Thermo-mechanical and wetting behavior of modified SnAg3.5eutectic solder alloy

Effects of adding bismuth content on structure, thermo-mechanical and wetting behavior of SnAg3.5 eutectic alloy have been investigated. Matrix structure of SnAg3.5 eutectic alloy, such as crystallinity, crystal size and lattice parameters, changed after adding bismuth content which effect on all measured properties. Melting temperature of SnAg3.5 eutectic alloy decreased after adding bismuth content. Elastic modulus and contact angle of SnAg3.5 eutectic alloy varied after adding bismuth content. The Sn66.5Ag3.5Bi30alloy has the best solder properties for electronic applications such as lower melting temperature, contact angle and elastic modulus

Effect of quaternary addition on structure, electrical, mechanical and thermal properties of bismuth-tin-zinc rapidly solidified fusible alloy

Effect of quaternary addition, silver or indium, on structure, electrical, mechanical and thermal properties of bismuth-tin-zinc rapidly solidified fusible alloy have been investigated.  Adding silver or indium caused change in alloy matrix microstructure such as matrix parameters and crystal structure of formed phase.  A significant increase in bismuth-tin-zinc alloy strengthens with a little decreased in melting point after adding silver content.  But a significant decrease in bismuth-tin-zinc alloy melting point with a very little increase in alloy strengthens after adding indium conten

Modification of Pb-Sb eutectic bearing-solder alloys with bismuth additions rapidly solidified from melt

In this work, various amounts of Bi element have been added to the eutectic Pb-Sb to form bearing- solder materials. The Pb-Sb eutectic has been produced by rapid solidification using melt spinning technique with various amounts of Bi have been added to it, in the ratio 1, 2 , 3, 4, and 5 wt.%. Scanning electron microscopy (SEM), X- ray diffraction (XRD) analysis and differential scanning calorimetry (DSC) have been carried out. Microhardness measurements were also carried out using Vicker’s hardness technique. The results showed that, the ternary alloys up to 4 wt.% Bi have properties superior to binary eutectic material. Bismuth up to 4wt. % increases the Young’s modulus, Vicker’s hardness and decreases the electrical resistivity, internal friction and melting point. The ternary Pb-13.1Sb-4Bi solder alloy has a lower melting point about 237.87 ?C. Also, the results show that formation of Bi phase developed the mechanical properties and Vicker’s hardness due to addition of Bi element. The addition of Bi refines the crystal size of Sn in case of melt spun alloys as seen in scanning electron micrographs and X-ray diffraction

Correlation between microstructure, mechanical and thermal properties of In-Bi-Sn-Ag melt spun alloys

A series of indium-bismuth-tin-silver alloys containing up to 5 wt. % silver were quenched from melt by chill-block melt-spin technique. The resultant ribbons were studied by X-ray diffraction, scanning electron microscope, energy dispersive X-ray, and deferential scanning calorimetry techniques. Structural, Mechanical and thermal correlations were discussed and reviewed for In-Bi-Sn-Ag Fields metal alloy systems. The results are interpreted in terms of the phase changes occurring in the alloy system. It is found that melting point, solidus and liquidus temperatures of the solder alloys are lowered as the Ag content is increased. With the addition of Ag, the In rich phase is finer in size, and the intermetallic compounds are more uniformly distributed.  As a result, Youngs modulus and microhardness of In-Bi-Sn are increased when Ag is added into the solder alloy. It is also , concluded that from our results, the present work relates to a melting temperature adjustable metal thermal interface material (TIM) applicable to an interface between a microelectronic packaging component and a heat dissipation device, so as to facilitate the heat dissipation of the microelectronic component

An analysis of the transport properties and mechanical stability of rapidly solidified Al-Sb alloy

The structure of a series of AlSb alloys prepared by melt spinning have been studied in the as melt–spun ribbons as a function of antimony content .The stability of these structures has been related to that of the transport and mechanical properties of the alloy ribbons. Microstructural analysis was performed and it was found that only Al and AlSb phases formed for different composition. The electrical, thermal and the stability of the mechanical properties are related indirectly through the influence of the antimony content. The results are interpreted in terms of the phase change occurring to alloy system. Electrical resistivity, thermal conductivity, elastic moduli and the values of micro hardness are found to be more sensitive than the internal friction to the phase change

A study of eutectic indium-bismuth and indium-bismuth-tin Fields metal rapidly solidified from melt

In this paper, the microstructure and thermal behavior of two rapidly solidified of eutectic Indium-Bismuth and Indium-Bismuth-Tin Fields metal are reported. This work experimentally measures the specific heat of the eutectic alloys of the binary Indium-bismuth and indium bismuth tin tertiary system using a differential scanning calorimeter (DSC) technique and analyzes the results to determine the thermodynamic properties of the system have sufficient scaling for experimental modeling applications. The resultant ribbons were studied by X-ray diffraction (XRD), scanning electron microscope (SEM) techniques, energy dispersive x-ray (EDX) technique. From the differential scanning calorimetry measurements, it is found that entropy change, enthalpy and specific heat are improved and enhanced compared with literature. The electrical resistivity was reported for temperatures between 295 and 330 K for all the melt-quenched ribbons of binary In-49Biand tertiary In-32.5 Bi -16.5 Sn (wt.%). The microhardness, elastic moduli, internal friction and both thermal diffusivity and thermal effusivity were also measured. Fields metal is more than suitable for use in experimental settings as it is non-reactive, non-toxic, simple to manufacture, easy to use, and responds to a magnetic force

Gamma radiation effects on vitamins, antioxidant, internal and molecular structure of Purslane seeds

Purslane contains the highest amount of omega-3 fatty acids, antioxidants, and has better nutritional quality. Gamma irradiation is harmless and dependable method for refining the shelf life and nutritional quality of the stored seeds. The aim of this research is to study the influence of irradiation by gamma on structure, ascorbic acid and phenolic content of Purslane seeds. The results show that, ascorbic acid, phenolic content, carbohydrate and protein content in Purslane seeds decreased after exposed by gamma rays. Super oxidase dismutase, fat and fiber content in Purslane seeds increased after exposed by gamma radiation. The shape, size, interconnection and arrangement of molecules in/or around benzene ring in Purslane cells changed after exposure to gamma radiation