Leakage Minimization Technique for Nanoscale CMOS VLSI

Because of the continued scaling of technology and supply-threshold voltage, leakage power has become more significant in power dissipation of nanoscale CMOS circuits. Therefore, estimating the total leakage power is critical to designing low-power digital circuits. In nanometer CMOS circuits, the main leakage components are the subthreshold, gate-tunneling, and reverse-biased junction band-to-band-tunneling (BTBT) leakage currents

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

Impact of Device Parameteres of Triple Gate SOI-FINFET on the Performance of CMOS Inverter at 22NM

A simulation based design evaluation is reported for SOI FinFETs at 22nm gate length. The impact of device parameters on the static power dissipation and delay of a CMOS inverter is presented. Fin dimensions such as Fin width and height are varied. For a given gate oxide thickness increasing the fin height and fin width degrades the SCEs, while improves the performance. It was found that reducing the fin thickness was beneficial in reducing the off state leakage current (IOFF), while reducing the fin height was beneficial in reducing the gate leakage current (IGATE). It was found that Static power dissipation of the inverter increases with fin height due to the increase in leakage current, whereas delay decreased with increase fin width due to higher on current. The performance of the inverter decreased with the down scaling of the gate oxide thickness due to higher gate leakage current and gate capacitance

Ultra-Low Power and Radiation Hardened Asynchronous Circuit Design

This dissertation proposes an ultra-low power design methodology called bit-wise MTNCL for bit-wise pipelined asynchronous circuits, which combines multi-threshold CMOS (MTCMOS) with bit-wise pipelined NULL Convention Logic (NCL) systems. It provides the leakage power advantages of an all high-Vt implementation with a reasonable speed penalty compared to the all low-Vt implementation, and has negligible area overhead. It was enhanced to handle indeterminate standby states. The original MTNCL concept was enhanced significantly by sleeping Registers and Completion Logic as well as Combinational circuits to reduce area, leakage power, and energy per operation. This dissertation also develops an architecture that allows NCL circuits to recover from a Single Event Upset (SEU) or Single Event Latchup (SEL) fault without any data loss. Finally, an accurate throughput derivation formula for pipelined NCL circuits was developed, which can be used for static timing analysis

LOW LEAKAGE CHARGE RECYCLING TECHNIQUE FOR POWER MINIMIZATION IN CNTFET CIRCUITS

Carbon Nanotube Field Effect Transistor (CNTFET) is one of the most promising candidates in the near future for digital design due to its better electrostatics and higher mobility characteristics. Parameters that determine the CNTFET performance are the number of tubes, pitch, diameter and oxide thickness. In this paper, a power gating design methodology to realise low power CNTFET digital circuits even under device parameter changes is presented. Investigation about the effect of different CNTFET parameters on dynamic and standby power is carried out. Simulation results reveal that the power gated circuits suppress a maximum of about 67% dynamic power and 59% standby power compared to conventional circuits

Methodology for Standby Leakage Power Reduction in Nanometer-Scale CMOS Circuits

In nanometer-scale CMOS technology, leakage power has become a major component of the total power dissipation due to the downscaling of threshold voltage and gate oxide thickness. The leakage power consumption has received even more attention by increasing demand for mobile devices. Since mobile devices spend a majority of their time in a standby mode, the leakage power savings in standby state is critical to extend battery lifetime. For this reason, low power has become a major factor in designing CMOS circuits. In this dissertation, we propose a novel transistor reordering methodology for leakage reduction. Unlike previous technique, the proposed method provides exact reordering rules for minimum leakage formation by considering all leakage components. Thus, this method formulates an optimized structure for leakage reduction even in complex CMOS logic gate, and can be used in combination with other leakage reduction techniques to achieve further improvement. We also propose a new standby leakage reduction methodology, leakage-aware body biasing, to overcome the shortcomings of a conventional Reverse Body Biasing (RBB) technique. The RBB technique has been used to reduce subthreshold leakage current. Therefore, this technique works well under subthreshold dominant region even though it has intrinsic structural drawbacks. However, such drawbacks cannot be overlooked anymore since gate leakage has become comparable to subthreshold leakage in nanometer-scale region. In addition, BTBT leakage also increases with technology scaling due to the higher doping concentration applied in each process technology. In these circumstances, the objective of leakage minimization is not a single leakage source but the overall leakage sources. The proposed leakage-aware body biasing technique, unlike conventional RBB technique, considers all major leakage sources to minimize the negative effects of existing body biasing approach. This can be achieved by intelligently applying body bias to appropriate CMOS network based on its status (on-/off-state) with the aid of a pin/transistor reordering technique

Leakage Power Modeling and Reduction Techniques for Field Programmable Gate Arrays

FPGAs have become quite popular for implementing digital circuits and systems because of reduced costs and fast design cycles. This has led to increased complexity of FPGAs, and with technology scaling, many new challenges have come up for the FPGA industry, leakage power being one of the key challenges. The current generation FPGAs are being implemented in 90nm technology, therefore, managing leakage power in deep-submicron FPGAs has become critical for the FPGA industry to remain competitive in the semiconductor market and to enter the mobile applications domain. In this work an analytical state dependent leakage power model for FPGAs is developed, followed by dual-Vt based designs of the FPGA architecture for reducing leakage power. The leakage power model computes subthreshold and gate leakage in FPGAs, since these are the two dominant components of total leakage power in the scaled nanometer technologies. The leakage power model takes into account the dependency of gate and subthreshold leakage on the state of the circuit inputs. The leakage power model has two main components, one which computes the probability of a state for a particular FPGA circuit element, and the other which computes the leakage of the FPGA circuit element for a given input using analytical equations. This FPGA power model is particularly important for rapidly analyzing various FPGA architectures across different technology nodes. Dual-Vt based designs of the FPGA architecture are proposed, developed, and evaluated, for reducing the leakage power using a CAD framework. The logic and the routing resources of the FPGA are considered for dual-Vt assignment. The number of the logic elements that can be assigned high-Vt in the ideal case by using a dual-Vt assignment algorithm in the CAD framework is estimated. Based upon this estimate two kinds of architectures are developed and evaluated, homogeneous and heterogeneous architectures. Results indicate that leakage power savings of up to 50% can be obtained from these architectures. The analytical state dependent leakage power model developed has been used for estimating the leakage power savings from the dual-Vt FPGA architectures. The CAD framework that has been developed can also be used for developing and evaluating different dual-Vt FPGA architectures, other than the ones proposed in this work

Ultra-low Voltage Digital Circuits and Extreme Temperature Electronics Design

Certain applications require digital electronics to operate under extreme conditions e.g., large swings in ambient temperature, very low supply voltage, high radiation. Such applications include sensor networks, wearable electronics, unmanned aerial vehicles, spacecraft, and energyharvesting systems. This dissertation splits into two projects that study digital electronics supplied by ultra-low voltages and build an electronic system for extreme temperatures. The first project introduces techniques that improve circuit reliability at deep subthreshold voltages as well as determine the minimum required supply voltage. These techniques address digital electronic design at several levels: the physical process, gate design, and system architecture. This dissertation analyzes a silicon-on-insulator process, Schmitt-trigger gate design, and asynchronous logic at supply voltages lower than 100 millivolts. The second project describes construction of a sensor digital controller for the lunar environment. Parts of the digital controller are an asynchronous 8031 microprocessor that is compatible with synchronous logic, memory with error detection and correction, and a robust network interface. The digitial sensor ASIC is fabricated on a silicon-germanium process and built with cells optimized for extreme temperatures

Coarse-Grained Online Monitoring of BTI Aging by Reusing Power-Gating Infrastructure

In this paper, we present a novel coarse-grained technique for monitoring online the bias temperature instability (BTI) aging of circuits by exploiting their power gating infrastructure. The proposed technique relies on monitoring the discharge time of the virtual-power-network during standby operations, the value of which depends on the threshold voltage of the CMOS devices in a power-gated design (PGD). It does not require any distributed sensors, because the virtual-power-network is already distributed in a PGD. It consists of a hardware block for measuring the discharge time concurrently with normal standby operations and a processing block for estimating the BTI aging status of the PGD according to collected measurements. Through SPICE simulation, we demonstrate that the BTI aging estimation error of the proposed technique is less than 1% and 6.2% for PGDs with static operating frequency and dynamic voltage and frequency scaling, respectively. Its area cost is also found negligible. The power gating minimum idle time (MIT) cost induced by the energy consumed for monitoring the discharge time is evaluated on two scalar machine models using either x86 or ARM instruction sets. It is found less than 1.3× and 1.45× the original power gating MIT, respectively. We validate the proposed technique through accelerated aging experiments conducted with five actual chips that contain an ARM cortex M0 processor, manufactured with a 65 nm CMOS technology