1 research outputs found
Tape Ball Grid Array
- Author
- 3M M Electronics Products Division
- 3M Specifications and Design GuidelinesMicroflex Circuits for IC Interconnect Solutions
- A Domadia
- Amkor Technology
- C Ernsberger
- CC Huang
- CJ Speerschneider
- CJ Speerschneider
- D Frear
- EIA/JEDEC Standard EIA/JESD22–A112A
- EJ Vardaman
- EN Larson
- F Andros
- F Andros
- F Andros
- G Derman
- H Shaukatullah
- H Shaukatullah
- IBM Microelectronics
- International Technology Roadmap for Semiconductors
- J Ewanich
- J Fjelstad
- J Fjelstad
- J Geissinger
- J Hwang
- JEDEC Standard JESD-30
- Joint Industry Standard IPC/JEDEC J-STD-020
- Joint Industry Standard IPC/JEDEC J-STD-033
- K Gilleo
- K Tatsumi
- K Wachtler
- KT Knadle
- L Yip
- M Bernier
- M Electronics Products Division
- M Karnezos
- M Karnezos
- M Karnezos
- M Karnezos
- M Otsuka
- M Pecht
- P Virpi
- Personal communication with C. Kroger and E. J. Vardaman
- R Crowley
- R Darveaux
- R Darveaux
- R Darveaux
- RC Lasky
- RD Schueller
- RD Schueller
- S Anderson
- S Berry
- S Berry
- SB Sathe
- SHK Lee
- SK Kang
- T Gainey
- T Ohtaka
- T Thompson
- TH Stearns
- The Electronics Industry Report 1997–1998
- TR Lindley
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- 01/01/2001
- Field of study