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3 research outputs found
Reliability-oriented environmental thermal stress analysis of fuses in power electronics
Author
A.S. Bahman
Bahman
+13 more
Bahman
Chiriac
F. Blaabjerg
F. Iannuzzo
Meng
Muralidharan
Pleşca
Pleşca
R.Ø. Nielsen
Robert
T. Holmgaard
Wang
Wiliams
Publication venue
'Elsevier BV'
Publication date
Field of study
No full text
Crossref
Improved Cauer thermal network considering thermal coupling effects of multi‐chip modules
Author
Ahsan M.
Allard B.
+40 more
An N.
Bahman A.S.
Bahman A.S.
Bahman A.S.
Batard C.
Bing Li
Chen J.
Chen M.
Chenchen Li
Deng E.
Du B.
Du X.
Fabis P.M.
Gachovska T.K.
Gachovska T.K.
Gerstenmaier Y.C.
Gu J.
Holman J.P.
Huang M.J.
Iwamuro N.
Jianbo Zhou
Li D.
Li H.
Li H.
Ma K.
Nguyen N.B.
Qian C.
Schweitzer D.
Shahjalal M.
Swan I.
Szekely V.
Vermeersch B.
Wang H.
Wang Z.
Weibo Yuan
Wu R.
Xu Y.
Yigang He
Zhihong W.
Zhiqiang Ma
Publication venue
'Institution of Engineering and Technology (IET)'
Publication date
Field of study
No full text
Crossref
Increasing the reliability of wind turbines using condition monitoring of semiconductor devices: a review
Author
Arab M.
Bahman A.S.
+57 more
Baker N.
Barlini D.
Bayerer R.
Bi R.
Bęczkowski S.
Chang L.
Charalampos Baniotopoulos
Chen L.
Chen N.
Choi U.‐M.
Choi U.‐M.
Coquery G.
Do M.
Dupont L.
Eleffendi M.
Fratelli L.
Fu S.
Ghimire P.
Han B.
Hassan Hemida
Katsis D.
Katsis D.C.
Khanna V.
Kojima T.
Kuh H.
Lehmann J.
Loh W.S.
Luo H.
Madhusoodhanan S.
Mingxing D.
Ohring M.
Pedro García Márquez F.
Perpiñà X.
Pietro Tricoli
Rana Moeini
Reigosa P.D.
Sadik D.
Sadik D.‐P.
Sarkany Z.
Singh A.
Takashi K.
Tu P.
Wang H.
Wang H.
Wang Z.
Weber S.
Xiang D.
Xiang L.
Xu L.
Xue P.
Ye X.
Yun C.
Zhou L.
Zhou Q.
Zhou S.
Zorn C.
Zorn C.
Publication venue
'Institution of Engineering and Technology (IET)'
Publication date
Field of study
No full text
Crossref