27 research outputs found

    ๆจกๆ“ฌ ็™ผ็”Ÿ๋œ ๆณขๆตช์— ์˜ํ•œ ๆตทๅบ•ๅœฐ็›ค์˜ ๆ‡‰ๅŠ›่ฎŠๅŒ–์— ้—œํ•œ ๅฏฆ้ฉ—็š„ ็ก็ฉถ

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    ํ•™์œ„๋…ผ๋ฌธ(์„์‚ฌ)--์„œ์šธๅคงๅญธๆ ก ๅคงๅญธ้™ข :่พฒๅทฅๅญธ็ง‘ ่พฒๆฅญๅœŸๆœจๅฐˆๆ”ป,1995.Maste

    ์‘๋ ฅ์žฅ์ด ์กด์žฌํ•˜๋Š” ๋ฐ•๋ง‰ ํ‘œ๋ฉด์˜ ํ˜•ํƒœ ๋ณ€ํ™”๋ฅผ ์œ„ํ•œ ์—ฐ์†์ฒด ๋ชจ๋ธ

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    ํ•™์œ„๋…ผ๋ฌธ(์„์‚ฌ)--์„œ์šธ๋Œ€ํ•™๊ต ๋Œ€ํ•™์› :์žฌ๋ฃŒ๊ณตํ•™๋ถ€,2003.Maste

    ๋งˆ์ดํฌ๋กœ ๊ตฌ์กฐ ํ‘œ๋ฉด์—์„œ์˜ ์ตœ์†Œ๋ง‰๋น„๋“ฑ ์˜จ๋„ ์ฆ์ง„: ์‹คํ—˜ ๋ฐ ํ•ด์„

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    DoctorWe investigated the minimum film-boiling temperature, TMFB, on microstructured surfaces using a quenching experiment conducted in saturation temperature water at atmospheric pressure. Firstly, two microstructured quench spheres, Brass and SUS316L (d = 10 mm), were prepared using a chemical etching and anodic oxidation method: Microstructured Surface in Brass (MS_Brass) and MS_SUS316L. Secondly, three types of CuO surface structured quench spheres (MS_CuO, Nanostructured Surface NS_CuO and Micro/Nanostructured Surface MNS_Brass/CuO) on brass (d = 15 mm), were prepared using a chemical etching and electrochemical deposition (ECD) method. Especially, a periodic CuO microstructure is obtained using ECD of 1 ยตm diameter particles forming unit-cell porous cones of average height L = 100 ยตm and base diameter D = 20 ยตm in MS_CuO. Surface parameters, including the contact angle, L, D, and chemical composition, were measured. TMFB increased only at MS_SUS316L, but not on MS_Brass. Also, significant increase in TMFB (> 600oC) is achieved with MS_CuO. These results attributed to local cooling (fin effect) by the microstructure causing liquidโ€“solid contact. The increase in TMFB was affected by the surface microstructures, and was determined by characteristic variables of microstructure: thermal conductivity k, L, D and its shape. Based on fin theory, we analyzed that the dimensionless temperature difference ฮธ* of microstructure depends on the hybrid Biot number, Bih = (mL)2 = hL2/(kD). Fin analysis predicts the cone tip cooling to the homogeneous nucleation temperature of water (~ 330oC), while the base temperature is at 600oC in MS_CuO: Bih = 3.6 with h = 800 W/(m2-K), L = 100 ยตm, D = 20 ยตm and = 0.5 W/(m-K). This causes liquidโ€“solid contact during quenching and analysis suggests the fin effective thermal conductivity and geometric ratio L2/D are key to this liquidโ€“solid contact. By including the temperature difference between the fin-base and the fin-tip in the model suggested by K.J. Baumeister and F.F. Simon (1973), we develop a model of TMFB on microstructured surfaces. This approach improves our understanding of the effects of microstructured surfaces in liquid-solid contact during quenching, and may contribute to the development of advanced high temperature cooling systems
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