Experimental analysis and numerical simulation of sintered micro-fluidic

This paper investigates the use of numerical simulations to describe solid state diffusion of a sintering stage during a Powder Hot Embossing (PHE) process for micro-fluidic components. Finite element analysis based on a thermo-elasto-viscoplastic model was established to describe the densification process of a PHE stainless steel porous component during sintering. The corresponding parameters such as the bulk viscosity, shearing viscosity and sintering stress are identified from dilatometer experimental data. The numerical analyses, which were performed on a 3D micro-structured component, allowed comparison between the numerical predictions and experimental results of during a sintering stage. This comparison demonstrates that the FE simulation results are in better agreement with the experimental results at high temperatures

Physical modelling of amorphous thermoplastic polymer and numerical simulation of micro hot embossing process

Micro hot embossing process is considered as one of the most promising micro replication processes for manufacturing of polymeric components, especially for the high aspect ratio components and large surface structural components. A large number of hot embossing experimental results have been published, the material modelling and processes simulation to improve the quality of micro replication by hot embossing process are still lacking. This paper consists to 3D modelling of micro hot embossing process with amorphous thermoplastic polymers, including the mechanical characterisation of polymers properties, identification of the viscoelastic behaviour law of the polymers, numerical simulation and experimental investigation of micro hot embossing process. Static compression creep tests have been carried out to investigate the selected polymers’ viscoelastic properties. The Generalized Maxwell model has been proposed to describe the relaxation modulus of the polymers and good agreement has been observed. The numerical simulation of the hot embossing process in 3D has been achieved by taking into account the viscoelastic behaviour of the polymers. The microfluidic devices with the thickness of 2 mm have been elaborated by hot embossing process. The hot embossing process has been carried out using horizontal injection/compression moulding equipment, especially developed for this study. A complete compression mould tool, equipped with the heating system, the cooling system, the ejection system and the vacuum system, has been designed and elaborated in our research. Polymer-based microfluidic devices have been successfully replicated by the hot embossing process using the compression system developed. Proper agreement between the numerical simulation and the experimental elaboration has been observed. It shows strong possibility for the development of the 3D numerical model to optimize the micro hot embossing process in the future

A sulfur-rich pi-electron acceptor derived from 5,5 '-bithiazolidinylidene: charge-transfer complex vs. charge-transfer salt

International audienceNovel pi-electron acceptors are still highly desirable for the formation of conducting salts or as n-dopable semiconductors. We describe here two synthetic approaches to substitute a dicyanovinylidene group, C=C(CN)(2) to a thioketone (C=S) in the recently described DEBTTT acceptor where DEBTTT stands for (E)-3,3'-diethyl-5,5'-bithiazolidinylidene-2,4,2',4'-tetrathione. These electron withdrawing groups enhance the electron accepting ability as demonstrated through electrochemical investigations, without hindering the formation of short intra-and intermolecular S center dot center dot center dot S contacts in the solid state. Association of this acceptor 1 with tetramethyltetrathiafulvalene (TMTTF) and decamethylferrocene (Fe(Cp*)(2)) afforded 1 : 1 adducts which were analyzed by single crystal X-ray diffraction. Combined with vibrational and magnetic properties, it appears that [TMTTF][1] behaves as a neutral charge-transfer complex while [Fe(Cp*)(2)][1] is an ionic salt. The concentration of the spin density on the exocyclic sulfur atoms in 1(-center dot) favors the setting of direct anti-ferromagnetic interactions in [Fe(Cp*)(2)][1