A framework for fine-grain synthesis optimization of operational amplifiers

This thesis presents a cell-level framework for Operational Amplifiers Synthesis (OASYN) coupling both circuit design and layout. For circuit design, the tool applies a corner-driven optimization, accounting for on-chip performance variations. By exploring the process, voltage, and temperature variations space, the tool extracts design worst case solution. The tool undergoes sensitivity analysis along with Pareto-optimality to achieve required specifications. For layout phase, OASYN generates a DRC proved automated layout based on a sized circuit-level description. Morata et al. (1996) introduced an elegant representation of block placement called sequence pair for general floorplans (SP). Like TCG and BSG, but unlike O-tree, B*tree, and CBL, SP is P-admissible. Unlike SP, TCG supports incremental update during operation and keeps the information of the boundary modules as well as their relative positions in the representation. Block placement algorithms that are based on SP use heuristic optimization algorithms, e.g., simulated annealing where generation of large number of sequence pairs are required. Therefore a fast algorithm is needed to generate sequence pairs after each solution perturbation. The thesis presents a new simple and efficient O(n) runtime algorithm for fast realization of incremental update for cost evaluation. The algorithm integrates sequence pair and transitive closure graph advantages into TCG-S* a superior topology update scheme which facilitates the search for optimum desired floorplan. Experiments show that TCG-S* is better than existing works in terms of area utilization and convergence speed. Routing-aware placement is implemented in OASYN, handling symmetry constraints, e.g., interdigitization, common centroid, along with congestion elimination and the enhancement of placement routability

On The Engineering of a Stable Force-Directed Placer

Analytic and force-directed placement methods that simultaneously minimize wire length and spread cells are receiving renewed attention from both academia and industry. However, these methods are by no means trivial to implement---to date, published works have failed to provide sufficient engineering details to replicate results. This dissertation addresses the implementation of a generic force-directed placer entitled FDP. Specifically, this thesis provides (1) a description of efficient force computation for spreading cells, (2) an illustration of numerical instability in this method and a means to avoid the instability, (3) metrics for measuring cell distribution throughout the placement area, and (4) a complementary technique that aids in minimizing wire length. FDP is compared to Kraftwerk and other leading academic tools including Capo, Dragon, and mPG for both standard cell and mixed-size circuits. Wire lengths produced by FDP are found to be, on average, up to 9% and 3% better than Kraftwerk and Capo, respectively. All told, this thesis confirms the validity and applicability of the approach, and provides clarifying details of the intricacies surrounding the implementation of a force-directed global placer

On the Use of Directed Moves for Placement in VLSI CAD

Search-based placement methods have long been used for placing integrated circuits targeting the field programmable gate array (FPGA) and standard cell design styles. Such methods offer the potential for high-quality solutions but often come at the cost of long run-times compared to alternative methods. This dissertation examines strategies for enhancing local search heuristics---and in particular, simulated annealing---through the application of directed moves. These moves help to guide a search-based optimizer by focusing efforts on states which are most likely to yield productive improvement, effectively pruning the size of the search space. The engineering theory and implementation details of directed moves are discussed in the context of both field programmable gate array and standard cell designs. This work explores the ways in which such moves can be used to improve the quality of FPGA placements, improve the robustness of floorplan repair and legalization methods for mixed-size standard cell designs, and enhance the quality of detailed placement for standard cell circuits. The analysis presented herein confirms the validity and efficacy of directed moves, and supports the use of such heuristics within various optimization frameworks

High performance algorithms for large scale placement problem

Placement is one of the most important problems in electronic design automation (EDA). An inferior placement solution will not only affect the chip’s performance but might also make it nonmanufacturable by producing excessive wirelength, which is beyond available routing resources. Although placement has been extensively investigated for several decades, it is still a very challenging problem mainly due to that design scale has been dramatically increased by order of magnitudes and the increasing trend seems unstoppable. In modern design, chips commonly integrate millions of gates that require over tens of metal routing layers. Besides, new manufacturing techniques bring out new requests leading to that multi-objectives should be optimized simultaneously during placement. Our research provides high performance algorithms for placement problem. We propose (i) a high performance global placement core engine POLAR; (ii) an efficient routability-driven placer POLAR 2.0, which is an extension of POLAR to deal with routing congestion; (iii) an ultrafast global placer POLAR 3.0, which explore parallelism on POLAR and can make full use of multi-core system; (iv) some efficient triple patterning lithography (TPL) aware detailed placement algorithms

Placement techniques in automatic analog layout generation.

模擬電路版圖設計是一個非常複雜和耗時的過程。通常情況下，設計一個高質量的模擬電路版圖需要電子工程師花費幾週甚至更長的時間。模擬電路的電子特性對於電路的細節設計非常敏感，因此，減小電路中的失配現象成為模擬電路版圖設計中一個非常重要的課題。在本論文中，我們提出了一系列實際的佈局技術，來降低電路的失配並提高繞線的成功率。我們可以非常容易的將這些技術整合至一個完整的模擬佈局和佈線的工具中，此工具可以在幾分鐘內生成一個完整的、高質量的模擬電路版圖。同時，該版圖能夠通過設計規則驗證（DRC）和佈局與電路設計一致性檢測（LVS）。模擬結果顯示，它的電路性能能夠與達到甚至超出手工設計的電路版圖。我們的論文主要作出了以下兩方面貢獻。1. 平衡佈局：對於模擬電路中的電子元器件，如電容、電阻、晶體管等進行一維和二維的平衡佈局。電子工程師可以根據不同的設計需求，通過選擇不同的佈局參數來改變電路的佈局排列方式。同時，在模擬退火算法中，我們著重考慮了器件間的匹配以生成高質量的模擬電路佈局。2. 消除阻塞的電路佈局：在模擬電路設計中，我們期望盡量避免在電子元器件密度較高的區域進行繞線。因此，我們需要在電路佈局設計過程中在電子元器件間留有足夠的佈線空間。為達到這個目標，我們提出了更精確的阻塞估計方法和版圖拓展方法，使其能夠生成一個高質量、高繞線成功率的電路佈局結果。為了驗證生成的電路版圖的質量和匹配特性，我們利用蒙地卡羅方法來模擬電路中的製程偏差和失配特性。實驗結果顯示，我們的工具可以在幾分鐘內自動生成高質量的電路版圖，與人工設計通常需要花費數日至數週相比，設計時間大幅縮短，同時電路的匹配特性得以提升。Analog layout design is a complicated and time-consuming process. It often takes couples of weeks for the layout designers to generate a qualied layout. The elec-trical properties of analog circuit are very sensitive to the layout details, and mis-match reduction becomes a very important issue in analog layout design.In this thesis, we will present some practical placement techniques to reduce mismatch and improve routability. These techniques can be easily integrated into a complete analog placement and routing ow, which can produce in just a few min-utes a complete and high quality layout for analog circuits that passes the design rule check, layout-schematic check and with performance veried by simulations. The contents of this thesis will focus on the following two issues:(1) Symmetry Placement: We consider symmetric placement of transistors, re-sistors and capacitors, which includes 1-D symmetry and 2-D symmetry (or called common centroid). Different symmetric placement congurations, derived accord-ing to the practical needs in analog design, are considered for the matching devices in the simulated annealing engine of the placer in order to generate a placement with high quality.(2) Congestion-driven Placement: In analog design, wires are preferred not be routed over active devices, so we need to leave enough spaces properly for routing between the devices during the placement process. To achieve this, we explore congestion estimation and layout expansion during the placement step in order to produce a good and routable solution.In order to verify the quality of the generated layouts in terms of mismatch, we will run Monte Carlo simulations on them with variations in process and mismatch. Experiments show that our methodology can generate high quality layout automatically in just a few minutes while manual design may take couples of days.Detailed summary in vernacular field only.Detailed summary in vernacular field only.Detailed summary in vernacular field only.Detailed summary in vernacular field only.Detailed summary in vernacular field only.Cui, Guxin.Thesis (M.Phil.)--Chinese University of Hong Kong, 2012.Abstracts also in Chinese.Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Background --- p.1Chapter 1.2 --- Physical Design --- p.2Chapter 1.3 --- Analog Placement --- p.4Chapter 1.3.1 --- Methodologies of Analog Placement --- p.4Chapter 1.3.2 --- Symmetry Constraints of Analog Placement --- p.5Chapter 1.4 --- Process Variation and Layout Mismatch --- p.6Chapter 1.4.1 --- Process Variation --- p.6Chapter 1.4.2 --- Random Mismatch and Systematic Mismatch --- p.7Chapter 1.5 --- Monte Carlo Simulation Procedure --- p.9Chapter 1.6 --- Problem Formulation of Placement --- p.9Chapter 1.7 --- Motivations --- p.10Chapter 1.8 --- Contributions --- p.11Chapter 1.9 --- Thesis Organization --- p.12Chapter 2 --- Literature Review on Analog Placement --- p.13Chapter 2.1 --- Topological Representations Handling Symmetry Constraints --- p.14Chapter 2.1.1 --- Symmetry within the Sequence-Pair (SP) Representation . --- p.14Chapter 2.1.2 --- Block Placement with Symmetry Constraints Based on the O-Tree Non-Slicing Representation --- p.16Chapter 2.1.3 --- Placement with Symmetry Constraints for Analog Layout Design Using TCG-S --- p.17Chapter 2.1.4 --- Modeling Non-Slicing Floorplans with Binary Trees --- p.19Chapter 2.1.5 --- Segment Trees Handle Symmetry Constraints --- p.20Chapter 2.1.6 --- Center-based Corner Block List --- p.22Chapter 2.2 --- Other Works on Analog Placement Constraints --- p.25Chapter 2.2.1 --- Deterministic Analog Placement with Hierarchically Bounded Enumeration and Enhanced Shape Functions --- p.25Chapter 2.2.2 --- Analog Placement Based on Symmetry-Island Formulation --- p.27Chapter 2.2.3 --- Heterogeneous B*-Trees for Analog Placement with Symmetry and Regularity Considerations --- p.28Chapter 2.3 --- Summary --- p.31Chapter 3 --- Common-Centroid Analog Placement --- p.32Chapter 3.1 --- Problem Formulation --- p.33Chapter 3.2 --- Overview of Our Work --- p.35Chapter 3.3 --- Handling Common Centroid Constraints in Different Devices --- p.37Chapter 3.3.1 --- Common Centroid Placement of Resistors --- p.38Chapter 3.3.2 --- Common Centroid Placement of Transistors --- p.44Chapter 3.3.3 --- Common Centroid Placement of Capacitors --- p.47Chapter 3.4 --- Congestion Estimation and Layout Expansion --- p.50Chapter 3.4.1 --- Blockage-Aware Congestion Estimation --- p.51Chapter 3.4.2 --- Layout Expansion --- p.56Chapter 3.5 --- Simulated Annealing --- p.59Chapter 3.5.1 --- Types of Moves --- p.59Chapter 3.5.2 --- Handling Devices in Symmetry Group --- p.59Chapter 3.5.3 --- Cost Function of Simulated Annealing --- p.61Chapter 3.6 --- Summary --- p.62Chapter 4 --- Experimental Results and Monte-Carlo Simulations --- p.64Chapter 4.1 --- Study of Congestion-driven Layout Expansion --- p.64Chapter 4.2 --- Monte Carlo Simulations --- p.70Chapter 4.2.1 --- Devices Modeling --- p.70Chapter 4.2.2 --- Study of Layouts with and without Symmetry Groups --- p.71Chapter 4.2.3 --- Study of Layouts with and without Self-Symmetry Devices --- p.73Chapter 4.2.4 --- Study of Layouts with Different Number of Symmetry Groups --- p.74Chapter 4.2.5 --- Study of Large and Small Size Capacitors Array --- p.76Chapter 4.3 --- Comparison of Automatic and Manual Layouts using Monte Carlo Simulations --- p.79Chapter 5 --- Conclusion --- p.86Bibliography --- p.8

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Thermal, Power Delivery and Reliability Management for 3D ICS

Three-dimensional (3D) integration technology is promising to continuously improve the performance of electronic devices by vertically stacking multiple active layers and connecting them with Through-Silicon-Vias (TSVs). Meanwhile, the thermal and power integrity problems are exacerbated since the power flux in 3D integrated circuits (3D ICs) increases linearly with the number of stacked layers. Moreover, the TSV structure in 3D ICs introduces new reliability problems since TSVs are vulnerable to various failure mechanisms (e.g. electromigration) and the failure of power-ground TSVs will cause voltage drop thereby significantly degrading the performance of 3D ICs. To make things worse, the high temperature, thermal gradient and power load in 3D ICs accelerate the failure of TSVs. Therefore, in order to push the 3D integration technology to full commercialization, the thermal, power integrity and reliability problem should be properly addressed in both design-time and run-time. In 3D ICs, the heat flux will easily exceed the capability of the traditional air cooling. Therefore, several aggressive cooling methods are applied to remove heat from the 3D IC, which include micro-fluidic cooling, the phase change material based cooling etc. These cooling schemes are usually implemented close to the heat source to gain high heat removal capability, thus causing more challenges to the design of 3D ICs. Unfortunately, physical design tools for 3D ICs with those aggressive cooling methods are lack. In this thesis, we will focus on 3D ICs with micro-fluidic (MF) cooling. The physical design for this kind of 3D ICs involves complex trade-offs between the circuit performance, power delivery noise, and temperature. For example, both TSVs and micro-cavities for MF cooling are fabricated in the substrate region. Therefore, they will compete in space: the allocation of signal TSVs should avoid micro-cavities to realize a feasible design, thus enforcing more constraints to the physical placement of 3D ICs. Moreover, power delivery networks (PDNs) in 3D ICs are enabled by power-ground (P/G) TSVs. The number and distribution of P/G TSVs are also constrained by micro-cavities which will influence the power integrity of the 3D IC. In addition, the capability of MF cooling degrades downstream the flow of coolant thereby causing large in-layer temperature gradient. The spatial temperature variance will affect the reliability of 3D ICs. in order to avoid it, the gate/modules in 3D ICs should be placed properly. In order to address the trade-offs 3D ICs with MF cooling, different design-time methods for application specific ICs (ASICs) and field programmable gate arrays (FPGAs) are proposed, respectively. For 3D ASICs, we propose a co-design method that integrates the design of MF cooling heat sink and P/G TSVs to the physical placement for 3D ICs. Experiments on publicly available benchmarks show that using our method, we can achieve better results compared to the traditional sequential design flow. The case for 3D FPGAs is more complicated than ASICs since the routing and logic resources are fixed and the chip power and temperature is hard to estimate until the circuit is routed. Therefore, in this thesis, we first build a design space exploration (DSE) framework to study how MF cooling affects the design of 3D FPGAs. Following this, we utilize an existing 3D FPGA placement and routing tool to develop a cooling-aware placement framework for 3D FPGAs to reduce the temperature gradient. Since the activity of 3D ICs cannot be completely estimated at the design stage, the run-time management, besides design-time methods, is required to address the thermal, power and reliability problems in 3D ICs. However, the vertically stacked structure makes the run-time management for 3D ICs more complicated than 2D ICs. The major reason of this is that the power supply noise and temperature can be coupled across layers in 3D ICs. This means the activity of one layer may affect the performance and reliability of other layers through voltage/temperature coupling. As a result, we cannot perform run-time management for each layer (perhaps implemented with dierent chips) of 3D ICs separately as in 2D systems. Therefore, the space of control nodes will become larger and more complicated. To make things worse, the existing run-time management techniques have various drawbacks (e.g. large off-line characterization overhead, poor scalability etc. ), which needs more eort to improve. In this thesis, we propose a phase-driven Q-learning based run-time management technique which can tune the activity of the processor to maximize the 3D CPU performance subject to the reliability constraint