Application of Stereo Imaging to Atomic Force Microscopy

Metrological data from sample surfaces can be obtained by using a variety of profilometry methods. Atomic Force Microscopy (AFM), which relies on contact inter-atomic forces to extract topographical images of a sample, is one such method that can be used on a wide range of surface types, with possible nanometer range resolution. However, AFM images are commonly distorted by convolution, which reduces metrological accuracy. This type of distortion is more significant when the sample surface contains high aspect ratio features such as lines, steps or sharp edges - structures commonly found in semiconductor devices and applications. Aiming at mitigating these distortions and recovering metrology soundness, we introduce a novel image deconvolution scheme based on the principle of stereo imaging. Multiple images of a sample, taken at different angles, allow for separation of convolution artifacts from true topographic data. As a result, perfect sample reconstruction and probe shape estimation can be achieved in certain cases. Additionally, shadow zones, which are areas of the sample that cannot be probed by the AFM, are greatly reduced. Most importantly, this technique does not require a priori probe characterization. It also reduces the need for slender or sharper probes, which, on one hand, induce less convolution distortion but, on the other hand, are more prone to wear and damage, thus decreasing overall system reliability.Singapore-MIT Alliance (SMA

Imaging at the Nano-scale: State of the Art and Advanced Techniques

Surface characteristics such as topography and critical dimensions serve as important indicators of product quality and manufacturing process performance especially at the micrometer and the nanometer scales. This paper first reviews different technologies used for obtaining high precision 3-D images of surfaces, along with some selected applications. Atomic force microscopy (AFM) is one of such methods. These images are commonly distorted by convolution effects, which become more prominent when the sample surface contains high aspect ratio features. In addition, data artifacts can result from poor dynamic response of the instrument used. In order to achieve reliable data at high throughput, dynamic interactions between the instrument's components need to be well understood and controlled, and novel image deconvolution schemes need to be developed. Our work aims at mitigating these distortions and achieving reliable data to recover metrology soundness. A summary of our findings will be presented.Singapore-MIT Alliance (SMA