Baseline study of employability related activities in Scottish colleges

In October 2004, the Scottish Funding Council (SFC)'s predecessor bodies, theSFEFC and the SHEFC, publishedLearning to Work(SFC 2004), a discussion paperabout how Scotland's colleges and universities can help to enhance learners'employability. In subsequent dialogue with stakeholders, there was agreement thatemployability should be a specific focus for quality enhancement in the college sectorfrom 2006-07. As a basis for further development, the SFC commissioned this studyto provide information on the range of current activities and practices in Scotland'scolleges which contribute to enhancing employability

Researching methods for efficient hardware specification, design and implementation of a next generation communication architecture

The objective of this work is to create and implement a System Area Network (SAN) architecture called EXTOLL embedded in the current world of systems, software and standards based on the experiences obtained during the ATOLL project development and test. The topics of this work also cover system design methodology and educational issues in order to provide appropriate human resources and work premises. The scope of this work in the EXTOLL SAN project was: • the Xbar architecture and routing (multi-layer routing, virtual channels and their arbitration, routing formats, dead lock aviodance, debug features, automation of reuse) • the on-chip module communication architecture and parts of the host communication • the network processor architecture and integration • the development of the design methodology and the creation of the design flow • the team education and work structure. In order to successfully leverage student know-how and work flow methodology for this research project the SEED curricula changes has been governed by the Hochschul Didaktik Zentrum resulting in a certificate for "Hochschuldidaktik" and excellence in university education. The complexity of the target system required new approaches in concurrent Hardware/Software codesign. The concept of virtual hardware prototypes has been established and excessively used during design space exploration and software interface design

Methodology and Ecosystem for the Design of a Complex Network ASIC

Performance of HPC systems has risen steadily. While the 10 Petaflop/s barrier has been breached in the year 2011 the next large step into the exascale era is expected sometime between the years 2018 and 2020. The EXTOLL project will be an integral part in this venture. Originally designed as a research project on FPGA basis it will make the transition to an ASIC to improve its already excelling performance even further. This transition poses many challenges that will be presented in this thesis. Nowadays, it is not enough to look only at single components in a system. EXTOLL is part of complex ecosystem which must be optimized overall since everything is tightly interwoven and disregarding some aspects can cause the whole system either to work with limited performance or even to fail. This thesis examines four different aspects in the design hierarchy and proposes efficient solutions or improvements for each of them. At first it takes a look at the design implementation and the differences between FPGA and ASIC design. It introduces a methodology to equip all on-chip memory with ECC logic automatically without the user’s input and in a transparent way so that the underlying code that uses the memory does not have to be changed. In the next step the floorplanning process is analyzed and an iterative solution is worked out based on physical and logical constraints of the EXTOLL design. Besides, a work flow for collaborative design is presented that allows multiple users to work on the design concurrently. The third part concentrates on the high-speed signal path from the chip to the connector and how it is affected by technological limitations. All constraints are analyzed and a package layout for the EXTOLL chip is proposed that is seen as the optimal solution. The last part develops a cost model for wafer and package level test and raises technological concerns that will affect the testing methodology. In order to run testing internally it proposes the development of a stand-alone test platform that is able to test packaged EXTOLL chips in every aspect