Advances in Manufacturing Technology XXVII: Proceedings of the 11th International Conference on Manufacturing Research (ICMR2013)

ICMR2013 was organised by Cranfield University on the 19-20 September 2013. The conference focuses on any aspects of product development, manufacturing technology, manufacturing systems, information systems and digital technologies. It provides an excellent avenue for researchers to present state-of-the-art multidisciplinary manufacturing research and exchange ideas. In addition to the four keynote speeches from Airbus and Rolls-Royce and three invited presentations, there are 108 papers in these proceedings. These papers are split into 24 technical sessions. The International Conference on Manufacturing Research is a major event for academics and industrialists engaged in manufacturing research. Held annually in the UK since the late 1970s, the conference is renowned as a friendly and inclusive environment that brings together a broad community of researchers who share a common goal; developing and managing the technologies and operations that are key to sustaining the success of manufacturing businesses. For over two decades, ICMR has been the main manufacturing research conference organised in the UK, successfully bringing researchers, academics and industrialists together to share their knowledge and experiences. Initiated a National Conference by the Consortium of UK University Manufacturing Engineering Heads (COMEH), it became an International Conference in 2003. COMEH is an independent body established in 1978. Its main aim is to promote manufacturing engineering education, training and research. To achieve this, the Consortium maintains a close liaison with government bodies concerned with the training and continuing development of professional engineers, while responding to the appropriate consultative and discussion documents and other initiatives. COMEH is represented on the Engineering Professor’s council (EPC) and it organises and supports national manufacturing engineering education research conferences and symposia

Monolithic electronic-photonic integration in state-of-the-art CMOS processes

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Cataloged from student submitted PDF version of thesis.Includes bibliographical references (p. 388-407).As silicon CMOS transistors have scaled, increasing the density and energy efficiency of computation on a single chip, the off-chip communication link to memory has emerged as the major bottleneck within modern processors. Photonic devices promise to break this bottleneck with superior bandwidth-density and energy-efficiency. Initial work by many research groups to adapt photonic device designs to a silicon-based material platform demonstrated suitable independent performance for such links. However, electronic-photonic integration attempts to date have been limited by the high cost and complexity associated with modifying CMOS platforms suitable for modern high-performance computing applications. In this work, we instead utilize existing state-of-the-art electronic CMOS processes to fabricate integrated photonics by: modifying designs to match the existing process; preparing a design-rule compliant layout within industry-standard CAD tools; and locally-removing the handle silicon substrate in the photonic region through post-processing. This effort has resulted in the fabrication of seven test chips from two major foundries in 28, 45, 65 and 90 nm CMOS processes. Of these efforts, a single die fabricated through a widely available 45nm SOI-CMOS mask-share foundry with integrated waveguides with 3.7 dB/cm propagation loss alongside unmodified electronics with less than 5 ps inverter stage delay serves as a proof-of-concept for this approach. Demonstrated photonic devices include high-extinction carrier-injection modulators, 8-channel wavelength division multiplexing filter banks and low-efficiency silicon germanium photodetectors. Simultaneous electronic-photonic functionality is verified by recording a 600 Mb/s eye diagram from a resonant modulator driven by integrated digital circuits. Initial work towards photonic device integration within the peripheral CMOS flow of a memory process that has resulted in polysilicon waveguide propagation losses of 6.4 dB/cm will also be presented.by Jason S. Orcutt.Ph.D

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems