玻纤增强尼龙6复合材料界面微观力学行为仿真研究

本文基于双线性内聚力模型，采用Abaqus对玻纤增强尼龙6复合材料的纤维推出过程进行计算机仿真研究，成功计算了玻纤与尼龙6的界面强度，并利用纳米压痕试验进行验证．结果表明，仿真模型可以较好地模拟真实测试过程，样品的初始弯曲变形是测试结果与理论计算值存在差异的主要原因．单纤维推出过程的有限元模拟及试验为理解复合材料的界面性能提供了有效的方法，也为复合材料跨尺度失效准则及其损伤演化的研究提供微观力学模型. Based on the bilinear cohesion model, this paper employed Abaqus to conduct a computer simulation study on the fiber push-out process of glass fiber reinforced nylon 6 composite material. The interface strength between glass fiber and nylon 6 was successfully calculated, and the results were verified using the nanoindentation test. The simulation results were in good agreement with the test results. The initial bending deformation of the sample was the main reason for the difference between the experimental and the theoretical results. The finite element simulation and experiment of the single fiber push-out process test provide effective approaches for understanding the interface properties of composite materials, and also provide a micromechanical model for the study of the trans-scale failure criteria and damage evolution of the composite material. © 2022, Editorial Office of Chinese Quarterly of Mechanic. All rights reserved

基于硫化物表面处理的InP/GaAs低温晶片键合

提出一种新的基于硫化物表面处理的InP/GaAs低温晶片键合技术.在360℃的退火温度下,获得了1.2MPa的键合强度.基于这种低温键合技术,可将外延生长在InP衬底上的In0.53Ga0.47As/InP多量子阱(MQW)键合并转移到GaAs衬底上.X射线衍射表明量子阱的结构未受键合过程的影响.光致发光谱分析表明键合后量子阱的晶体质量略有改善.电流电压特性的测试表明n-InP/n-InP的键合界面具有良好的导电特性;在n-InP/n-GaAs 的键合界面存在着电荷势垒,这主要是由于键合界面存在GaAs氧化物薄层所致