Design, fabrication and applications of microplasma device

The feasibility of using microplasma device (MPD) as a non-thermal plasma source for hydrogen production to potentially replace conventional source of electricity for potable applications has been explored. The scaling theory for direct glow discharges along with the design approach, fabrication details and the experimental characterizations are presented for two types of device: Planar Geometry Microplasma Device (PGMPD), and Parallel Plane Electrodes Microplasma Device (PPEMPD). Optical Emission Spectroscopy (OES) and current-voltage characteristics of the two designs are described. Issues related to plasma stability and breakdown voltage are studied. It was found that the breakdown voltage of the designs is about 280 V, with a 30-sccm of argon flow rate. In addition it was found that a more durable electrode material is needed to improve the lifetime of the PPEMPD devices, which is limited to about 2 hours due to sputtering. Experimental runs have demonstrated a water vapor conversion to hydrogen using argon plasma at atmospheric pressure

Investigation of Microplasma Cells Fabricated on Silicon Wafer

The objective of this project was to investigate the possibility of producing array of microplasma, having aluminum and silicon electrodes, and oxide as a dielectric with cavity size as large as 30x30 μm2. One of the potential applications among many was to use such device as a photodector. A new class of photodectors, hybrid semiconductor-microplasma devices, to exhibit photoresponsivities in the visible and near infrared that are more than an order of magnitude larger than those typical of semiconductor avalanche photodiodes [1]. After fabrication processing, the route causes of failure were determined. Processing problems were diagnosed and process evaluation test structures characterized using optical microscope, and scanning electron microscopy (SEM). Oxide insulation between the metal layers (Aluminum) was tested using a multimeter. Continuity tests revealed a short between the metal electrodes. The application of SEM in this failure analysis of a finished device shows aluminum stringers left in the cavities. This was the confirmation of a potential short previously diagnosed with the multimeter test

The Journal of Microelectronic Research 2008

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