Development of 3C-SiC MOSFETs, Journal of Telecommunications and Information Technology, 2007, nr 2

The paper reviews the development of the 3C-SiC MOSFETs in a unique development project combining the material and device expertise of HAST (Hoya Advanced Semiconductor Technologies) and Acreo, respectively. The motivation for the development of the 3C-SiC MOSFETs and the summary of the results from the lateral and vertical devices with varying size from single cell to 3×3 mm2 large devices are reviewed. The vertical devices had hexagonal and square unit cell designs with 2 μm and 4 μm channel length. The p-body was aluminum implanted and the source was nitrogen or phosphorus implanted. Low temperature Ti/W contacts were evaluated

Large area scanning probe microscope in ultra-high vacuum demonstrated for electrostatic force measurements on high-voltage devices

Background: The resolution in electrostatic force microscopy (EFM), a descendant of atomic force microscopy (AFM), has reached nanometre dimensions, necessary to investigate integrated circuits in modern electronic devices. However, the characterization of conducting or semiconducting power devices with EFM methods requires an accurate and reliable technique from the nanometre up to the micrometre scale. For high force sensitivity it is indispensable to operate the microscope under high to ultra-high vacuum (UHV) conditions to suppress viscous damping of the sensor. Furthermore, UHV environment allows for the analysis of clean surfaces under controlled environmental conditions. Because of these requirements we built a large area scanning probe microscope operating under UHV conditions at room temperature allowing to perform various electrical measurements, such as Kelvin probe force microscopy, scanning capacitance force microscopy, scanning spreading resistance microscopy, and also electrostatic force microscopy at higher harmonics. The instrument incorporates beside a standard beam deflection detection system a closed loop scanner with a scan range of 100 μm in lateral and 25 μm in vertical direction as well as an additional fibre optics. This enables the illumination of the tip–sample interface for optically excited measurements such as local surface photo voltage detection. Results: We present Kelvin probe force microscopy (KPFM) measurements before and after sputtering of a copper alloy with chromium grains used as electrical contact surface in ultra-high power switches. In addition, we discuss KPFM measurements on cross sections of cleaved silicon carbide structures: a calibration layer sample and a power rectifier. To demonstrate the benefit of surface photo voltage measurements, we analysed the contact potential difference of a silicon carbide p/n-junction under illumination

Two-Dimensional Carrier Profiling on Lightly Doped n-Type 4H-SiC Epitaxially Grown Layers

Electronically active dopant profiles of epitaxially grown n-type 4H-SiC calibration layer structures with concentrations ranging from 3.1015 cm-3 to 1·1019 cm-3 have been investigated by non-contact Scanning Probe Microscopy (SPM) methods. We have shown that Kelvin Probe Force Microscopy (KPFM) and Electrostatic Force Microscopy (EFM) are capable of resolving two-dimensional carrier maps in the low doping concentration regime with nanoscale spatial resolution. Furthermore, different information depths of this wide band gap semiconductor material could be assessed due to the inherent properties of each profiling method. We additionally observed a resolution enhancement under laser illumination which we explain by reduced band-bending conditions. To gauge our SPM signals, we utilized epitaxially grown layers which were calibrated, in terms of dopant concentration, by C-V measurements

Localized Lifetime Control of 10 kV 4H-SiC PiN Diodes by MeV Proton Implantation

In this paper, proton implantation with different combinations of MeV energies and doses from 2x109 to 1x1011 cm-2 is used to create defects in the drift region of 10 kV 4H-SiC PiN diodes to obtain a localized drop in the SRH lifetime. On-state and reverse recovery behaviors are measured to observe how MeV proton implantation influences these devices and values of reverse recovery charge Qrr are extracted. These measurements are carried out under different temperatures, showing that the reverse recovery behavior is sensitive to temperature due to the activation of incompletely ionized p-type acceptors. The results also show that increasing proton implantation energies and fluencies can have a strong effect on diodes and cause lower Qrr and switching losses, but also higher on-state voltage drop and forward conduction losses. The trade-off between static and dynamic performance is evaluated using Qrr and forward voltage drop. Higher fluencies, or energies, help to improve the turn-off performance, but at a cost of the static performance