Adhesive composition for connection of electronic parts containing radical trap component

라디칼 트랩 성분을 함유하는 전자부품 접속용 접착조성물이 제공된다. 본 발명에 따른 전자부품 접속용 접착조성물은 열가소성 수지, 열경화성 수지 및 경화제를 포함하는 전자부품 접속용 접착조성물로, 상기 경화제는 상기 열경화성 수지의 경화를 개시하기 위한 라디칼을 발생시키며, 상기 조성물은 상기 라디칼을 소모시키기 위한 라디칼 트랩 성분을 더 포함하는 것을 특징으로 하며, 본 발명에 따른 전자부품 접속용 접착조성물은 라디칼에 의하여 중합되는 열경화성 수지와 라디칼 트랩성분을 동시에 갖는다. 상기 첨가되는 라디칼 트랩 성분은 보관 도중 발생하는 라디칼과 결합하여, 라디칼을 소모시키나, 열접착 과정에서 다량 발생하는 라디칼은 전량 소모시키기 어려운 수준으로 첨가된다. 이에 따라, 열접착 공정 온도 미만에서는 접착조성물의 경화가 진행되지 않으므로, 접착조성물의 안정된 보관이 가능하다. 반면, 접착 공정이 진행되는 온도에서는 상기 접착조성물 내에서 발생하는 라디칼에 의하여 경화가 진행되어, 전자부품을 효과적으로 접속시킬 수 있으므로, 저온의 접착공정이 가능하다

고활성, 고입체규칙성 촉매에 의한 슬러리상 및 기상 프로필렌 중합의 비교연구

A comparative study has been made for propylene polymerization in gas phase and slurry phase reactors using a new MgCl2-supported TiCl4 catalyst prepared by the reaction of Mg(OEt)2 with Ti(OBu)4, phthalic anhydride, and TiCl4. The experimental results obtained from polymerizations combined with AlEt3/phenyltriethoxy silane (PTES) showed that the rate of polymerization was lower for gas phase than for slurry phase within an experimental temperature range (25-60℃), even if rate-time profiles obeyed first-order deactivation for both cases except the gas phase polymerization at 60℃. The change of polymerization rate according to the variation of polymerization medium could be confirmed by a specially designed polymerization. The apparent activation energy of slurry phase polymerization (10.3 kcal/mol over a temperature of 25-60℃) was much larger than that of gas phase (4.3 kcal/mol over a temperature range of 25-50℃), and the differences could be explained by referring the formation process of polymerization centers. The change of isotacticity(II) of polymer was negligible without regard to the process and temperature of polymerization compared with the large differences of activity

모노 및 디에스테르 루이스염기를 함유한 고활성 촉매에 의한 에틸렌 중합: 활성점 농도의 측정

The concentration of active sites (C*) for the polymerization of propylene has been compared with that for the polymerization of ethylene using highly active Mg(OEt)2/benzoyl chloride(PhCOCl)/TiCl4 catalysts (containing monoester) or MgCl2/butanol/phthaloyl chloride [Ph(COCl)2]/TiCl4 catalyst (containing diester) activated with AlEt3. The method used to measure a concentration of active sites is based on the inhibiting effect of carbon monoxide on polymerization. Depending on the strength of interaction between catalytic species and internal Lewis base anchored onto catalyst matrix, there was much difference between the C*-values for propylene polymerization and those for ethylene polymerization. While the C*-values for propylene polymerization measured at the maximum polymerization rate (Rp.m) were in the range between 0.17 and 0.33 mol/mol Ti, the C*-values for ethylene polymerization were in the range between 0.28 and 0.45 mol/mol Ti. In order to investigate the stability of active sites during polymerization the C* values have been compared at various polymerization times of determination. The C*-values were constant or increased for ethylene polymerizations, which was completely different trend for propylene polymerizations

Kinetics of Ethylene Polymerization by Coprecipitated TiCl4/MgCl2THF Catalyst

High activity ethylene polymerization catalysts have been prepared by the reaction of magnesium chloride with titanium tetrachloride in tetrahydrofuran. followed by precipitation with excess n-hexane. The physical properties of catalyst such as surface area and titanium content were measured by BET method and redox titration, respectively. These catalysts were tested with ethylene polymerization reaction in the presence of AlEt3 in the slurry reactor. The activities of prepared catalysts were more than 100kg PE/g·Ti·hr. Kinetic study of ethylene polymerization was performed by varying catalyst concentrations, monomer concentrations, the Al/Ti ratios, polymerization temperatures and hydrogen pressures. The overall polymerization rate was found to be first order with respect to the monomer concentration and the number of active sites. The decay rate of active sites was found to be first order with respect to time. The activation energies of propagation and the decay reaction of active sites were found to be 5.73 and 4.00 kcal/mol, respectively

Ultraprecision surface measurement algorithm based on phase measuring interferometry

학위논문(석사) - 한국과학기술원 : 생산공학과, 1991.2, [ [ii], 55 p. ]한국과학기술원 : 생산공학과

고활성 지글러-나타 촉매에 의한 올레핀 중합반응의 연구

학위논문(박사) - 한국과학기술원 : 화학공학과, 1990.2, [ xvi, 309 p. ]Olefin polymerizations were carried out under high pressure and atmospheric pressure slurry reactors using three types of Ziegler-Natta catalysts synthesized by different operational methods. The first type of catalyst to study ethylene polymerization was prepared by anchoring $TiCl_4$/THF/$MgCl_2$ solvate complex onto the inert $SiO_2$. A plausible mechanism for the reaction between the solvate complexes and hydroxyl groups in silica gel was postulated. Ethylene polymerization were then carried out in a semi-batch, constant pressure slurry reactor. The pressure and temperature employed in this study were similar to those employed in industrial practice. Kinetic investigations were carried out on the effect of polymerization conditions and nature of aluminum alkyl cocatalyst on the morphology (size, shape, density, and texture) of nascent polyethylene synthesized with the catalyst. Depending on the nature of cocatalyst, considerably different kinetic profiles were obtained. Fibrillar, globular, cobweb, ribbon-like, worm-like, and lamellar structures were obtained depending upon the catalyst system and polymerization conditions. The effect of polymerization of nascent polyethylene was also investigated. Replication phenomenon was observed depending on the catalyst yield and polymerization time. Generally, the average particle size of polymer particles became larger as the rate of polymerization increased. Polymerization of ethylene and copolymerization of ethylene with 1-hexene were performed by using a second type of catalyst prepared by coprecipitation method. The catalyst system is composed of $TiCl_4$/THF/$MgCl_2$ bimetallic complex. In order to look into the role of magnesium compound in the catalyst, various catalysts with different Mg content (Mg/Ti=0.42-16.5) were characterized by means of elemental analysis, FTIR, x-ray powder diffraction, and SEM techniques. The catalyst activity increased linearly with respect to the Mg/Ti ratio of catalyst t...한국과학기술원 : 화학공학과

비스무드-몰리브데이트 촉매들에 의한 이소부틸렌의 기상공기 산화에 관한 연구

학위논문(석사) - 한국과학기술원 : 화학공학과, 1984.2, [ [v], 103, [1] p. ]The vapor-phase air oxidation of isobutylene to methacrolein over bismuth molybdate catalysts were investigated in an isothermal integral flow reactor at atmospheric pressure between 300 and 600℃. Various bismuth molybdates were characterized by X-ray diffraction, in spectra, and DTA analysis as α-, β-, γ-bismuth molybdate. With these defined catalysts activity test was carried out. γ-Bismuth molybdate had the highest activity for the oxidation of isobutylene of the three catalysts. Then, for the study of kinetics of oxidation of isobutylene over γ-bismuth molybdate catalyst the effects of several variables, feed ratio of oxygen to isobutylene, reaction temperature and the reciprocal of space velocity on the conversion and product distribution were determined by gas chromatography. Through 13 different mechanisms were postulated, the rate of reaction was most satisfactorily correlated by a mechanism which assumes the rate-controlling step to be the surface reaction between charged adsorbed isobutylene and oxygen. The rate expression $$γ= \frac{K_SK_AP_A}{1+K_AP_A+K_RP_R}×\frac{K_BP_B}{1+K_BP_B}$$ fitted the data best. And derived rate and adsorption coefficients satisfy the Boudart criteria.한국과학기술원 : 화학공학과

Fabrication Method of Wafer-Level Flip Chip Package Using ACF/NCF Solution

본 발명은 웨이퍼 레벨의 패키지에 관한 기술로, 상세하게는 절연 고분자 수지, 경화제 및 유기용매를 포함하는 혼합물 용액을 비솔더 범프가 형성된 웨이퍼 상에 도포한 후, 건조하여 웨이퍼상 도포된 혼합물 용액을 반경화 상태(B-stage) 초기로 만드는 단계, 상기 건조된 웨이퍼를 개별칩으로 다이싱하는 단계 및 상기 개별칩으로 다이싱된 반도체칩을 기판의 전극과 정렬한 후, 열과 압력을 가하여 플립칩 접속하는 단계로 제조되는 특징이 있다.본 발명은 이방성 전도 접착제 필름 또는 비 전도성 접착제 필름의 조성을 갖는 물질을 용액 상태로 직접 웨이퍼 상에 코팅하여 이용하므로, 이방성 전도 접착제 필름 또는 비전도성 접착제 필름을 웨이퍼 위에 라미네이션하고 이형지를 제거하는 공정이 필요치 않아 높은 생산성을 가지고 그 공정이 단순하며, 필름이 아닌 용액상태로 코팅을 하므로 평탄하지 않은 웨이퍼 표면에서 발생하기 쉬운 쉐도우 효과를 효과적으로 억제할 수 있으며, 이방성 전도 접착제 페이스트 또는 비전도성 접착제 페이스트에서는 어려운 코팅의 두께 조절이 용이한 장점이 있으며, 유기용매를 휘발시키는 단순 건조를 통해 경화의 잠재성을 잃지 않는 수준의 반경화 초기 상태를 얻을 수 있는 장점이 있다

NON-CONDUCTIVE POLYMER ADHESIVE MATERIAL FOR PACKAGING OF DEVICE AND FILM USING THE SAME

본 발명은, 플립칩(flip chip) 방식의 전자 패키징을 위한 접착제에 관한 것으로서, 열경화성 수지, 열가소성 수지, 잠재성경화제, 및 산발생제(TAG)를 포함하며, 전자 패키징 시 전자소자의 전극 상단에 형성된 금속솔더의 산화층을 제거시키는 전자 패키징용 비전도 폴리머 접합물질에 관한 것이다