Thermal resistanse and nonuniform distribution of electroluminescence and temperature in high-power AlGaInN light-emitting diodes

The paper studies current spreading, light emission, and heat transfer in high-power flip-chip light-emitting diodes (LEDs) and their effect on the chip thermal resistance by experimental and theoretical approaches. The thermal resistance was measured using two methods: by monitoring the transient response of the LED operation voltage to the temperature variation with the Transient Tester T3Ster and by temperature mapping with the use of an infrared thermal-imaging microscope. The near field of the electroluminescence intensity was recorded with an optical microscope and a CCD camera. Three-dimensional numerical simulation of the current spreading and heat transfer in the LED chip was carried out using the SimuLED package in order to interpret the obtained experimental results

Deep green and monolithic white LEDs based on combination of short-period InGaN/GaN superlattice and InGaN QWs

International audienceThis work presents the results of the investigation of approaches to the synthesis of the active region of LED with extended optical range. Combination of short‐period InGaN/GaN superlattice and InGaN quantum well was applied to extend optical range of emission up to 560 nm. Monolithic white LED structures containing two blue and one green QWs separated by the short‐period InGaN/GaN superlattice were grown with external quantum efficiency up to 5–6%

Effect of stimulated phase separation on properties of blue, green and monolithic white LEDs

International audienceDifferent methods of stimulation of phase separation in an InGaN QWs by technological methods and by design of structure were investigated. Effect of admixing of hydrogen during growth interruptions (GIs) after deposition of the InGaN QWs on their structural and optical properties and properties of InGaN‐based LEDs was investigated. Effect of growth pressure on the phase separation was investigated and formation of separate InGaN islands at increase in growth pressure was revealed. It was shown that the phase separation is stumulated in composite InAlN/GaN/InGaN heterostructures and formation of well isolated InGaN islands was observed. Effect of the phase separation on the properties of the blue and deep green LEDs was investigated and strong changes in the spectral position and current dependence of the quantum efficiency were revealed. It was shown that formation of the island due to the phase separation allows control position and width of the emission line and maximum in current dependence of the quantum efficiency. Monolithic white LEDs are containing in active region blue and green InGaN QWs grown with applying of the GIs and emitting in spectral range from 440 nm to 560 nm were studied. Monolithic white LEDs having optimal design of active region demonstrate CCT in the range of 9000‐12000 K and maximal external quantum efficiency up to 14 lm/W

Monolithic white LEDs: Approaches, technology, design

International audienceThe results of investigations of monolithic white InGaAlN LEDs with an active region containing several thin InGaN layers, emitting in the range from blue to yellow-green, and separated by short-period InGaN/GaN superlattices, are presented. The influence of the growth conditions and layer sequence in the active region on the optical properties of monolithic white LEDs was studied with the aim of controlling their color parameters

Single quantum well deep-green LEDs with buried InGaN/GaN short-period superlattice

International audienceIn spite of the great progress in III-N technology, LEDs with wavelength >530 nm still exhibit low efficiency compared to blue and short-wavelength-green LEDs. Here we report on significant improvement of deep-green LED properties by modifications of the structure design. The combination of InGaN/GaN superlattice followed by low-temperature GaN is the key element to increase the electroluminescence efficiency for deep-green LED. Various techniques were employed to clarify the correlation between structure properties, growth regimes and design. Modification of the defect structure of the GaN buffer by InGaN layers appears to be mostly responsible for the observed effect. LEDs processed and assembled in a standard flip-chip geometry with Ni–Ag p-contact demonstrate external quantum efficiencies of 8–20% in the 560–530 nm range