281 research outputs found

    Throughput-driven floorplanning with wire pipelining

    Get PDF
    The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

    High Voltage and Nanoscale CMOS Integrated Circuits for Particle Physics and Quantum Computing

    Get PDF

    Physical Design Methodologies for Low Power and Reliable 3D ICs

    Get PDF
    As the semiconductor industry struggles to maintain its momentum down the path following the Moore's Law, three dimensional integrated circuit (3D IC) technology has emerged as a promising solution to achieve higher integration density, better performance, and lower power consumption. However, despite its significant improvement in electrical performance, 3D IC presents several serious physical design challenges. In this dissertation, we investigate physical design methodologies for 3D ICs with primary focus on two areas: low power 3D clock tree design, and reliability degradation modeling and management. Clock trees are essential parts for digital system which dissipate a large amount of power due to high capacitive loads. The majority of existing 3D clock tree designs focus on minimizing the total wire length, which produces sub-optimal results for power optimization. In this dissertation, we formulate a 3D clock tree design flow which directly optimizes for clock power. Besides, we also investigate the design methodology for clock gating a 3D clock tree, which uses shutdown gates to selectively turn off unnecessary clock activities. Different from the common assumption in 2D ICs that shutdown gates are cheap thus can be applied at every clock node, shutdown gates in 3D ICs introduce additional control TSVs, which compete with clock TSVs for placement resources. We explore the design methodologies to produce the optimal allocation and placement for clock and control TSVs so that the clock power is minimized. We show that the proposed synthesis flow saves significant clock power while accounting for available TSV placement area. Vertical integration also brings new reliability challenges including TSV's electromigration (EM) and several other reliability loss mechanisms caused by TSV-induced stress. These reliability loss models involve complex inter-dependencies between electrical and thermal conditions, which have not been investigated in the past. In this dissertation we set up an electrical/thermal/reliability co-simulation framework to capture the transient of reliability loss in 3D ICs. We further derive and validate an analytical reliability objective function that can be integrated into the 3D placement design flow. The reliability aware placement scheme enables co-design and co-optimization of both the electrical and reliability property, thus improves both the circuit's performance and its lifetime. Our electrical/reliability co-design scheme avoids unnecessary design cycles or application of ad-hoc fixes that lead to sub-optimal performance. Vertical integration also enables stacking DRAM on top of CPU, providing high bandwidth and short latency. However, non-uniform voltage fluctuation and local thermal hotspot in CPU layers are coupled into DRAM layers, causing a non-uniform bit-cell leakage (thereby bit flip) distribution. We propose a performance-power-resilience simulation framework to capture DRAM soft error in 3D multi-core CPU systems. In addition, a dynamic resilience management (DRM) scheme is investigated, which adaptively tunes CPU's operating points to adjust DRAM's voltage noise and thermal condition during runtime. The DRM uses dynamic frequency scaling to achieve a resilience borrow-in strategy, which effectively enhances DRAM's resilience without sacrificing performance. The proposed physical design methodologies should act as important building blocks for 3D ICs and push 3D ICs toward mainstream acceptance in the near future

    High performance algorithms for large scale placement problem

    Get PDF
    Placement is one of the most important problems in electronic design automation (EDA). An inferior placement solution will not only affect the chip’s performance but might also make it nonmanufacturable by producing excessive wirelength, which is beyond available routing resources. Although placement has been extensively investigated for several decades, it is still a very challenging problem mainly due to that design scale has been dramatically increased by order of magnitudes and the increasing trend seems unstoppable. In modern design, chips commonly integrate millions of gates that require over tens of metal routing layers. Besides, new manufacturing techniques bring out new requests leading to that multi-objectives should be optimized simultaneously during placement. Our research provides high performance algorithms for placement problem. We propose (i) a high performance global placement core engine POLAR; (ii) an efficient routability-driven placer POLAR 2.0, which is an extension of POLAR to deal with routing congestion; (iii) an ultrafast global placer POLAR 3.0, which explore parallelism on POLAR and can make full use of multi-core system; (iv) some efficient triple patterning lithography (TPL) aware detailed placement algorithms

    Circuit delay optimization by buffering the logic gates

    Get PDF
    Avec la miniaturisation actuelle, les circuits démontrent de plus en plus l'importance des délais d'interconnexion. Afin de réduire ce délai, l'insertion de tampons doit être effectuée durant la synthèse logique et la synthèse physique. Cette activité d'optimisation est souvent basée sur la programmation dynamique. Dans ce mémoire, la technique branch-and-bound est utilisé et le problème pour le cas spécifique d'arbres de tampons équilibrés est résolu, où toutes les charges ont un temps requis et une capacité identique. Une analyse mathématique est faite pour tenir compte d'une variété de questions de conception telles que la topologie, la bibliothèque de tampons et le changement de phase en présence d'inverseur. En combinant la programmation dynamique et les techniques branch-and-bound, une méthode hybride est présentée qui améliore le temps d'exécution tout en conservant une utilisation de mémoire raisonnable. Les concepts mathématiques et algorithmiques fondamentaux utilisés dans ce mémoire peuvent être employés pour généraliser la méthode proposée pour un ensemble de charges avec des capacités et des temps requis différents

    FieldPlacer - A flexible, fast and unconstrained force-directed placement method for heterogeneous reconfigurable logic architectures

    Get PDF
    The field of placement methods for components of integrated circuits, especially in the domain of reconfigurable chip architectures, is mainly dominated by a handful of concepts. While some of these are easy to apply but difficult to adapt to new situations, others are more flexible but rather complex to realize. This work presents the FieldPlacer framework, a flexible, fast and unconstrained force-directed placement method for heterogeneous reconfigurable logic architectures, in particular for the ever important heterogeneous FPGAs. In contrast to many other force-directed placers, this approach is called ‘unconstrained’ as it does not require a priori fixed logic elements in order to calculate a force equilibrium as the solution to a system of equations. Instead, it is based on a free spring embedder simulation of a graph representation which includes all logic block types of a design simultaneously. The FieldPlacer framework offers a huge amount of flexibility in applying different distance norms (e. g., the Manhattan distance) for the force-directed layout and aims at creating adapted layouts for various objective functions, e. g., highest performance or improved routability. Depending on the individual situation, a runtime-quality trade-off can be considered to either produce a decent placement in a very short time or to generate an exceptionally good placement, which takes longer. An extensive comparison with the latest simulated annealing placement method from the well-known Versatile Place and Route (VPR) framework shows that the FieldPlacer approach can create placements of comparable quality much faster than VPR or, alternatively, generate better placements in the same time. The flexibility in defining arbitrary objective functions and the intuitive adaptability of the method, which, among others, includes different concepts from the field of graph drawing, should facilitate further developments with this framework, e. g., for new upcoming optimization targets like the energy consumption of an implemented design

    Synthèse de réseaux de distribution d'horloges en présence de variations du procédé de fabrication

    Get PDF
    Design of clock distributions networks in presence of process variations -- Importance des variations spatiales de la constante de temps du transistor MOS -- Pipelined H-trees for high-speed clocking of large integrated systems in presence of process variations -- Conception de réseaux de distribution d'horloges fiables et à faible consommation de puissance -- Design of low-power and reliable logic-based H-trees -- Sources des variations spatiales de la constante de temps du transistor MOS -- Spatial characterization of process variations via MOS transistor time constants in VLSI & WSI -- Techniques de minimisation du biais de synchronisation par calibration de délai -- Minimizing process-induced skew using delay tuning

    Network-on-Chip

    Get PDF
    Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems
    • …
    corecore