Recognitionand Analysis of Microstructure Parameters of Porous Anodic Films Using ImageJ

The most important parameters that characterize the microstructure of the films and determine the possibility of their use as porous templates are the pore diameter, porosity, and ordering of the porous structure. Therefore, to increase the efficiency of the use of porous anodic alumina films, it is important to investigate the effect of the formation modes on the microstructure. The aim of this work was to choose and optimize a model for processing experimental data obtained by scanning electron microscopy in the ImageJ to determine the parameters of the microstructure of porous films. The work shows the result of SEMimage analysis and obtains plots of pore diameter distribution by size and determines the diameter of the main pores

Obtaining high silica powders containing copper ions of a given stoichiometric composition

The paper presents the results of studies of the Technological Stages of Obtaining High-Silica Powders Containing Copper Ions by the Sol-Gel Method. It has been shown that metal nanoparticles in a xerogel matrix are nanostructured objects with high chemical and “penetrating” activity with respect to the occurrence of thermally stimulated surface reactions, while the SiO2 matrix retains an amorphous system, whereas CuO and Cu° form a monoclinic crystalline syngony. Based on the results of SEM data, it was suggested that the reduced metal is sorbed into the globular structure of the xerogel, forming a thin composite layer on the SiO2 surface. No pronounced formation of separately localized Cu° micro- and nanoparticles was found. From the obtained high-silica SiO2:CuO and SiO2:Cuº powders, targets were formed for the deposition of thin films by electron-beam or magnetron sputtering with a diameter of up to 80 mm

Structural propertis of micropowders composition SiO2:CuO & SiO2:Cu° prepared by sol-gel method

The aim of the research was to obtain and study the functional characteristics of composite materials of the composition SiO2, SiO2:CuO and SiO2:Cu°, synthesized on the basis of Aerosil A-300. The basis for obtaining micropowders from pyrogenic silica was an aqueous dispersion of aerosil containing copper nitrate with a concentration (in molar percent) SiO2:Cu (NO3)2×3H2O = 1:0.25; 1:0.40 and 1:0.5. The aqueous dispersion (sol) of the specified composition was subjected to successive drying and annealing in air to T = 800 ºС (holding time was 1 h). The micro-powder formed as a result of such heat treatment had a phase composition of SiO2:CuO. Further annealing of such composite micro-powders in a hydrogen atmosphere (at Т = 800 ºС, holding time - 1 h) made it possible to transform bivalent copper oxide Cu (II) into the state of reduced copper (Cuº).The phase transformations of copper nitrate into its oxide (II) or reduced copper (under the action of thermal treatment of micropowders in an appropriate gas environment) were studied using the method of X-ray phase analysis. The morphology of the structure of the synthesized xerogels was studied by scanning electron microscopy. The processing of the obtained SEM images was carried out using the Gwyddion program (techniques were used to create an inverted "mask" for the surface of the sample under study). The elemental composition of the synthesized micropowders was determined by the (EDX) method. Based on the data obtained and studies carried out by other authors for materials of this kind, assumptions were made about the possibility of using synthesized powders of SiO2 xerogels containing micro- and nanoparticles of reduced metals (as well as metal oxides) as effective biologically active substances with a wide range medical purposes, as well as construction materials used to create microsensors with a selective sensitivity zone

Evolution of copper ions in high-silica thin films

The paper studies Thin Films based on Silica which doped with Copper Ions (SiO2:CuO) at A Molar Ratio of (1:0.20; 1:0.30; 1:0.40) Deposited on Quartz and Silicon Substrates. The films were obtained by ion sputtering in a gaseous medium (argon/oxygen) from High- Silica targets obtained by the Sol-Gel method. The morphology and structure of the films were studied using scanning electron microscopy and X-ray phase analysis. X-ray phase analysis of the films revealed that the structure of the films is polycrystalline and has a hexagonal structure. It has been established that the reduction of Cu+2 to Cu+ occurs during film preparation in argon, which is confirmed by the analysis of absorption spectra and XRD data. The obtained frequency dependences of the dielectric permittivity of SiO2:CuO films showed a decrease in the dielectric permittivity and dielectric loss tangent in the range of (103 to 106) Hz. It has been found that when the SiO2:CuO film thickness is less than 100 nm, a thin-film capacitor is not always formed. The calculation of the film band gap shows the presence of two energy bands corresponding to the SiO2:CuO and SiO2:Cu2O compositions. The band gap of Eg(CuO) changes with increasing concentration from 3.564 to 2.598 eV, and Eg(Cu2O) changes with increasing concentration from 5.299 to 3.586 eV. A dip corresponding to the plasmon effect is observed in the transmission spectra in the region of 600–650 nm