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    3์กฑ ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด๋ฅผ ์œ„ํ•œ ์ €์˜จ ๋ฒ„ํผ์ธต ์—ฐ๊ตฌ

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    ํ•™์œ„๋…ผ๋ฌธ (๋ฐ•์‚ฌ)-- ์„œ์šธ๋Œ€ํ•™๊ต ๋Œ€ํ•™์› : ์žฌ๋ฃŒ๊ณตํ•™๋ถ€, 2016. 2. ์œค์˜์ค€.3์กฑ ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด๋Š” HEMT ์™€ ๊ฐ™์€ ์ „์ž์†Œ์ž์˜ ์‘์šฉ๊ฐ€๋Šฅ์„ฑ์œผ๋กœ ์ธํ•ด ๋งŽ์€ ์—ฐ๊ตฌ๊ฐ€ ์ง„ํ–‰๋˜์–ด ์˜ค๊ณ  ์žˆ๋‹ค. 3์กฑ ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด๋Š” ๋™์ข… ๊ธฐํŒ ์‚ฌ์šฉ์˜ ํ•œ๊ณ„๋กœ ์ธํ•˜์—ฌ ์ผ๋ฐ˜์ ์œผ๋กœ ์‹ค๋ฆฌ์ฝ˜ ๊ธฐํŒ์ด๋‚˜ ์‚ฌํŒŒ์ด์–ด ๊ธฐํŒ๊ณผ ๊ฐ™์€ ์ด์ข…๊ธฐํŒ์„ ์‚ฌ์šฉํ•˜์—ฌ ์—ํ”ผํ…์…œ ์„ฑ์žฅ์ด ์ด๋ฃจ์–ด ์ง„๋‹ค. ํ•˜์ง€๋งŒ ๊ฐˆ๋ฅจ (Ga) ์›์ž ๋“ฑ์˜ 3์กฑ ์›์†Œ๋“ค์€ ์ด์ข…๊ธฐํŒ ์œ„์—์„œ ์•ˆ์ •์ ์œผ๋กœ ๋ถ™์–ด ์žˆ๊ธฐ ์–ด๋ ต๊ธฐ ๋•Œ๋ฌธ์— ๊ท ์ผํ•œ ๋ฐ•๋ง‰์„ ์–ป๋Š”๋ฐ ํ•œ๊ณ„๊ฐ€ ์žˆ์—ˆ๋‹ค. ๋ฒ„ํผ์ธต (buffer layer)์˜ ๊ฐœ๋ฐœ์€ 3์กฑ ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด์™€ ๊ธฐํŒ ์‚ฌ์ด์˜ ๋ฌผ๋ฆฌ์  ํŠน์„ฑ ์ฐจ์ด๋กœ ๋ฐœ์ƒํ•˜๋Š” ์œ„์™€ ๊ฐ™์€ ๋ฌธ์ œ์ ๋“ค์„ ํ•ด๊ฒฐ ํ•ด์ฃผ์—ˆ๊ณ  ์ด๋กœ ์ธํ•ด 3์กฑ ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด์—์„œ ๊ผญ ํ•„์š”ํ•œ ํ•ต์‹ฌ ๊ธฐ์ˆ ๋กœ ๋„๋ฆฌ ์ด์šฉ ๋˜๊ณ  ์žˆ๋‹ค. ํ•˜์ง€๋งŒ ์—ฌ์ „ํžˆ ๋ˆ„์„ค์ „๋ฅ˜ (leakage current), ๊ธฐํŒ ํœจ (wafer bowing) ๊ทธ๋ฆฌ๊ณ  ์„ฑ์žฅ ํ™˜๊ฒฝ์˜ ์˜ํ–ฅ๊ณผ ๊ฐ™์ด 3์กฑ ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด์˜ ํŠน์„ฑ์„ ์ €ํ•˜ ์‹œํ‚ค๋Š” ๋ฌธ์ œ์ ๋“ค์ด ์กด์žฌ ํ•˜๊ณ  ์žˆ๋‹ค. ๋ณธ ์—ฐ๊ตฌ์—์„œ๋Š” ๊ฐ ๊ธฐํŒ ์œ„์— ์งˆํ™”๋ฌผ ๋ฐ˜๋„์ฒด๋ฅผ ์„ฑ์žฅํ•จ์— ๋”ฐ๋ผ ๋ฐœ์ƒํ•˜๋Š” ๋ฌธ์ œ์ ๋“ค์„ ํ™•์ธ ํ•˜๊ณ , ์ด๋ฅผ ๋ฒ„ํผ์ธต์„ ์ด์šฉํ•ด ํ•ด๊ฒฐ ํ•˜๊ณ ์ž ํ•˜์˜€๋‹ค. ์šฐ์„  ์‹ค๋ฆฌ์ฝ˜ ๊ธฐํŒ ์œ„ GaN์ธต ์„ฑ์žฅ์—์„œ ์ผ๋ฐ˜์ ์œผ๋กœ ์‚ฌ์šฉ ๋˜๋Š” AlN ๋ฒ„ํผ์ธต์˜ ๋ฌธ์ œ์ ์— ๋Œ€ํ•œ ์—ฐ๊ตฌ๋ฅผ ์ง„ํ–‰ํ•˜์˜€๋‹ค. ๋Œ€๊ฐœ AlN ๋ฒ„ํผ์ธต๊ณผ GaN ์ธต์€ ๊ฐ™์€ ์œ ๊ธฐ๊ธˆ์†ํ™”ํ•™๊ธฐ์ƒ์ฆ์ฐฉ (MOCVD) ์žฅ๋น„ ๋‚ด์—์„œ ์„ฑ์žฅ ๋˜๊ธฐ ๋•Œ๋ฌธ์— ๋‚จ์•„ ์žˆ๋Š” ๊ฐˆ๋ฅจ์ด AlN ๋ฒ„ํผ์ธต์— ์˜ํ–ฅ์„ ๋ฏธ์น˜๊ฒŒ ๋œ๋‹ค. ๋ณธ ์—ฐ๊ตฌ๋ฅผ ํ†ตํ•ด ์œ ๊ธฐ๊ธˆ์†ํ™”ํ•™๊ธฐ์ƒ์ฆ์ฐฉ ์žฅ๋น„ ๋‚ด ์— ๋‚จ์•„ ์žˆ๋Š” ๊ทน์†Œ๋Ÿ‰์˜ ๊ฐˆ๋ฅจ์ด AlN ๋ฒ„ํผ์ธต์˜ ํ‘œ๋ฉด์ƒํƒœ์— ์˜ํ–ฅ์„ ๋ผ์น˜๊ณ , ์ด๋กœ ์ธํ•ด ๊ทธ ์œ„์— ์„ฑ์žฅ ๋˜๋Š” GaN ์ธต์˜ ๊ฒฐ์ •์„ฑ ๋ฐ ์‘๋ ฅ์— ๋ถ€์ •์ ์ธ ์˜ํ–ฅ์„ ๋ฏธ์น˜๋Š” ๊ฒƒ์„ ํ™•์ธ ํ•˜์˜€๋‹ค. ์ด๋Š” Si ๊ธฐํŒ ์œ„ GaN๋ฅผ ์„ฑ์žฅ ํ•  ๋•Œ ๋งˆ๋‹ค ๋‹ค๋ฅธ ๊ฒฐ๊ณผ๊ฐ€ ๋‚˜์˜ค๋Š” ๋“ฑ์˜ ์‹ ๋ขฐ์„ฑ ๋ฌธ์ œ๋ฅผ ์•ผ๊ธฐ ์‹œํ‚ค๋ฉฐ, ๊ฐˆ๋ฅจ์˜ ์˜ํ–ฅ์„ ์ตœ์†Œํ™” ํ•˜๋ ค๋ฉด ์žฅ๋น„์˜ ์œ ์ง€ ๋ณด์ˆ˜ ๋“ฑ์— ๋งŽ์€ ๋น„์šฉ๊ณผ ์‹œ๊ฐ„์ด ์š”๊ตฌ ๋˜๊ธฐ ๋•Œ๋ฌธ์— ํ•ด๊ฒฐ์ฑ…์ด ํ•„์š” ํ•˜๋‹ค. ์œ„ ๋ฌธ์ œ๋ฅผ ํ•ด๊ฒฐํ•˜๊ณ ์ž DC ๋งˆ๊ทธํ…ŒํŠธ๋ก  ์Šคํผํ„ฐ๋ง (magnetron sputtering) ์žฅ๋น„๋ฅผ ์ด์šฉํ•˜์—ฌ ์ƒ์˜จ์—์„œ ์ฆ์ฐฉ ํ•œ AlN ๋ฒ„ํผ์ธต์„ ๊ฐœ๋ฐœ ํ•˜์˜€๋‹ค. ์ด ์ƒˆ๋กœ์šด AlN ๋ฒ„ํผ์ธต์€ ์œ ๊ธฐ๊ธˆ์†ํ™”ํ•™๊ธฐ์ƒ์ฆ์ฐฉ ์žฅ๋น„๋กœ ์„ฑ์žฅ ๋˜๋Š” ๊ฒƒ์ด ์•„๋‹ˆ๋ฏ€๋กœ ๊ฐˆ๋ฅจ ์˜ ์˜ํ–ฅ์ด ์—†์„ ๋ฟ๋งŒ ์•„๋‹ˆ๋ผ, ์ƒ์˜จ์—์„œ ์„ฑ์žฅ๋˜๊ธฐ ๋•Œ๋ฌธ์— ์•Œ๋ฃจ๋ฏธ๋Š„ (Al)-์‹ค๋ฆฌ์ฝ˜์˜ ์ƒํ˜ธ ํ™•์‚ฐ์œผ๋กœ ์ธํ•œ ๋ˆ„์„ค์ „๋ฅ˜ ๋ฌธ์ œ๋ฅผ ํ•ด๊ฒฐ ํ•  ์ˆ˜ ์žˆ์„ ๊ฒƒ์œผ๋กœ ๊ธฐ๋Œ€๋œ๋‹ค. DC ๋งˆ๊ทธ๋„คํŠธ๋ก  ์Šคํผํ„ฐ๋ง์„ ์ด์šฉํ•œ ์ƒ์˜จ AlN์ธต์ด ๋ฒ„ํผ์ธต์œผ๋กœ์„œ ์—ญํ•  ํ•  ์ˆ˜ ์žˆ๋„๋ก, ์šฐ๋ฆฌ๋Š” ์‹ค๋ฆฌ์ฝ˜ ๊ธฐํŒ๊ณผ AlN ์ธต ์‚ฌ์ด์— ์•Œ๋ฃจ๋ฏธ๋Š„ ์ธต์„ ๋„ฃ์–ด AlN ์˜ ์—ํ”ผํ…์…œ ์„ฑ์žฅ์ด ๋˜๋„๋ก ๋งŒ๋“ค์—ˆ๋‹ค. ์•Œ๋ฃจ๋ฏธ๋Š„ ๊ณผ AlN ์˜ ๊ฒฉ์ž์ƒ์ˆ˜ ์ฐจ์ด (6~8%)๊ฐ€ ์‹ค๋ฆฌ์ฝ˜ ๊ณผ AlN ์˜ ๊ฒฉ์ž์ƒ์ˆ˜ ์ฐจ์ด (19%) ๋ณด๋‹ค ์ž‘๊ธฐ ๋•Œ๋ฌธ์—, ์•Œ๋ฃจ๋ฏธ๋Š„ ์ธต์˜ ๋„์ž…์ด AlN ๊ฐ€ ์—ํ”ผํ…์…œ ์„ฑ์žฅ์ด ๋˜๊ธฐ ์œ„ํ•œ ํ™œ์„ฑํ™” ์—๋„ˆ์ง€๋ฅผ ๋‚ฎ์ถ”๋Š” ํšจ๊ณผ๋ฅผ ๋งŒ๋“ค์–ด๋ƒˆ๋‹ค. ๋”๋ถˆ์–ด ๋†’์€ DC power๋ฅผ ํ†ตํ•ด ์ถฉ๋ถ„ํ•œ ์šด๋™์—๋„ˆ์ง€๋ฅผ ๊ณต๊ธ‰ ํ•จ์œผ๋กœ์จ ์‹ค๋ฆฌ์ฝ˜ ๊ธฐํŒ ์œ„ AlN ์ธต์˜ ์—ํ”ผํ…์…œ ์„ฑ์žฅ์„ ์ƒ์˜จ์—์„œ ์„ฑ๊ณต ํ•˜์˜€๋‹ค. ์œ ๊ธฐ๊ธˆ์†ํ™”ํ•™๊ธฐ์ƒ์ฆ์ฐฉ ์žฅ๋น„๋ฅผ ์‚ฌ์šฉํ•˜์—ฌ ์œ„ AlN์ธต ์œ„์— GaN ์ธต์„ ์„ฑ์žฅ ํ•œ ๊ฒฐ๊ณผ, ๋‹จ๊ฒฐ์ •์˜ GaN ์ธต์ด ์„ฑ์žฅ ํ•˜๋Š” ๊ฒƒ์„ ํ™•์ธ ํ•˜์˜€๊ณ , ์ด๋Š” ๋ณธ ์—ฐ๊ตฌ์—์„œ ๊ฐœ๋ฐœํ•œ DC ๋งˆ๊ทธ๋„คํŠธ๋ก  ์Šคํผํ„ฐ๋ง์„ ์ด์šฉํ•œ AlN ๋ฒ„ํผ์ธต์ด ํ˜„์žฌ ์—ฌ๋Ÿฌ ๋ฌธ์ œ์ ์„ ๊ฐ€์ง€๊ณ  ์žˆ๋Š” ๊ธฐ์กด์˜ AlN ๋ฒ„ํผ์ธต์„ ๋Œ€์ฒด ํ•  ์ˆ˜ ์žˆ์Œ์„ ๋ณด์—ฌ์ค€๋‹ค. ์ถ”๊ฐ€์ ์ธ ์—ฐ๊ตฌ๋ฅผ ํ†ตํ•ด ์ด ๋ฒ„ํผ์ธต์˜ ํ’ˆ์งˆ ํ–ฅ์ƒ์„ ์œ„ํ•œ ๋ณธ ๊ธฐ์ˆ ์˜ ๊ฐ€๋Šฅ์„ฑ์„ ๋ณด์•˜๋‹ค. ์ถ”๊ฐ€์ ์œผ๋กœ ์‚ฌํŒŒ์ด์–ด ๊ธฐํŒ ์œ„ GaN ์ธต์ด ๊ฐ–๊ณ  ์žˆ๋Š” ๋ˆ„์„ค์ „๋ฅ˜ ๋ฌธ์ œ ๋ฐ ๊ธฐํŒ ํœจ ํ˜„์ƒ์„ ํ•ด๊ฒฐํ•˜๊ธฐ ์œ„ํ•œ ์ƒˆ๋กœ์šด ์ €์˜จ ๋ฒ„ํผ์ธต์„ ๊ฐœ๋ฐœ ํ•˜์˜€๋‹ค. ์ผ๋ฐ˜์ ์œผ๋กœ ์‚ฌํŒŒ์ด์–ด ๊ธฐํŒ ์œ„ ์ €์˜จ GaN ๋ฒ„ํผ์ธต์€ ์ €์˜จ์—์„œ GaN ๋ฒ„ํผ์ธต์„ ์„ฑ์žฅ ํ•œ ํ›„ ์ฃผ GaN ์ธต์„ ์„ฑ์žฅ ํ•˜๊ธฐ ์œ„ํ•ด ๊ณ ์˜จ์œผ๋กœ ์˜ฌ๋ฆฌ๋Š” ๋™์•ˆ ์•”๋ชจ๋‹ˆ์•„ ๊ฐ€์Šค๋งŒ ํ˜๋ ค์ค€๋‹ค. ๋ฐ˜๋ฉด ๋ณธ ์—ฐ๊ตฌ์—์„œ๋Š” GaN ๋ฒ„ํผ์ธต์„ ์ €์˜จ์—์„œ ์„ฑ์žฅ ํ•œ ํ›„์— ๊ณ ์˜จ์œผ๋กœ ์Šน์˜จ ํ•˜๋Š” ๋™์•ˆ ์•”๋ชจ๋‹ˆ์•„ ๊ฐ€์Šค์™€ ํ•จ๊ป˜ TMGa ์†Œ์Šค๋„ ํ•จ๊ป˜ ํ˜๋ ค์ฃผ์—ˆ๋‹ค. ์ด์™€ ๊ฐ™์€ ๋ฐฉ๋ฒ•์œผ๋กœ ์„ฑ์žฅ๋œ GaN ๋ฒ„ํผ์ธต์€ ๋‚˜๋…ธ ์ปฌ๋Ÿผ๋‚˜ (nano-columanr) ๊ตฌ์กฐ๋ฅผ ์œ ์ง€ํ•˜๋ฉด์„œ ๋งŽ์€ ์–‘์˜ ํƒ„์†Œ๋ฅผ ํฌํ•จ ํ•˜๊ณ  ์žˆ๋Š” ๊ฒƒ์„ ํ™•์ธ ํ•˜์˜€์œผ๋ฉฐ, ๊ทธ์— ๋Œ€ํ•œ ์„ฑ์žฅ ๋ฉ”์ปค๋‹ˆ์ฆ˜์„ ๊ทœ๋ช… ํ•˜์˜€๋‹ค. ๊ฒฐ๊ณผ์ ์œผ๋กœ ์ƒˆ๋กœ์šด GaN ๋ฒ„ํผ์ธต์„ ์ ์šฉ ํ•จ์œผ๋กœ์จ ์‚ฌํŒŒ์ด์–ด ๊ธฐํŒ ์œ„ GaN ์ธต์˜ ๊ธฐํŒ ํœจ ํ˜„์ƒ์ด ์™„ํ™” ๋˜์—ˆ์œผ๋ฉฐ, ๊ณ ์ €ํ•ญ ํŠน์„ฑ์„ ๋‚˜ํƒ€๋‚ด์—ˆ๋‹ค. ์ด ๋ฒ„ํผ์ธต์„ ์ ์šฉํ•˜์—ฌ HEMT ์†Œ์ž๋ฅผ ์ œ์ž‘ํ•œ ๊ฒฐ๊ณผ -4 V ์˜ ๊ฒŒ์ดํŠธ ์ „์•• ํ•˜์—์„œ 800 V ์ด์ƒ์˜ off-state ํ•ญ๋ณต์ „์•• (breakdown voltage) ํŠน์„ฑ์„ ๋ณด์˜€์œผ๋ฉฐ ์ด๋Ÿฌํ•œ ๊ฒฐ๊ณผ๋Š” ๋ณธ ์—ฐ๊ตฌ์˜ ์ƒˆ๋กœ์šด ์ €์˜จ GaN ๋ฒ„ํผ์ธต์ด ์‚ฌํŒŒ์ด์–ด ๊ธฐํŒ ์œ„ GaN ์ „์ž์†Œ์ž์— ์ ํ•ฉํ•จ์„ ๋ณด์—ฌ์ค€๋‹ค.The group III-nitride semiconductors with their wide applications in electronic devices such as high electron mobility transistor (HEMT) have attracted much research interest in the past two decades. A major drawback of III-nitride is that native substrates are not yet available in large quantities, so heteroepitaxy using foreign substrates such as Si and sapphire have been widely used. Unfortunately, although both materials have been chosen as substrates for GaN epitaxial growth, the substrates are badly matched to GaN with respect to their lattice constant and thermal expansion coefficient. In addition, when atoms such as Ga are deposited on the substrate, the atoms are very mobile on the plain substrate, so homogeneously wetting on the substrate is difficult. To solve the problems, buffer layer was developed in the growth of GaN layer, resulting in rapid progress in III-nitride growth. Accordingly, the buffer techniques have become critical key issue and determine the properties of III-nitride. However, several problems such as leakage current, wafer bowing and metal-organic chemical vapor deposition (MOCVD) chamber condition still exist, resulting in the degraded properties of electronic device. To overcome these problems, new low temperature buffer layers for each substrate were proposed in this study. The problems in epitaxial growth of GaN on Si substrate, first of all, were investigated when AlN buffer layer, conventional buffer layer for GaN on Si, was grown by same MOCVD system for the GaN growth. We confirmed MOCVD reactor circumstance related with previous GaN growth run, Ga memory effect, is significant for properties of GaN/AlN/Si structure. The small amount of Ga from the Ga memory effect affected the final stress and crystal quality of GaN on Si as well as the surface of AlN buffer layer. To solve the Ga memory effect, we proposed a AlN buffer layer deposited by DC magnetron sputtering at room temperature. The ex-situ buffer layer could be effective solution to avoid growth circumstance problem in MOCVD reactor since the system does not include Ga. Moreover low growth temperature could prevent interdiffusion between Si-Al, leading to leakage path. For epitaxial growth of AlN on Si substrate by DC magnetron sputtering at room temperature, the pre-deposited Al process, deposition of thin Al layer before main AlN deposition, was developed. It was expected that the activation energy for epitaxial growth of AlN on Al interlayer became lower than it on Si substrate, resulting from smaller lattice mismatch between AlN and Al (6~8%) than between AlN and Si (19%). Moreover, the sufficient kinetic energy from the high DC power helped epitaxial growth of AlN even at the room temperature. Also, single crystalline GaN was successfully grown by MOCVD on the AlN buffer layer, which shows the new room temperature AlN buffer layer could be substituted for conventional AlN buffer layer grown at high temperature by MOCVD system. Additionally, new low temperature (LT) GaN buffer layer for GaN on sapphire substrate was proposed to solve problems of the GaN on sapphire which are low resistivity and convex wafer bowing. The LT GaN buffer layer was fabricated as introduction of tri-methylgallium (TMGa) into the reactor together with ammonia during the temperature ramp-up after the growth of a LT GaN buffer layer. We confirmed nano-columnar structure of the buffer layer with high carbon concentration and investigated the growth mechanism. The GaN layer on sapphire with new LT GaN buffer layer revealed the high-resistivity characteristic and reduction of wafer bowing. A HEMT device made on the layer showed a good pinch-off characteristic and high off-state breakdown voltage over 800 V at a gate voltage of -4 V, implying the new LT buffer layer is effective to grow GaN on sapphire for electronic device.Chapter 1. Introduction 1 1.1. III-nitride based devices 1 1.1.1 General properties of III-nitride materials 1 1.1.2 The principal of formation of two-dimensional electron gas in III-nitride semiconductor 3 1.2. Growth of III-nitride film 10 1.2.1 Epitaxial growth of III-nitride 10 1.2.2 The intrinsic stress evolution at the grain boundary in the film 11 1.3. Substrate for III-nitride 18 1.3.1 Si substrate 18 1.3.2 Sapphire substrate 19 1.4. Buffer layer in III-nitride 24 1.4.1 Buffer layer for Si substrate 24 1.4.2 Buffer layer for sapphire substrate 26 1.5. The problems of the buffer layer for HEMT device 32 1.5.1 Electrical problem 32 1.5.2 Stress problem 34 1.5.3 Dislocation problem 35 1.6. Thesis contents and organization 41 1.7. Bibliography 43 Chapter 2. The problem of GaN on Si grown by MOCVD Investigation of Ga memory effect 51 2.1. Introduction 51 2.2. Experimental procedure 53 2.3. The effect of AlN run sequence for GaN on Si substrate 56 2.4. Ga memory effect for AlN buffer layer on Si 68 2.5. Summary 76 2.6. Bibliography 77 Chapter 3. Growth of AlN buffer layer on Si substrate by DC magnetron sputtering at room temperature 81 3.1. Growth of AlN buffer layer with same alignment of out-of-plane 81 3.1.1 Introduction 81 3.1.2 Experimental procedure 83 3.1.3 Results and discussion 85 3.1.4 Summary 96 3.2. Epitaxial growth of single crystalline AlN buffer layer on Si (111) 97 3.2.1 Introduction 97 3.2.2 Experimental procedure 99 3.2.3 Results and discussion 102 3.2.4 Summary 121 3.3. Further study of AlN buffer layer grown by DC magnetron sputtering at room temperature 122 3.3.1 Annealing process for AlN buffer layer 122 3.3.2 Further study on the pre-deposition process 129 3.4. Bibliography 134 Chapter 4. The development of low temperature buffer layer for GaN on sapphire 139 4.1. Introduction 139 4.2. Experimental procedure 142 4.3. Results and discussion 145 4.3.1 Semi-insulating characteristics 145 4.3.2 Characteristic of less bowed GaN and crystal qualities 156 4.4. Investigation of growth mechanism and evaluation of HEMT device 165 4.4.1 Investigation of growth mechanism and new low temperature buffer layer 165 4.4.2 Evaluation of HEMT device 174 4.5. Summary 177 4.6. Bibliography 178 Chapter 5. Conclusion 183 ๊ตญ๋ฌธ์ดˆ๋ก 186 Publication list 190Docto

    Meta-analysis on the Effect of Adventure Education in Korea

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    ์ด ์—ฐ๊ตฌ์˜ ๋ชฉ์ ์€ ๊ทธ๋™์•ˆ ๊ต์œก๊ณ„์˜ ๊ด€์‹ฌ์„ ํฌ๊ฒŒ ๋ฐ›์ง€ ๋ชปํ–ˆ๋˜ ๊ทน๊ธฐ ํ›ˆ๋ จ, ์•ผ์˜, ์ž์—ฐ๊ถŒ ์ˆ˜๋ จํ™œ๋™ ๋“ฑ์„ ๋ชจํ—˜๊ต์œก์ด๋ผ๋Š” ์ƒˆ๋กœ์šด ๊ต์œก ์˜์—ญ์˜ ํ•˜๋‚˜๋กœ ์ธ์‹ํ•˜๋ฉด์„œ ๊ต์œก์ ์œผ๋กœ ํ™œ์šฉํ•˜๊ธฐ ์œ„ํ•œ ๊ฐ€๋Šฅ์„ฑ์„ ๋ชจ์ƒ‰ํ•˜๋Š” ๊ฒƒ์ด๋‹ค. ์ด๋ฅผ ์œ„ํ•ด ์ด 6๊ฐœ์˜ ๋ฐ์ดํ„ฐ๋ฒ ์ด์Šค๋ฅผ ํ†ตํ•ด ์„ ์ •ํ•œ 16ํŽธ์˜ ๊ตญ๋‚ด ๋ชจํ—˜๊ต์œก ๊ด€๋ จ ์—ฐ๊ตฌ๋ฌผ์„ ๋ฉ”ํƒ€๋ถ„์„ํ•˜์—ฌ, ์ „์ฒด ํšจ๊ณผํฌ๊ธฐ๋กœ ํ‘œ์ค€ํ™”๋œ ํ‰๊ท  ์ฐจ๋ฅผ ์‚ฐ์ถœํ•˜์˜€๋‹ค. ๋™์งˆ์„ฑ ๊ฒ€์ • ๊ฒฐ๊ณผ๊ฐ€ ํ†ต๊ณ„์ ์œผ๋กœ ์œ ์˜๋ฏธํ•˜์—ฌ ๋žœ๋คํšจ๊ณผ ๋ชจํ˜•์„ ์‚ฌ์šฉํ•ด ๋ฉ”ํƒ€๋ถ„์„์„ ์ง„ํ–‰ํ•˜์˜€๋‹ค. ๋ฉ”ํƒ€๋ถ„์„ ๊ฒฐ๊ณผ, ๊ตญ๋‚ด ๋ชจํ—˜๊ต์œก์˜ ์ „์ฒด ํšจ๊ณผํฌ๊ธฐ๋Š” 0.335์˜€๋‹ค. ์ด๋Š” ์ค‘๊ฐ„๋ณด๋‹ค ์กฐ๊ธˆ ์ž‘์€ ํฌ๊ธฐ์˜ ํšจ๊ณผ๋กœ ๊ต์œก์ ์œผ๋กœ ์œ ์˜๋ฏธํ•œ ์ˆ˜์ค€์ด์—ˆ๋‹ค. ๊ตญ๋‚ด ๋ชจํ—˜๊ต์œก ์˜์—ญ์˜ ์—ฐ๊ตฌ๋“ค์ด ๋ณด๊ณ ํ•œ ํšจ๊ณผ์˜ ์ข…๋ฅ˜๋Š” 100์—ฌ ๊ฐ€์ง€๊ฐ€ ๋„˜์–ด์„œ ์ด๋“ค์„ ์ด 5๊ฐ€์ง€์˜ ์ธ์ง€์ , ์ •์˜์ , ์‚ฌํšŒ์ , ๋ณตํ•ฉ์ , ์‹ ์ฒด์  ์˜์—ญ์œผ๋กœ ๋ถ„๋ฅ˜ํ•˜์—ฌ ์˜์—ญ๋ณ„ ํšจ๊ณผํฌ๊ธฐ๋ฅผ ์‚ฐ์ถœํ•˜์˜€๋‹ค. ๊ทธ ๊ฒฐ๊ณผ, ๋ณตํ•ฉ์  ํŠน์„ฑ ์˜์—ญ์—์„œ ๊ฐ€์žฅ ํšจ๊ณผ๊ฐ€ ์ปธ์œผ๋ฉฐ ๋‹ค์Œ์œผ๋กœ๋Š” ์ •์˜์  ํŠน์„ฑ ์˜์—ญ์ด์—ˆ๋‹ค. ์ด๋“ค ์˜์—ญ์—์„œ์˜ ๋ชจํ—˜๊ต์œก์˜ ํšจ๊ณผ๋Š” ๊ต์œก์ ์œผ๋กœ ์œ ์˜๋ฏธํ•œ ์ˆ˜์ค€์ด์—ˆ๋‹ค. ๊ตญ๋‚ด์™€ ๊ตญ์™ธ์˜ ๋ชจํ—˜๊ต์œก์„ ๋น„๊ตํ•˜์—ฌ ๊ตญ๋‚ด ๋ชจํ—˜๊ต์œก ๋ถ„์•ผ์˜ ํšจ๊ณผ๋ฅผ ๋†’์ด๊ธฐ ์œ„ํ•œ ์‹œ์‚ฌ์ ์„ ๋„์ถœํ•˜์˜€๋‹ค.The purpose of this study was to search the possibility of adventure education in Korea. This meta-analysis analyzed 16 studies and calculated the standardized mean difference in effect size. As the result of homogeneity test, random-effects model was chosen. The overall effect size(d) of adventure education was positive with 0.335, which means a little lower than moderate. It was educationally significant. The studies in the area of adventure education reported over 100 kinds of effect variables. This study assorted them into cognitive, emotional, social, complex, and physical domains and calculated each effect size. As the result of comparing those domains, complex domain had the biggest effect size and next was emotional domain. They were educationally significant. By the comparison of Korean and abroad adventure education, this study suggested how to develop Korean adventure education

    A Meta-Analysis of the Effects of School Violence Prevention Programs in Korea

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    This study purports to evaluate the effectiveness of school violence prevention programs and to identify the success factors of these programs. To search for the previous studies, we searched through web databases including keris, nanet, kiss, dapia, the Korean Psychology Association, etc., using as key words school violence, aggressiveness, bullying, delinquency, perpetrators, victims, prevention, and effect size. We selected a total of 23 publications including journal articles, theses, and dissertations which employed a pretest-posttest control group design and standardized measurement tools. A total of 96 effect size values were calculated by using the CMA(Comprehensive Meta Analysis) V2 program. The results show that the total program effect size value based on the random effect model was high. The analysis of effect sizes as to program characteristics reveal that the effect size values for intensive awareness-evoking programs were significantly higher than those for programs which attempted to indirectly intervene the participants psychological traits. Such program strategies were associated with not only a reduction in violent behavior but also enhanced social-emotional skills. It was also shown that as the total number of sessions increased, the effect size values became significantly higher. Small group activities focused on high school students had a larger effect size value. Based on the findings, implications for future research and program implementation were discussed.์ด ์—ฐ๊ตฌ๋Š” ๋ฉ”ํƒ€๋ถ„์„ ๊ธฐ๋ฒ•์„ ํ™œ์šฉํ•˜์—ฌ ํ•™๊ตํญ๋ ฅ ์˜ˆ๋ฐฉ ํ”„๋กœ๊ทธ๋žจ์˜ ํšจ๊ณผ์„ฑ์„ ์ข…ํ•ฉ์ ์œผ๋กœ ํ‰๊ฐ€ํ•˜๊ณ ์ž ํ•˜์˜€๋‹ค. ์„ ํ–‰์—ฐ๊ตฌ๋“ค์„ ๊ฒ€์ƒ‰ํ•˜๊ธฐ ์œ„ํ•˜์—ฌ ํ•™์ˆ ์—ฐ๊ตฌ์ •๋ณด์„œ๋น„์Šค, ๊ตญํšŒ๋„์„œ๊ด€, ๊ตญ๋ฆฝ์ค‘์•™๋„์„œ๊ด€, ํ•œ๊ตญ์‹ฌ๋ฆฌํ•™ํšŒ ๋ฐ์ดํ„ฐ๋ฒ ์ด์Šค์—์„œ ํ•™๊ตํญ๋ ฅ, ๊ณต๊ฒฉ์„ฑ, ๊ดด๋กญํž˜, ์™•๋”ฐ, ๋น„ํ–‰, ๊ฐ€ํ•ด์ž, ํ”ผํ•ด์ž, ์˜ˆ๋ฐฉ, ํšจ๊ณผํฌ๊ธฐ ๋“ฑ์„ ํ‚ค์›Œ๋“œ๋กœ ํ•˜์—ฌ ์ž๋ฃŒ๋ฅผ ๊ฒ€์ƒ‰ํ•˜์˜€๊ณ , ๊ฒ€์ƒ‰๋œ ์ž๋ฃŒ ์ค‘์—์„œ ์‹คํ—˜์ง‘๋‹จ, ํ†ต์ œ์ง‘๋‹จ์„ ์„ค์ •ํ•œ ์‹คํ—˜์—ฐ๊ตฌ์™€ ํ‘œ์ค€ํ™”๋œ ์ธก์ •๋„๊ตฌ๋ฅผ ์‚ฌ์šฉํ•œ ๋…ผ๋ฌธ์„ ๊ธฐ์ค€์œผ๋กœ ์ด 23ํŽธ์˜ ๋…ผ๋ฌธ์„ ์„ ์ •ํ•˜์˜€๋‹ค. ์ด๋“ค ๋…ผ๋ฌธ์—์„œ ์ถ”์ถœํ•œ ์ด 96๊ฐœ์˜ ํšจ๊ณผํฌ๊ธฐ ๊ฐ’์€ ๋ฉ”ํƒ€๋ถ„์„ ์ „๋ฌธ ํ”„๋กœ๊ทธ๋žจ์ธ CMA(Comprehensive Meta Analysis) V2๋ฅผ ์ด์šฉํ•˜์—ฌ ๋ถ„์„ํ•˜์˜€๋‹ค. ๋ถ„์„๊ฒฐ๊ณผ, ๋žœ๋คํšจ๊ณผ๋ฅผ ์ด์šฉํ•œ ์ „์ฒด ํ”„๋กœ๊ทธ๋žจ์˜ ํšจ๊ณผํฌ๊ธฐ ๊ฐ’์ด ํฐ ๊ฒƒ์œผ๋กœ ๋‚˜ํƒ€๋‚ฌ๋‹ค. ํ”„๋กœ๊ทธ๋žจ ์œ ํ˜•์— ๋”ฐ๋ฅธ ํšจ๊ณผํฌ๊ธฐ ๊ฐ’์„ ๋น„๊ตํ•œ ๊ฒฐ๊ณผ, ํ•™๊ตํญ๋ ฅ์— ๋Œ€ํ•œ ๋ฌธ์ œ์ œ๊ธฐ๋ฅผ ํ†ตํ•ด ํญ๋ ฅ์— ๋Œ€ํ•œ ์ธ์‹๊ณผ ํƒœ๋„ ๋ณ€ํ™”๋ฅผ ์ง์ ‘์ ์œผ๋กœ ๋„๋ชจํ•˜๋Š” ์ง์ ‘๊ต์ˆ˜ ๋ฐ ์ฒดํ—˜๋ฐฉ์‹์ด ์‹ฌ๋ฆฌ์  ์š”์ธ์— ๊ฐ„์ ‘์ ์œผ๋กœ ๊ฐœ์ž…ํ•˜๋Š” ๋ฐฉ์‹๋ณด๋‹ค ํšจ๊ณผํฌ๊ธฐ๊ฐ€ ์œ ์˜ํ•˜๊ฒŒ ํฐ ๊ฒƒ์œผ๋กœ ๋‚˜ํƒ€๋‚ฌ๋‹ค. ์ด๋Ÿฌํ•œ ํ”„๋กœ๊ทธ๋žจ ํšจ๊ณผ๋Š” ๊ณต๊ฒฉ์  ํ–‰๋™์ด๋‚˜ ์‹ค์ œ ํญ๋ ฅ์˜ ๊ฐ์†Œ๋ฟ๋งŒ ์•„๋‹ˆ๋ผ ์‚ฌํšŒ์  ๊ธฐ์ˆ , ์ •์„œ ๊ฐœ์„  ์ธก๋ฉด์—์„œ๋„ ๋‚˜ํƒ€๋‚ฌ๋‹ค. ๋˜ํ•œ ๋Œ€์ƒ์—ฐ๋ น์ด ๊ณ ๋“ฑํ•™์ƒ์ผ ๋•Œ, ํ”„๋กœ๊ทธ๋žจ ์‹ค์‹œ ํšŒ๊ธฐ์ˆ˜๊ฐ€ ์ฆ๊ฐ€ํ• ์ˆ˜๋ก, ๋Œ€์ง‘๋‹จ๋ณด๋‹ค๋Š” ์†Œ์ง‘๋‹จ ํ™œ๋™์—์„œ ํšจ๊ณผํฌ๊ธฐ๊ฐ€ ์œ ์˜ํ•˜๊ฒŒ ํฐ ๊ฒƒ์œผ๋กœ ๋‚˜ํƒ€๋‚ฌ๋‹ค. ์—ฐ๊ตฌ๊ฒฐ๊ณผ์— ๊ธฐ์ดˆํ•˜์—ฌ, ํ›„์†์—ฐ๊ตฌ์™€ ํ”„๋กœ๊ทธ๋žจ ์šด์˜์— ๋Œ€ํ•œ ์‹œ์‚ฌ์ ์ด ๋…ผ์˜๋˜์—ˆ๋‹ค
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