37 research outputs found

    Universal non-adiabatic control of small-gap superconducting qubits

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    Resonant transverse driving of a two-level system as viewed in the rotating frame couples two degenerate states at the Rabi frequency, an amazing equivalence that emerges in quantum mechanics. While spectacularly successful at controlling natural and artificial quantum systems, certain limitations may arise (e.g., the achievable gate speed) due to non-idealities like the counter-rotating term. Here, we explore a complementary approach to quantum control based on non-resonant, non-adiabatic driving of a longitudinal parameter in the presence of a fixed transverse coupling. We introduce a superconducting composite qubit (CQB), formed from two capacitively coupled transmon qubits, which features a small avoided crossing -- smaller than the environmental temperature -- between two energy levels. We control this low-frequency CQB using solely baseband pulses, non-adiabatic transitions, and coherent Landau-Zener interference to achieve fast, high-fidelity, single-qubit operations with Clifford fidelities exceeding 99.7%99.7\%. We also perform coupled qubit operations between two low-frequency CQBs. This work demonstrates that universal non-adiabatic control of low-frequency qubits is feasible using solely baseband pulses

    Generating spatially entangled itinerant photons with waveguide quantum electrodynamics

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    Realizing a fully connected network of quantum processors requires the ability to distribute quantum entanglement. For distant processing nodes, this can be achieved by generating, routing, and capturing spatially entangled itinerant photons. In this work, we demonstrate the deterministic generation of such photons using superconducting transmon qubits that are directly coupled to a waveguide. In particular, we generate two-photon N00N states and show that the state and spatial entanglement of the emitted photons are tunable via the qubit frequencies. Using quadrature amplitude detection, we reconstruct the moments and correlations of the photonic modes and demonstrate state preparation fidelities of 84%. Our results provide a path toward realizing quantum communication and teleportation protocols using itinerant photons generated by quantum interference within a waveguide quantum electrodynamics architecture

    Microwave Package Design for Superconducting Quantum Processors

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    Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing. However, high-fidelity, simultaneous control of superconducting qubits at even a moderate scale remains a challenge, partly due to the complexities of packaging these devices. Here, we present an approach to microwave package design focusing on material choices, signal line engineering, and spurious mode suppression. We describe design guidelines validated using simulations and measurements used to develop a 24-port microwave package. Analyzing the qubit environment reveals no spurious modes up to 11GHz. The material and geometric design choices enable the package to support qubits with lifetimes exceeding 350 {\mu}s. The microwave package design guidelines presented here address many issues relevant for near-term quantum processors.Comment: 15 pages, 9 figure

    Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits

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    The large physical size of superconducting qubits and their associated on-chip control structures presents a practical challenge towards building a large-scale quantum computer. In particular, transmons require a high-quality-factor shunting capacitance that is typically achieved by using a large coplanar capacitor. Other components, such as superconducting microwave resonators used for qubit state readout, are typically constructed from coplanar waveguides which are millimeters in length. Here we use compact superconducting through-silicon vias to realize lumped element capacitors in both qubits and readout resonators to significantly reduce the on-chip footprint of both of these circuit elements. We measure two types of devices to show that TSVs are of sufficient quality to be used as capacitive circuit elements and provide a significant reductions in size over existing approaches
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