Hybrid Substrate Applied to the Monolithic Integration of Common-Mode and Bandpass RF Filters

International audienc

Study of Porous Silicon Substrates for the Monolithic Integration of Radiofrequency Circuits

International audienceThe silicon/porous silicon (PS) hybrid substrate is an interesting candidate for the monolithic integration of radiofrequency (RF) circuits. Thus, passive components can be integrated on the insulating PS regions close to the active devices integrated on silicon. Regarding silicon, hybrid substrates allow the improvement of RF circuits performances. To demonstrate it, coplanar waveguides have been integrated on glass, silicon, and localized PS substrates. The characterization results show that the substrate losses are reduced with PS

N-Type Porous Silicon Substrates for Integrated RF Inductors

International audienceTo study the effect of various n-type substrates on high-frequency inductor performances, several devices were integrated on porous silicon (PS), silicon (Si), and glass. Both n-type mesoporous Si and mesoporous/macroporous Si bilayers were fabricated. The analysis further shows that PS reduces significantly the substrate losses. Indeed, higher quality factors have been obtained for the inductors integrated on PS than on the Si substrate and particularly in the case of bilayer structures. These original results can be added to p-type PS performances already shown in the literature. Then, this work demonstrates that PS can also be a promising candidate for the integration of passive and active devices on n-type silicon

P Type Porous Silicon Resistivity and Carrier Transport

International audienc

Non-Oxidized Porous Silicon-Based Power AC Switch Peripheries

International audienceWe present in this paper a novel application of porous silicon (PS) for low-power alternating current (AC) switches such as triode alternating current devices (TRIACs) frequently used to control small appliances (fridge, vacuum cleaner, washing machine, coffee makers, etc.). More precisely, it seems possible to benefit from the PS electrical insulation properties to ensure the OFF state of the device. Based on the technological aspects of the most commonly used AC switch peripheries physically responsible of the TRIAC blocking performances (leakage current and breakdown voltage), we suggest to isolate upper and lower junctions through the addition of a PS layer anodically etched from existing AC switch diffusion profiles. Then, we comment the voltage capability of practical samples emanating from the proposed architecture. Thanks to the characterization results of simple Al-PS-Si(P) structures, the experimental observations are interpreted, thus opening new outlooks in the field of AC switch peripheries

Integration of low-loss inductors on thin porous silicon membranes

International audienc

Evaluation of Mesoporous Silicon Substrates Strain for the Integration of Radio Frequency Circuits

International audienc

RF Planar Inductor Electrical Performances on N-Type Porous 4H Silicon Carbide

International audienceFor the first time, inductors were integrated on porous silicon carbide to study the effect of this substrate on radio-frequency (RF) performances. n-Type heavily doped 4H-SiC substrates were anodized in an HF-based electrolyte to produce 6- and 15-&#x03BC;m-thick porous layers. An improvement of the quality factor was demonstrated on porous SiC with regard to SiC bulk. This promising result shows the decrease of substrate losses at the high frequencies with the porous SiC substrate. Thus, porous SiC could have an interest for the integration of RF power devices