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5 research outputs found

Printing of SMT Adhesives

Author: A.Z. Miric
Publication venue: 'Emerald'
Publication date
Field of study

High Quality Solder Pastes:

Author: A.Z. Miric
Tutorial
Publication venue: 'Emerald'
Publication date
Field of study

Zn-Al based alloys as Pb-free solders for die attach

Author: A.R.C. Westwood
A.Z. Miric
B. Kempf
C. Tschudin
D.B. Masson
E.D. Hondros
G. Eriksson
J. Crank
J. Glazer
M. Rettenmayr
M.P. Seah
P. Lambracht
P. Villars
R.C. Hugo
T. Shimizu
T.B. Massalski
V. Tolmachev
W.B. Hampshire
W.R. Goggin
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders

Author: A. Sharif
A. Sharif
A.Z. Miric
C.H. Yu
C.Y. Chou
Chiapyng Lee
Chun-Lei Hsu
D.J. Chakrabarti
D.Q. Yu
D.R. Frear
H. Okamoto
H.K. Kim
I. Karakaya
J. Glazer
K. Suganuma
K.N. Tu
L .H. Su
M. Schaefer
M.O. Alam
N. Saunders
P.Y. Yeh
S. Mannan
Weng-Ting Chou
Y.M. Liu
Y.W. Yen
Yee-Wen Yen
Yu Tseng
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments

Author: A. Lee
A.Z. Miric
B.Z. Hong
C.J. Zhai
F. Guo
F. Guo
G.D. Giacomo
H. Mavoori
H. Rhee
H. Rhee
H. Rhee
H. Rhee
H.C.L. Abbenhuis
J. Howell
J. Lau
J. McDougall
J. Sigelko
J.C. Suhling
J.D. Lichtenhan
J.D. Sigelko
J.G. Lee
J.G. Lee
J.G. Lee
J.G. Lee
J.H. Huang
K.C. Chen
K.J. Ferguson
K.N. Subramanian
K.N. Subramanian
K.N. Subramanian
K.N. Subramanian
K.N. Subramanian
M. Farooq
R.A. Mantz
R.H. Raeder
S. Choi
S. Choi
S. Choi
S.G. Jadhav
T. Goswami
W. Zhang
W.J. Plumbridge
W.J. Plumbridge
W.L. Winterbottom
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/2007
Field of study

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