RF Design Methodologies bridging System-IC-Module Design

Abstract- There has been a long-standing need to link the RF design domains into a connected, common design environment. Such a methodology is possible through implementing system-level behavioral models with different levels of abstraction that can be modeled or co-simul ated at the IC circuit level. At module or board design, it is possible to link and simulate multiple chips with board-level components and parastics in an RFIC design environment. IC RFIC With today’s more complex IC designs that are heading toward nanometer-scaled semiconductor processes, the re is a desire to further understand the many subtle physical IC characteristics, such as layout and substrate parasitics, RF transistor models, IR drops, electromigration, elctromagnetics, and modeling of on-chip spiral inductors. Designers have entered into an era where they could benefit from a balance between analog, digital, and DSP design all in a fast and automated RFIC design environment. This paper presents RF design methodologies that can bridge between system, IC, and module design, providing an efficient, thorough design flow using advanced EDA tools. I