Scalable Analysis, Verification and Design of IC Power Delivery

Due to recent aggressive process scaling into the nanometer regime, power delivery network design faces many challenges that set more stringent and specific requirements to the EDA tools. For example, from the perspective of analysis, simulation efficiency for large grids must be improved and the entire network with off-chip models and nonlinear devices should be able to be analyzed. Gated power delivery networks have multiple on/off operating conditions that need to be fully verified against the design requirements. Good power delivery network designs not only have to save the wiring resources for signal routing, but also need to have the optimal parameters assigned to various system components such as decaps, voltage regulators and converters. This dissertation presents new methodologies to address these challenging problems. At first, a novel parallel partitioning-based approach which provides a flexible network partitioning scheme using locality is proposed for power grid static analysis. In addition, a fast CPU-GPU combined analysis engine that adopts a boundary-relaxation method to encompass several simulation strategies is developed to simulate power delivery networks with off-chip models and active circuits. These two proposed analysis approaches can achieve scalable simulation runtime. Then, for gated power delivery networks, the challenge brought by the large verification space is addressed by developing a strategy that efficiently identifies a number of candidates for the worst-case operating condition. The computation complexity is reduced from O(2^N) to O(N). At last, motivated by a proposed two-level hierarchical optimization, this dissertation presents a novel locality-driven partitioning scheme to facilitate divide-and-conquer-based scalable wire sizing for large power delivery networks. Simultaneous sizing of multiple partitions is allowed which leads to substantial runtime improvement. Moreover, the electric interactions between active regulators/converters and passive networks and their influences on key system design specifications are analyzed comprehensively. With the derived design insights, the system-level co-design of a complete power delivery network is facilitated by an automatic optimization flow. Results show significant performance enhancement brought by the co-design

SCORPIO: A 36-Core Research Chip Demonstrating Snoopy Coherence on a Scalable Mesh NoC with In-Network Ordering

URL to conference programIn the many-core era, scalable coherence and on-chip interconnects are crucial for shared memory processors. While snoopy coherence is common in small multicore systems, directory-based coherence is the de facto choice for scalability to many cores, as snoopy relies on ordered interconnects which do not scale. However, directory-based coherence does not scale beyond tens of cores due to excessive directory area overhead or inaccurate sharer tracking. Prior techniques supporting ordering on arbitrary unordered networks are impractical for full multicore chip designs. We present SCORPIO, an ordered mesh Network-on-Chip(NoC) architecture with a separate fixed-latency, bufferless network to achieve distributed global ordering. Message delivery is decoupled from the ordering, allowing messages to arrive in any order and at any time, and still be correctly ordered. The architecture is designed to plug-and-play with existing multicore IP and with practicality, timing, area, and power as top concerns. Full-system 36 and 64-core simulations on SPLASH-2 and PARSEC benchmarks show an average application run time reduction of 24.1% and 12.9%, in comparison to distributed directory and AMD HyperTransport coherence protocols, respectively. The SCORPIO architecture is incorporated in an 11 mm-by- 13 mm chip prototype, fabricated in IBM 45nm SOI technology, comprising 36 Freescale e200 Power Architecture TM cores with private L1 and L2 caches interfacing with the NoC via ARM AMBA, along with two Cadence on-chip DDR2 controllers. The chip prototype achieves a post synthesis operating frequency of 1 GHz (833 MHz post-layout) with an estimated power of 28.8 W (768 mW per tile), while the network consumes only 10% of tile area and 19 % of tile power.United States. Defense Advanced Research Projects Agency (DARPA UHPC grant at MIT (Angstrom))Center for Future Architectures ResearchMicroelectronics Advanced Research Corporation (MARCO)Semiconductor Research Corporatio

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers is dissipated in cooling. The remaining energy is used for computation, and causes the temperature ramp-up to operating conditions that already preclude operating all the cores at maximum performance levels, in order to prevent system overheating and failures. This situation is set to worsen as shipments of high-end (i.e., even denser) many-core servers are increasing at a 25% compound annual growth rate. Thus, state-of-the-art worst-case power and cooling delivery solutions on servers are reaching their limits and it will no longer be possible to power up simultaneously all the available on-chip cores (situation known as the existence of "dark silicon"); hence, drastically limiting the benefits of technology scaling. This presentation aims to completely revise the prevailing worst-case power and cooling provisioning paradigm for servers by championing a disruptive approach to computing server architecture design that prevents dark silicon. This proposed approach integrates a flexible heterogeneous many-core architecture template with an on-chip microfluidic fuel cell network for joint cooling delivery and power supply (i.e., local power generation and delivery), as well as a holistic power-temperature model predictive controller exploiting the server software stack, in order to achieve scalable and energy-minimal server architectures. Thanks to the disruptive system-level many-core architecture with microfluidic power and cooling delivery, as well as the complementary temperature control, we can envision the removal of the current limits of power delivery and heat dissipation in server designs, subsequently avoiding dark silicon in future servers and enabling new perspectives in future energy-proportional server designs

Test-Delivery Optimization in Manycore SOCs

We present two test-data delivery optimization algorithms for system-on-chip (SOC) designs with hundreds of cores, where a network-on-chip (NOC) is used as the interconnection fabric. We first present an e ective algorithm based on a subsetsum formulation to solve the test-delivery problem in NOCs with arbitrary topology that use dedicated routing. We further propose an algorithm for the important class of NOCs with grid topology and XY routing. The proposed algorithm is the first to co-optimize the number of access points, access-point locations, pin distribution to access points, and assignment of cores to access points for optimal test resource utilization of such NOCs. Testtime minimization is modeled as an NOC partitioning problem and solved with dynamic programming in polynomial time. Both the proposed methods yield high-quality results and are scalable to large SOCs with many cores. We present results on synthetic grid topology NOC-based SOCs constructed using cores from the ITC’02 benchmark, and demonstrate the scalability of our approach for two SOCs of the future, one with nearly 1,000 cores and the other with 1,600 cores. Test scheduling under power constraints is also incorporated in the optimization framework

A case study for NoC based homogeneous MPSoC architectures

The many-core design paradigm requires flexible and modular hardware and software components to provide the required scalability to next-generation on-chip multiprocessor architectures. A multidisciplinary approach is necessary to consider all the interactions between the different components of the design. In this paper, a complete design methodology that tackles at once the aspects of system level modeling, hardware architecture, and programming model has been successfully used for the implementation of a multiprocessor network-on-chip (NoC)-based system, the NoCRay graphic accelerator. The design, based on 16 processors, after prototyping with field-programmable gate array (FPGA), has been laid out in 90-nm technology. Post-layout results show very low power, area, as well as 500 MHz of clock frequency. Results show that an array of small and simple processors outperform a single high-end general purpose processo