Transient Liquid Phase Diffusion Bonding of Magnesium Alloy (Mg-AZ31) to Titanium Alloy (Ti-6Al-4V)

The magnesium alloy Mg-AZ31 and titanium alloy Ti-6Al-4V have physical characteristics and mechanical properties that makes it attractive for a wide range of engineering applications in the aerospace and automotive industries. However, the differences in melting temperature and coefficient of thermal expansion hinder the use of traditional fusion welding techniques. Transient liquid phase (TLP) bonding of magnesium alloy Mg-AZ31 and titanium alloy Ti-6Al- 4V was performed and different interlayer types and configurations were used to facilitate joint formation. The joining of these alloys using Ni foils was successful at a bonding temperature of 515oC, bonding pressure 0.2 MPa, for bonding time of 5 minutes. At the Ni/Mg-AZ31 bond interface, the formation of a eutectic liquid between Mg and Ni was observed. The formation of Mg2Ni and Mg3AlNi2 were identified along the bond interface resulting in an isothermally solidified joint. At the Ni/Ti-6Al-4V interface, the solid-state diffusion process results in joint formation. The use of double Ni-Cu sandwich joint resulted in further enhancement in joint formation and this produced joints with greater shear strength values. The configuration of Mg-AZ31/Cu- Ni/Ti-6Al-4V or Mg-AZ31/Ni-Cu/Ti-6Al-4V influence the mechanism of bonding and the type of intermetallics formed within the joint. The application of thin Ni electrodeposited coatings resulted in further enhancements of joint quality due to better surface-to-surface contact and a reduction in the formation of intermetallics at the joint. The effect of Cu nano-particles in the coatings was found to decrease the eutectic zone width and this resulted in an increase the shear strength of the joints. The highest shear strength of 69 MPa was possible with bonds made using coatings containing Cu nano-particle dispersion

The role of intelligent manufacturing systems in the implementation of Industry 4.0 by small and medium enterprises in developing countries

Abstract The desire to enhance connectivity and communication while simplifying data used to improve and optimize products and processes has driven many organizations within developed countries to invest heavily in implementing intelligent technologies for manufacturing. These technologies promise to enhance global manufacturing capabilities while sustaining demands by integrating equipment and frameworks in advanced economies for future production systems. On the other hand, many small and medium enterprises (SMEs) within developing countries have shown apprehension and mistrust toward the emerging technologies associated with Industry 4.0. This article provides a comprehensive review of SMEs' readiness within developing countries to implement the novel technologies falling within the Industry 4.0 realm. Such techniques include intelligent manufacturing systems, cyber‐physical systems, and other crucial technological tools for improved connectivity and communication within manufacturing and production systems. Analysis of the literature shows that many SMEs within developing countries are experiencing delays in introducing intelligent manufacturing and digitizing factories due to a lack of knowledge and communication issues. These firms lag in embracing the transformation to equipment and systems that can communicate with future‐oriented technologies and introduce intelligent devices and machines into production processes. This article explores challenges, identifies gaps and suggests the potential solutions to address the readiness of SMEs toward Industry 4.0 in developing countries, through a systematic summary and integrative analysis of the findings from the literature

Transient Liquid Phase Bonding of Magnesium Alloy AZ31 Using Cu Coatings and Cu Coatings with Sn Interlayers

Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu coatings with Sn interlayer. Copper coatings were used for one set of the bonds, and a combination of Cu coatings and Sn interlayer was used for the other set of bonds. The bonding temperature was fixed at 520 °C, and various bonding times were applied. This study shows that the bonds produced using only Cu coatings have shown weaker bonds compared to the bonds made using Cu coatings and Sn interlayer. The Cu2Mg particles were detected at the joint region of both bonds made by Cu coatings and Cu coatings with Sn interlayer by X-ray diffraction (XRD). However, it has been observed that the joint region was dominated by solid solution which is rich in Mg. Sn interlayer was not contributed to the intermetallic compound (IMC) at the joint region, and therefore it was diffused away through the Mg matrix. Within the joint interface, a slight increase of micro-hardness was observed compared to Mg base metal alloy. This was attributed to the formation and presence of IMC’s within the joint region. It was noticed that the presence of the Sn interlayer improved the joint strength by reducing the pores at the joint region. Pores were clearly observed for those bonds made using Cu coatings—especially for region where the fracture occurs; this was accomplished by scanning electron microscope (SEM)