Terahertz Communications and Sensing for 6G and Beyond: A Comprehensive View

The next-generation wireless technologies, commonly referred to as the sixth generation (6G), are envisioned to support extreme communications capacity and in particular disruption in the network sensing capabilities. The terahertz (THz) band is one potential enabler for those due to the enormous unused frequency bands and the high spatial resolution enabled by both short wavelengths and bandwidths. Different from earlier surveys, this paper presents a comprehensive treatment and technology survey on THz communications and sensing in terms of the advantages, applications, propagation characterization, channel modeling, measurement campaigns, antennas, transceiver devices, beamforming, networking, the integration of communications and sensing, and experimental testbeds. Starting from the motivation and use cases, we survey the development and historical perspective of THz communications and sensing with the anticipated 6G requirements. We explore the radio propagation, channel modeling, and measurements for THz band. The transceiver requirements, architectures, technological challenges, and approaches together with means to compensate for the high propagation losses by appropriate antenna and beamforming solutions. We survey also several system technologies required by or beneficial for THz systems. The synergistic design of sensing and communications is explored with depth. Practical trials, demonstrations, and experiments are also summarized. The paper gives a holistic view of the current state of the art and highlights the issues and challenges that are open for further research towards 6G.Comment: 55 pages, 10 figures, 8 tables, submitted to IEEE Communications Surveys & Tutorial

Millimeter-wave interconnects for intra- and inter-chip transmission and beam steering in NoC-based multi-chip systems

The primary objective of this work is to investigate the communication capabilities of short-range millimeter-wave (mm-wave) communication among Network-on-Chip (NoC) based multi-core processors integrated on a substrate board. To address the demand for high-performance multi-chip computing systems, the present work studies the transmission coefficients between the on-chip antennas system for both intra- and inter-chip communication. It addresses techniques for enhancing transmission by using antenna arrays for beamforming. It also explores new and creative solutions to minimize the adverse effects of silicon on electromagnetic wave propagation using artificial magnetic conductors (AMC). The following summarizes the work performed and future work. Intra- and inter-chip transmission between wireless interconnects implemented as antennas on-chip (AoC), in a wire-bonded chip package are studied 30GHz and 60 GHz. The simulations are performed in ANSYS HFSS, which is based on the finite element method (FEM), to study the transmission and to analyze the electric field distribution. Simulation results have been validated with fabricated antennas at 30 GHz arranged in different orientations on silicon dies that can communicate with inter-chip transmission coefficients ranging from -45dB to -60dB while sustaining bandwidths up to 7GHz. The fabricated antennas show a shift in the resonant frequency to 25GHz. This shift is attributed to the Ground-Signal-Ground (GSG) probes used for measurement and to the Short-Open-Load (SOLT) calibration which has anomalies at millimeter-wave frequencies. Using measurements, a large-scale log-normal channel model is derived which can be used for system-level architecture design. Further, at 60 GHz densely packed multilayer copper wires in NoCs have been modeled to study their impact on the wireless transmission between antennas for both intra- and inter-chip links and are shown to be equivalent to copper sheets. It is seen that the antenna radiation efficiency reduces in the presence of these densely packed wires placed close to the antenna elements. Using this model, the reduction of inter-chip transmission is seen to be about 20dB as compared to a system with no wires. Lastly, the transmission characteristics of the antennas resonating at 60GHz in a flip-chip packaging environment are also presented

Performance analysis of smart optimization antenna for wireless networks

Antenna design has significantly advanced as a result of the widespread need for wireless communications and data substitution through wireless devices. The research article's goal is to provide a conceptual framework, difficulties, and opportunities for a source as well as a general overview of the antenna used in wireless communications applications. In this proposed research, we will go over a variety of topics related to mobile communication and fifth generation (5G) technologies, including its pros and benefits. A thorough comparison between the expected properties of the antennas and each generation, from 1st generation (1G) to 5G, is also included. This article also provides an overview of the investigated 5G technologies and various antenna designs