65 research outputs found
An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
Particulate composites are commonly used in Microelectronics applications. One example of such materials is Thermal Interface Materials (TIMs) that are used to reduce the contact resistance between the chip and the heat sink. The existing analytical descriptions of thermal transport in particulate systems do not accurately account for the effect of inter-particle interactions, especially in the intermediate volume fractions of 30-80%. Another crucial drawback in the existing analytical as well as the network models is the inability to model size distributions (typically bimodal) of the filler material particles that are obtained as a result of the material manufacturing process. While full-field simulations (using, for instance, the finite element method) are possible for such systems, they are computationally expensive. In the present paper, we develop an efficient network model that captures the physics of inter-particle interactions and allows for random size distributions. Twenty random microstructural arrangements each of Alumina as well as Silver particles in Silicone and Epoxy matrices were generated using an algorithm implemented using a java language code. The microstructures were evaluated through both full-field simulations as well as the network model. The full-field simulations were carried out using a novel meshless analysis technique developed in the author’s (GS) research [26]. In all cases, it is shown that the random network models are accurate to within 5% of the full field simulations. The random network model simulations were efficient since they required two orders of magnitude smaller computation time to complete in comparison to the full field simulation
The Effect of Polydispersivity on the Thermal Conductivity of Particulate Thermal Interface Materials
Special Section on Components and Packaging Technologies With Contributions From ITherm 2002 Thermal Management Track
Originally published in IEEE Transactions on Components and Packaging Technology Vol. 26 No. 1. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.ITHERM 2002, the 8th Intersociety Conference on Thermal,
Mechanical and Thermomechanical Phenomena in Electronic
Systems, hosted approximately 500 international experts
in the areas of thermal management, thermomechanical and
mechanics issues, and emerging technologies in electronic
packaging and systems in San Diego, CA, May 30–June 1,
2002. The Technical Program included nearly 150 peer-reviewed
papers presented in 35 sessions arranged into three
Tracks: Thermal Management, Applied Mechanics, and
Emerging Technologies. Twenty-five of these sessions were
in the area of Thermal Management. This represented an
increase in the number of presented papers and attendance
compared with ITherm 2000, in spite of an economic downturn
in the intervening period. Three special issues of the CPMT
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING
TECHNOLOGIES have been planned, one for each Track. The
papers appearing in this Special Issue are in the area of thermal
management and have been nominated by session chairs for
consideration for the ITherm 2002 Best Paper in the Thermal
Management Track. In addition, three of the six Keynote
Speeches have also been included in this Special Issue. These
papers reflect a broad range of current interest topics covered
in the area of thermal management at ITherm 2002. Of the
sixteen papers selected for this Special Issue, eleven have
been accepted for publication after peer review
An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
Schmelzen einer horizontalen Eisschicht von oben durch kombinierte Einwirkung von Wärme und wäßriger Lösung
New Ortho-Directing Group for Lithiation: Use of a Methoxy-Imino Auxiliary for the Synthesis of Chiral Ortho-Substituted Acetyl- and Propionylferrocenes
- …