Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart

Ni-Cr Alloys Assessment for Dental Implants Suitability

The performance of the field and the condition of success in oral implantology today require the review and reevaluation of the means that contribute essentially to ensuring the stability and durability of the implant, starting from the nature of the biomaterial and continuing with the characteristics of the optimally designed biosurface. This paper proposes a comparative analysis of three commercial alloys, VeraBond, Kera N, and VeraSoft, compared to a modified dental alloy, with the aim of improving some mechanical properties. They have been studied structurally and mechanically. The microstructural structure shows that the alloys crystallize in the face-centered cube system, and the cast alloy has a dendritic structure with large grains. XRD diffractograms highlight that alloys exhibit three compounds Cr156.00 Al596.00: 9013031, Ni4.00, and Cr30.00Al48.00. The hardness measurements showed values between 203 HV and 430 HV. As the percentage of silicon increases, the hardness decreases. The modulus of elasticity obtained by the indentation method for the dental alloys was in the range of 46–153 GPa. The results showed that the hardness and elastic modulus of the new alloy was significantly minimized compared to the classical alloys used

Ni-Cr Alloys Assessment for Dental Implants Suitability

The performance of the field and the condition of success in oral implantology today require the review and reevaluation of the means that contribute essentially to ensuring the stability and durability of the implant, starting from the nature of the biomaterial and continuing with the characteristics of the optimally designed biosurface. This paper proposes a comparative analysis of three commercial alloys, VeraBond, Kera N, and VeraSoft, compared to a modified dental alloy, with the aim of improving some mechanical properties. They have been studied structurally and mechanically. The microstructural structure shows that the alloys crystallize in the face-centered cube system, and the cast alloy has a dendritic structure with large grains. XRD diffractograms highlight that alloys exhibit three compounds Cr156.00 Al596.00: 9013031, Ni4.00, and Cr30.00Al48.00. The hardness measurements showed values between 203 HV and 430 HV. As the percentage of silicon increases, the hardness decreases. The modulus of elasticity obtained by the indentation method for the dental alloys was in the range of 46–153 GPa. The results showed that the hardness and elastic modulus of the new alloy was significantly minimized compared to the classical alloys used

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart