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2 research outputs found
Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions
Author
A.D. Roming Jr.
C. Chen
+22Â more
C. L. Yu
C.A. Ma
C.H. Raeder
C.Y. Liu
D.R. Frear
H.K. Kim
H.K. Kim
J.L. Freer Goldstein
J.L. Freer Goldstein
J.L. Freer Goldstein
J.W. Morris Jr.
K.N. Tu
P.T. Vianco
P.T. Vianco
R.L. Fogelson
S. Bader
S. S. Wang
S. Y. Chang
T. H. Chuang
W. Gust
W. Yang
Y.G. Lee
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging
Author
A.D. Roming Jr.
C. M. L. Wu
+29Â more
C.C. Koch
C.C. Koch
C.H. Raeder
C.M. Miller
C.M.L. Wu
D. Frear
D.G. Morris
D.M. Jacobson
D.M. Jacobson
G.B. Schaffer
H.K. Kim
J. Glazer
J. K. L. Lai
J.H. Vincent
J.L. Freer
J.S. Benjamin
J.S. Benjamin
K. Uenishi
M. L. Huang
M. McCormack
M. Schaefer
S. Jin
S.W. Yoon
U.R. Kattner
V.I. Igosher
W. Yang
Y. C. Chan
Y. Kariya
Z. Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref