Provably Trustworthy and Secure Hardware Design with Low Overhead

Due to the globalization of IC design in the semiconductor industry and outsourcing of chip manufacturing, 3PIPs become vulnerable to IP piracy, reverse engineering, counterfeit IC, and hardware Trojans. To thwart such attacks, ICs can be protected using logic encryption techniques. However, strong resilient techniques incur significant overheads. SCAs further complicate matters by introducing potential attacks post-fabrication. One of the most severe SCAs is PA attacks, in which an attacker can observe the power variations of the device and analyze them to extract the secret key. PA attacks can be mitigated via adding large extra hardware; however, the overheads of such solutions can render them impractical, especially when there are power and area constraints. In our first approach, we present two techniques to prevent normal attacks. The first one is based on inserting MUX equal to half/full of the output bit number. In the second technique, we first design PLGs using SiNW FETs and then replace some logic gates in the original design with their SiNW FETs-based PLGs counterparts. In our second approach, we use SiNW FETs to produce obfuscated ICs that are resistant to advanced reverse engineering attacks. Our method is based on designing a small block, whose output is untraceable, namely URSAT. Since URSAT may not offer very strong resilience against the combined AppSAT-removal attack, S-URSAT is achieved using only CMOS-logic gates, and this increases the security level of the design to robustly thwart all existing attacks. In our third topic, we present the usage of ASLD to produce secure and resilient circuits that withstand IC attacks (during the fabrication) and PA attacks (after fabrication). First, we show that ASLD has unique features that can be used to prevent PA and IC attacks. In our three topics, we evaluate each design based on performance overheads and security guarantees

FDSOI Design using Automated Standard-Cell-Grained Body Biasing

With the introduction of FDSOI processes at competitive technology nodes, body biasing on an unprecedented scale was made possible. Body biasing influences one of the central transistor characteristics, the threshold voltage. By being able to heighten or lower threshold voltage by more than 100mV, the very physics of transistor switching can be manipulated at run time. Furthermore, as body biasing does not lead to different signal levels, it can be applied much more fine-grained than, e.g., DVFS. With the state of the art mainly focused on combinations of body biasing with DVFS, it has thus ignored granularities unfeasible for DVFS. This thesis fills this gap by proposing body bias domain partitioning techniques and for body bias domain partitionings thereby generated, algorithms that search for body bias assignments. Several different granularities ranging from entire cores to small groups of standard cells were examined using two principal approaches: Designer aided pre-partitioning based determination of body bias domains and a first-time, fully automatized, netlist based approach called domain candidate exploration. Both approaches operate along the lines of activation and timing of standard cell groups. These approaches were evaluated using the example of a Dynamically Reconfigurable Processor (DRP), a highly efficient category of reconfigurable architectures which consists of an array of processing elements and thus offers many opportunities for generalization towards many-core architectures. Finally, the proposed methods were validated by manufacturing a test-chip. Extensive simulation runs as well as the test-chip evaluation showed the validity of the proposed methods and indicated substantial improvements in energy efficiency compared to the state of the art. These improvements were accomplished by the fine-grained partitioning of the DRP design. This method allowed reducing dynamic power through supply voltage levels yielding higher clock frequencies using forward body biasing, while simultaneously reducing static power consumption in unused parts.Die Einführung von FDSOI Prozessen in gegenwärtigen Prozessgrößen ermöglichte die Nutzung von Substratvorspannung in nie zuvor dagewesenem Umfang. Substratvorspannung beeinflusst unter anderem eine zentrale Eigenschaft von Transistoren, die Schwellspannung. Mittels Substratvorspannung kann diese um mehr als 100mV erhöht oder gesenkt werden, was es ermöglicht, die schiere Physik des Schaltvorgangs zu manipulieren. Da weiterhin hiervon der Signalpegel der digitalen Signale unberührt bleibt, kann diese Technik auch in feineren Granularitäten angewendet werden, als z.B. Dynamische Spannungs- und Frequenz Anpassung (Engl. Dynamic Voltage and Frequency Scaling, Abk. DVFS). Da jedoch der Stand der Technik Substratvorspannung hauptsächlich in Kombinationen mit DVFS anwendet, werden feinere Granularitäten, welche für DVFS nicht mehr wirtschaftlich realisierbar sind, nicht berücksichtigt. Die vorliegende Arbeit schließt diese Lücke, indem sie Partitionierungsalgorithmen zur Unterteilung eines Entwurfs in Substratvorspannungsdomänen vorschlägt und für diese hierdurch unterteilten Domänen entsprechende Substratvorspannungen berechnet. Hierzu wurden verschiedene Granularitäten berücksichtigt, von ganzen Prozessorkernen bis hin zu kleinen Gruppen von Standardzellen. Diese Entwürfe wurden dann mit zwei verschiedenen Herangehensweisen unterteilt: Chipdesigner unterstützte, vorpartitionierungsbasierte Bestimmung von Substratvorspannungsdomänen, sowie ein erstmals vollautomatisierter, Netzlisten basierter Ansatz, in dieser Arbeit Domänen Kandidaten Exploration genannt. Beide Ansätze funktionieren nach dem Prinzip der Aktivierung, d.h. zu welchem Zeitpunkt welcher Teil des Entwurfs aktiv ist, sowie der Signallaufzeit durch die entsprechenden Entwurfsteile. Diese Ansätze wurden anhand des Beispiels Dynamisch Rekonfigurierbarer Prozessoren (DRP) evaluiert. DRPs stellen eine Klasse hocheffizienter rekonfigurierbarer Architekturen dar, welche hauptsächlich aus einem Feld von Rechenelementen besteht und dadurch auch zahlreiche Möglichkeiten zur Verallgemeinerung hinsichtlich Many-Core Architekturen zulässt. Schließlich wurden die vorgeschlagenen Methoden in einem Testchip validiert. Alle ermittelten Ergebnisse zeigen im Vergleich zum Stand der Technik drastische Verbesserungen der Energieeffizienz, welche durch die feingranulare Unterteilung in Substratvorspannungsdomänen erzielt wurde. Hierdurch konnten durch die Anwendung von Substratvorspannung höhere Taktfrequenzen bei gleicher Versorgungsspannung erzielt werden, während zeitgleich in zeitlich unkritischen oder ungenutzten Entwurfsteilen die statische Leistungsaufnahme minimiert wurde

MOCAST 2021

The 10th International Conference on Modern Circuit and System Technologies on Electronics and Communications (MOCAST 2021) will take place in Thessaloniki, Greece, from July 5th to July 7th, 2021. The MOCAST technical program includes all aspects of circuit and system technologies, from modeling to design, verification, implementation, and application. This Special Issue presents extended versions of top-ranking papers in the conference. The topics of MOCAST include:Analog/RF and mixed signal circuits;Digital circuits and systems design;Nonlinear circuits and systems;Device and circuit modeling;High-performance embedded systems;Systems and applications;Sensors and systems;Machine learning and AI applications;Communication; Network systems;Power management;Imagers, MEMS, medical, and displays;Radiation front ends (nuclear and space application);Education in circuits, systems, and communications