Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these materials are generally not very receptive to chemical bond formation with the deposited ink. This paper deals with the surface modification of a high frequency laminate (substrate) using two different techniques to improve interfacial adhesion. The techniques deployed are CF4/O2 based plasma treatment and micro structuring using pulsed laser. The plasma treatment parameters were varied systematically using a statistical design of experiments. Substrates with varying surface characteristics, resulting from different plasma treatment parameters, were subjected to post-processing steps including surface energy and surface roughness measurements. Similarly, the influence of laser treatment parameters on surface characteristics of the substrate was also studied in detail. The outcomes of these two surface modification techniques are discussed in this paper

A comparative study of two conductive inkjet inks for fabrication of RF circuit structures

Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, to impart the desired thickness to the circuit structures. The inkjet printing-electroless plating process combination was validated with the example of an S-band filter and an RF transmission line. Prior to the fabrication of the circuit structures, the substrates were plasma treated, in order to modify their surface and promote mechanical interlocking with the printed structures.\ud Finally, experiments were conducted to determine the solderability\ud of inkjet printed as well as printed-plated structures. Conclusions on\ud the suitability of the two inks for RF circuit fabrication have been\ud drawn based on experimental results

Job satisfaction of people with intellectual disabilities:Associations with job characteristics, fulfilment of basic psychological needs and autonomous motivation

Meininger, H.P. [Promotor]Kef, S. [Copromotor

Development of a Damage Quantification Model for Composite Skin-Stiffener Structures

The development of a model-based approach for a damage severity assessment applied on a complex composite skin structure with stiffeners is presented in this paper. Earlier investigations on composite structures with stiffeners revealed that a vibration based structural health monitoring approach, employing the Modal Strain Energy Damage Index (MSE-DI) algorithm can detect and localise delaminations. The next step, performed in the presented part of the research, is to assess the severity of the damage. It is shown that combining results from a fre-quency based analysis and from a modal strain energy based analysis can enhance the quantifica-tion of the severity estimation. This conclusion was drawn by analysing the effect of small masses that were added at a specific location in to mimic a damage, but maintain reversibility of the dam-age. The use of a numerical model to create a virtual test space was found to be valuable for the interpretation of experimental dat

Vibration based Structural Health Monitoring of a Composite Plate Structure with Multiple Stiffeners

A vibration based damage identification method is investigated experimentally.\ud The dynamic response of an intact and a locally damaged 16–layer unidirectional\ud carbon fibre PEKK reinforced plate structure with two stiffener sections is considered.\ud A forced–vibration set–up, including a laser vibrometer system, is employed\ud to measure the dynamic behaviour. The feasibility of the two–dimensional Modal\ud Strain Energy Damage Index algorithm to detect and localize impact induced defects\ud is demonstrated