3 research outputs found

    Guidance in the Network Jungle - A Typology of Inter-Company Innovation Networks

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    Inter-organizational networks are recognized as a collaborative means of enabling small and medium-sized enterprises to compete and innovate in a dynamic environment. Previous studies have analyzed network types and their characteristics, yet there is no empirically grounded network typology combining and integrating these lone-standing attributes from either an academic or a practitioner-oriented point of view. By applying an explorative, sequential, mixed methodology approach, we provide the first typology of innovation networks based on both previous theories and newly generated empirical data. We conduct a directed content analysis to compile a comprehensive data set and apply a hierarchical, agglomerative clustering approach using the Ward linking method. We contribute to existing academic network research by providing the first compelling, generic typology of inter-organizational innovation networks and thereby offer guidance to practitioners and policy makers in the jungle of word creations around innovation networks. We identify and describe 11 types of formal interorganizational innovation networks: Avid Persuaders, Value Chain Drivers, Collective Facilitators, Niche Specialists, Lateral Thinkers, Transnational Opportunity Seekers, Financially Resilient Connectors, Local Trend Sponsors, Regional Activists, Associated Industry Supporters, and Dynamic Research Groups

    The ABC130 barrel module prototyping programme for the ATLAS strip tracker

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    For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.Comment: 82 pages, 66 figure

    The ABC130 barrel module prototyping programme for the ATLAS strip tracker

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    For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests
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