Radar Technology

In this book “Radar Technology”, the chapters are divided into four main topic areas: Topic area 1: “Radar Systems” consists of chapters which treat whole radar systems, environment and target functional chain. Topic area 2: “Radar Applications” shows various applications of radar systems, including meteorological radars, ground penetrating radars and glaciology. Topic area 3: “Radar Functional Chain and Signal Processing” describes several aspects of the radar signal processing. From parameter extraction, target detection over tracking and classification technologies. Topic area 4: “Radar Subsystems and Components” consists of design technology of radar subsystem components like antenna design or waveform design

Development of a Real-time Ultra-wideband See Through Wall Imaging Radar System

Ultra-Wideband (UWB) See-Through-Wall (STW) technology has emerged as a musthave enabling technology by both the military and commercial sectors. As a pioneer in this area, we have led the research in addressing many of the fundamental STW questions. This dissertation is to investigate and resolve a few hurdles in advancing this technology, and produce a realizable high performance STW platform system, which will aid the STW community to find the ultimate answer through experimental and theoretical work. The architectures of a realizable STW imaging system are thoroughly examined and studied. We present both a conceptual system based on RF instruments and a standalone real-time system based on custom design, which utilize reconfigurable design architecture and allows scaling down/up to a desired UWB operating frequency with little difficulty. The systems will serve as a high performance platform for STW study and other related UWB applications. Along the way to a complete STW system, we have developed a simplified transmission line model for wall characteristic prediction; we have developed a scalable synthetic aperture array including both the RF part and the switch control/synchronization part; we have proposed a cost-effective and efficient UWB data acquisition method for real-time STW application based on equivalent-time sampling method. The measurement results reported here include static image formation and tracking moveable targets behind the wall. Even though digital signal processing to generate radar images is not the focus of this research, simple methods for image formation have been implemented and results are very encouraging

REAL-TIME ADAPTIVE PULSE COMPRESSION ON RECONFIGURABLE, SYSTEM-ON-CHIP (SOC) PLATFORMS

New radar applications need to perform complex algorithms and process a large quantity of data to generate useful information for the users. This situation has motivated the search for better processing solutions that include low-power high-performance processors, efficient algorithms, and high-speed interfaces. In this work, hardware implementation of adaptive pulse compression algorithms for real-time transceiver optimization is presented, and is based on a System-on-Chip architecture for reconfigurable hardware devices. This study also evaluates the performance of dedicated coprocessors as hardware accelerator units to speed up and improve the computation of computing-intensive tasks such matrix multiplication and matrix inversion, which are essential units to solve the covariance matrix. The tradeoffs between latency and hardware utilization are also presented. Moreover, the system architecture takes advantage of the embedded processor, which is interconnected with the logic resources through high-performance buses, to perform floating-point operations, control the processing blocks, and communicate with an external PC through a customized software interface. The overall system functionality is demonstrated and tested for real-time operations using a Ku-band testbed together with a low-cost channel emulator for different types of waveforms

NASA SBIR abstracts of 1991 phase 1 projects

The objectives of 301 projects placed under contract by the Small Business Innovation Research (SBIR) program of the National Aeronautics and Space Administration (NASA) are described. These projects were selected competitively from among proposals submitted to NASA in response to the 1991 SBIR Program Solicitation. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 301, in order of its appearance in the body of the report. Appendixes to provide additional information about the SBIR program and permit cross-reference of the 1991 Phase 1 projects by company name, location by state, principal investigator, NASA Field Center responsible for management of each project, and NASA contract number are included

Autonomous Surveillance Satellite

This paper describes the potential to enhance the performance and reliability of small satellites by using increased levels of digital processing on-board the spacecraft. It describes an architecture, developed by Control Data, that will satisfy its users\u27 needs and provide mechanisms for high reliability. The term SMARTSAT means a small satellite that has significant smarts (processing capability) on-board

Reconfiguration in an Optical Multiring Interconnection Network - Masters Thesis, December 2002

The advent of optical technology that can feasibly support extremely high bandwidth chip-to-chip communication raises a host of architectural questions in the design of digital systems. Terabit per second (and higher) bandwidths have not been previously available at the chip level. In this thesis, we examine the use of this technology in two different scenarios, viz., as the interconnection network in a multiprocessor system and as a switch fabric in network routers. Specifically, we examine the performance gains associated with utilizing the bandwidth reconfiguration capabilities of a system based on this technology

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Impact of 3D IC on NoC Topologies: A Wire Delay Consideration

International audienceIn this paper, we perform an exploration of 3D NoC architectures through physical design implementation based on two tiers Tezzaron 3D technology. The 3D NoC partitioning is done by dividing the NoC's datapath component into two blocks placed in the two tiers. Two Stacked NoC architectures namely Stacked 3D-Mesh NoC and Stacked 2D-Hexagonal NoC developed based on this partitioning strategy are analyzed by comparing their performances with Stacked 2D-Mesh NoC and classical 2D- Mesh and 3D-Mesh NoC. In order to measure the impact of wire delay on performance, two technology libraries (130 nm and 45 nm) representing old and advanced technologies have been used for the performance analysis. Results from physical implementations show that in advanced technologies such as 45 nm and below, the performance of Stacked 2D NoC topologies with datapath partitioning method have better performances compared with traditional 2D/3D Mesh topologies and Stacked 3D Mesh topology. We advocate here that with stacking there is no need for 3D NoC topologies for advanced 2-tier 3D IC and this is also confirmed for multistage networks like butterfly

Survey of FPGA applications in the period 2000 – 2015 (Technical Report)

Romoth J, Porrmann M, Rückert U. Survey of FPGA applications in the period 2000 – 2015 (Technical Report).; 2017.Since their introduction, FPGAs can be seen in more and more different fields of applications. The key advantage is the combination of software-like flexibility with the performance otherwise common to hardware. Nevertheless, every application field introduces special requirements to the used computational architecture. This paper provides an overview of the different topics FPGAs have been used for in the last 15 years of research and why they have been chosen over other processing units like e.g. CPUs

NASA Space Engineering Research Center for VLSI systems design

This annual review reports the center's activities and findings on very large scale integration (VLSI) systems design for 1990, including project status, financial support, publications, the NASA Space Engineering Research Center (SERC) Symposium on VLSI Design, research results, and outreach programs. Processor chips completed or under development are listed. Research results summarized include a design technique to harden complementary metal oxide semiconductors (CMOS) memory circuits against single event upset (SEU); improved circuit design procedures; and advances in computer aided design (CAD), communications, computer architectures, and reliability design. Also described is a high school teacher program that exposes teachers to the fundamentals of digital logic design