27 research outputs found
ๆจกๆฌ ็ผ็๋ ๆณขๆตช์ ์ํ ๆตทๅบๅฐ็ค์ ๆๅ่ฎๅ์ ้ํ ๅฏฆ้ฉ็ ็ก็ฉถ
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ผ๋ฌธ(์์ฌ)--์์ธๅคงๅญธๆ ก ๅคงๅญธ้ข :่พฒๅทฅๅญธ็ง ่พฒๆฅญๅๆจๅฐๆป,1995.Maste
์๋ ฅ์ฅ์ด ์กด์ฌํ๋ ๋ฐ๋ง ํ๋ฉด์ ํํ ๋ณํ๋ฅผ ์ํ ์ฐ์์ฒด ๋ชจ๋ธ
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ผ๋ฌธ(์์ฌ)--์์ธ๋ํ๊ต ๋ํ์ :์ฌ๋ฃ๊ณตํ๋ถ,2003.Maste
๋ง์ดํฌ๋ก ๊ตฌ์กฐ ํ๋ฉด์์์ ์ต์๋ง๋น๋ฑ ์จ๋ ์ฆ์ง: ์คํ ๋ฐ ํด์
DoctorWe investigated the minimum film-boiling temperature, TMFB, on microstructured surfaces using a quenching experiment conducted in saturation temperature water at atmospheric pressure. Firstly, two microstructured quench spheres, Brass and SUS316L (d = 10 mm), were prepared using a chemical etching and anodic oxidation method: Microstructured Surface in Brass (MS_Brass) and MS_SUS316L. Secondly, three types of CuO surface structured quench spheres (MS_CuO, Nanostructured Surface NS_CuO and Micro/Nanostructured Surface MNS_Brass/CuO) on brass (d = 15 mm), were prepared using a chemical etching and electrochemical deposition (ECD) method. Especially, a periodic CuO microstructure is obtained using ECD of 1 ยตm diameter particles forming unit-cell porous cones of average height L = 100 ยตm and base diameter D = 20 ยตm in MS_CuO. Surface parameters, including the contact angle, L, D, and chemical composition, were measured. TMFB increased only at MS_SUS316L, but not on MS_Brass. Also, significant increase in TMFB (> 600oC) is achieved with MS_CuO. These results attributed to local cooling (fin effect) by the microstructure causing liquidโsolid contact. The increase in TMFB was affected by the surface microstructures, and was determined by characteristic variables of microstructure: thermal conductivity k, L, D and its shape. Based on fin theory, we analyzed that the dimensionless temperature difference ฮธ* of microstructure depends on the hybrid Biot number, Bih = (mL)2 = hL2/(kD). Fin analysis predicts the cone tip cooling to the homogeneous nucleation temperature of water (~ 330oC), while the base temperature is at 600oC in MS_CuO: Bih = 3.6 with h = 800 W/(m2-K), L = 100 ยตm, D = 20 ยตm and = 0.5 W/(m-K). This causes liquidโsolid contact during quenching and analysis suggests the fin effective thermal conductivity and geometric ratio L2/D are key to this liquidโsolid contact. By including the temperature difference between the fin-base and the fin-tip in the model suggested by K.J. Baumeister and F.F. Simon (1973), we develop a model of TMFB on microstructured surfaces. This approach improves our understanding of the effects of microstructured surfaces in liquid-solid contact during quenching, and may contribute to the development of advanced high temperature cooling systems
A Ten-year Strategic Cooperative Partnership between Korea and China: Rosy Rhetoric and Grim Reality
์น-์์์ฑ ํ๋ฉด์์์ ๋ผ์ด๋ดํ๋ก์คํธ (Leidenfrost) ๊ธฐ์์ ๋ํ ์คํ์ ์ฐ๊ตฌ
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