Reconfigurable Multifunctional van der Waals Ferroelectric Devices and Logic Circuits

In this work, we demonstrate the suitability of Reconfigurable Ferroelectric Field-Effect- Transistors (Re-FeFET) for designing non-volatile reconfigurable logic-in-memory circuits with multifunctional capabilities. Modulation of the energy landscape within a homojunction of a 2D tungsten diselenide (WSe$_2$) layer is achieved by independently controlling two split-gate electrodes made of a ferroelectric 2D copper indium thiophosphate (CuInP$_2$S$_6$) layer. Controlling the state encoded in the Program Gate enables switching between p, n and ambipolar FeFET operating modes. The transistors exhibit on-off ratios exceeding 10$^6$ and hysteresis windows of up to 10 V width. The homojunction can change from ohmic-like to diode behavior, with a large rectification ratio of 10$^4$. When programmed in the diode mode, the large built-in p-n junction electric field enables efficient separation of photogenerated carriers, making the device attractive for energy harvesting applications. The implementation of the Re-FeFET for reconfigurable logic functions shows how a circuit can be reconfigured to emulate either polymorphic ferroelectric NAND/AND logic-in-memory or electronic XNOR logic with long retention time exceeding 10$^4$ seconds. We also illustrate how a circuit design made of just two Re-FeFETs exhibits high logic expressivity with reconfigurability at runtime to implement several key non-volatile 2-input logic functions. Moreover, the Re-FeFET circuit demonstrates remarkable compactness, with an up to 80% reduction in transistor count compared to standard CMOS design. The 2D van de Waals Re-FeFET devices therefore exhibit groundbreaking potential for both More-than-Moore and beyond-Moore future of electronics, in particular for an energy-efficient implementation of in-memory computing and machine learning hardware, due to their multifunctionality and design compactness.Comment: 23 pages, 5 figures; Supporting Information: 12 pages, 6 figure

A Recent Approach towards Fluidic Microstrip Devices and Gas Sensors: A Review

This paper aims to review some of the available tunable devices with emphasis on the techniques employed, fabrications, merits, and demerits of each technique. In the era of fluidic microstrip communication devices, versatility and stability have become key features of microfluidic devices. These fluidic devices allow advanced fabrication techniques such as 3D printing, spraying, or injecting the conductive fluid on the flexible/rigid substrate. Fluidic techniques are used either in the form of loading components, switching, or as the radiating/conducting path of a microwave component such as liquid metals. The major benefits and drawbacks of each technology are also emphasized. In this review, there is a brief discussion of the most widely used microfluidic materials, their novel fabrication/patterning methods

Implementation of a CMOS Wallace-tree Multiplier

© ASEE 2009As slow and expensive operation units, multipliers are often the bottleneck limiting the overall performance of many computational VLSI circuits. Various CMOS multiplier architectures are available, such as the array multiplier, carry-save multiplier, and Wallace-tree multiplier. Wallace-tree multiplier has been a very popular design due to its fast speed, ease for modularization and fabrication. In this paper, the design and simulation of an 8-bit Wallace-tree multiplier with PSPICE is proposed. In order for comparison, an 8-bit CMOS array multiplier is also designed. The worst-case delay of both multiplier architectures are extracted and Wallace-tree multiplier demonstrates significant speed enhancement compared to CMOS array multiplier. Some efforts are made to further improve the performance of Wallace-tree multiplier. The revision in the circuit structure demonstrates effective speed improvement for the Wallace-tree multiplier

Low-Dimensional Materials for Disruptive Microwave Antennas Design

This chapter is devoted to a complete analysis of remarkable electromagnetic properties of nanomaterials suitable for antenna design miniaturization. After a review of state of the art mesoscopic scale modeling tools and characterization techniques in microwave domain, new approaches based on wideband material parameters identification (complex permittivity and conductivity) will be described from impedance equivalence formulation achievement by de-embedding techniques applicable in integrated technology or in free space. A focus on performances of 1D materials such as vertically aligned multi-wall carbon nanotube (VA-MWCNT) bundles, from theory to technology, will be presented as a disruptive demonstration for defense and civil applications as in radar systems

High-precision, large-domain three-dimensional manipulation of nano-materials for fabrication nanodevices

Nanoscaled materials are attractive building blocks for hierarchical assembly of functional nanodevices, which exhibit diverse performances and simultaneous functions. We innovatively fabricated semiconductor nano-probes of tapered ZnS nanowires through melting and solidifying by electro-thermal process; and then, as-prepared nano-probes can manipulate nanomaterials including semiconductor/metal nanowires and nanoparticles through sufficiently electrostatic force to the desired location without structurally and functionally damage. With some advantages of high precision and large domain, we can move and position and interconnect individual nanowires for contracting nanodevices. Interestingly, by the manipulating technique, the nanodevice made of three vertically interconnecting nanowires, i.e., diode, was realized and showed an excellent electrical property. This technique may be useful to fabricate electronic devices based on the nanowires' moving, positioning, and interconnecting and may overcome fundamental limitations of conventional mechanical fabrication

Adaptive computing’s impact?

Abstract“We're coming upon a sea change in the world of semiconductors,” says Nick Tredennick, former designer of the Motorola 68000 microprocessor, which powered the Apple Mac in the 1980s and early 90s. “There are compelling advantages to reconfigurable chips in terms of performance and power consumption.” The momentum for adaptive computing is a result of advances in special high-speed memory chips called static ram, or S-RAM chips that make it possible to imitate the entire hardware circuits of a processor on a single chip. In adaptive computing, chip wiring would be reconfigured on the fly by software altering the circuitry’s information pathways. Reconfigurable chips may offer speed, cost and energy-saving advantages, and allow for quicker product design cycles. And the ability to combine the functions of many chips into one would be particularly desirable in making smaller, lighter and more energy-efficient portable computing and communications devices. Cellphones that could work worldwide; portable computers that use suitable radio frequency and wirelessly, automatically connect to the Internet, or consumer electronics gadgets able to adjust to each new technical standard in digital sights and sounds, offer enormous attractions with upgrades as easy as downloading the latest circuit design from the Internet. The fixed-circuit approach needs templates, or masks at $1m for each new circuit, making it difficult for product designers to quickly adapt to changing markets and technology formats. But for an adaptive circuit, that investment is not unreasonable. Reconfigurable chip design has several dozen start-ups (eg QuickSilver, and GateChange Technologies), as well interesting the giants. Intel, IBM, Infineon, Motorola and Texas, have all moved into both acquisition and spin-off. Infineon acquired Morphics Technology (reconfigurable circuits for wireless digital telephone networks). Royal Philips Electronics acquired Systemonic, (reconfigurable chips for wireless data applications). Motorola invested in Morpho Technologies (reconfigurable circuits for wireless, imaging and multimedia applications). HP research laboratories has spun off two adaptive companies, Synfora (Program-In Chip-Out PICO) and Elixent (Reconfigurable Algorithm Processing RAP). Reconfigurable looks as if its coming to stay.This is a short news story only. Visit www.three-fives.com for the latest advanced semiconductor industry news

Roadmap on Biological Pathways for Electronic Nanofabrication and Materials

Conventional microchip fabrication is energy and resource intensive. Thus, the discovery of new manufacturing approaches that reduce these expenditures would be highly beneficial to the semiconductor industry. In comparison, living systems construct complex nanometer-scale structures with high yields and low energy utilization. Combining the capabilities of living systems with synthetic DNA-/protein-based self-assembly may offer intriguing potential for revolutionizing the synthesis of complex sub-10 nm information processing architectures. The successful discovery of new biologically based paradigms would not only help extend the current semiconductor technology roadmap, but also offer additional potential growth areas in biology, medicine, agriculture and sustainability for the semiconductor industry. This article summarizes discussions surrounding key emerging technologies explored at the Workshop on Biological Pathways for Electronic Nanofabrication and Materials that was held on 16–17 November 2016 at the IBM Almaden Research Center in San Jose, CA

A Triple-Mode Flexible E-Skin Sensor Interface for Multi-Purpose Wearable Applications

This study presents a flexible wireless electronic skin (e-skin) sensor system that includes a multi-functional sensor device, a triple-mode reconfigurable readout integrated circuit (ROIC), and a mobile monitoring interface. The e-skin device's multi-functionality is achieved by an interlocked micro-dome array structure that uses a polyvinylidene fluoride and reduced graphene oxide (PVDF/RGO) composite material that is inspired by the structure and functions of the human fingertip. For multi-functional implementation, the proposed triple-mode ROIC is reconfigured to support piezoelectric, piezoresistance, and pyroelectric interfaces through single-type e-skin sensor devices. A flexible system prototype was developed and experimentally verified to provide various wireless wearable sensing functions-including pulse wave, voice, chewing/swallowing, breathing, knee movements, and temperature-while their real-time sensed data are displayed on a smartphone