Self-Checking Ripple-Carry Adder with Ambipolar Silicon Nanowire FET

For the rapid adoption of new and aggressive technologies such as ambipolar Silicon NanoWire (SiNW), addressing fault-tolerance is necessary. Traditionally, transient fault detection implies large hardware overhead or performance decrease compared to permanent fault detection. In this paper, we focus on on-line testing and its application to ambipolar SiNW. We demonstrate on self - checking ripple - carry adder how ambipolar design style can help reduce the hardware overhead. When compared with equivalent CMOS process, ambipolar SiNW design shows a reduction in area of at least 56% (28%) with a decreased delay of 62% (6%) for Static (Transmission Gate) design style

Novel Grid-Based Power Routing Scheme for Regular Controllable-Polarity FET Arrangements

Polarity-controllable transistors have emerged in the last few years as an adequate successor of current CMOS FinFETs. Due to the additional polarity terminal, novel physical design techniques are required. We present a novel grid-based power routing scheme able to mitigate the polarity terminal impact. The logic cells are organized in regular arrangements and easily configured using the novel power routing scheme. The impact of the placement and routing techniques used is gauged in terms of routing metal distribution, speed and area performance. Benchmark circuits are synthesized, placed and routed using commercial tools and performances are extracted. Post place and route results show 28% faster circuits compared to 22nm FinFET regular layout-based designs

A Surface Potential and Current Model for Polarity-Controllable Silicon Nanowire FETs

Silicon nanowire FET (SiNWFET) with dynamic polarity control has been experimentally demonstrated and has shown large potential in circuit applications. To fully explore its circuit-level opportunities, a physics-based compact model of the polarity-controllable SiNWFET is required. Therefore, in this paper, we extend the solution for conventional SiNWFETs to polarity-controllable SiNWFETs. By solving the current continuity equation, the potential distribution and drain current is obtained. The model shows good aoreement with TCAD simulation. It can be used as the core to develop the complete compact model for polarity-controllable SiNWFETs

Nanowire systems: technology and design (invited paper)

Nanosystems are large-scale integrated systems exploiting nanoelectronic devices. In this work, we consider double independent gate, vertically-stacked nanowire FETs with gate-all-around structures and typical diameter of 20-nm. These devices, which we have successfully fabricated and evaluated, control the ambipolar behavior of the nanostructure by selectively enabling one type of carriers. These transistors work as switches with electrically-programmable polarity and thus realize an exclusive or operation. The intrinsic higher expressive power of these FETs, as compared to standard CMOS, enables us to realize more efficient library cells, which we organize as tiles to realize circuits by regular arrays. This article surveys both the technology for double independent gate FETs as well as physical and logic design tools to realize digital systems with this fabrication technology

MIXSyn: An Efficient Logic Synthesis Methodology for Mixed XOR-AND/OR Dominated Circuits

We present a new logic synthesis methodology, called MIXSyn, that produces area-efficient results for mixed XOR-AND/OR dominated logic functions. MIXSyn is a two step synthesis process. The first step is a hybrid logic optimization that enables selective and distinct optimization of AND/OR and XOR-intensive portions of the logic circuit. The second step is a library-free technology mapping that enhances design flexibility with a tractable computational cost. MIXSyn has been tested on a set of large MCNC benchmarks. Experimental results indicate that MIXSyn produces CMOS circuits with 18.0% and 9.2% fewer devices, on the average, with respect to state-of-art academic and commercial synthesis tools, respectively. MIXSyn is also capable to exploit the opportunity of novel XOR implementations offered by the use of double-gate ambipolar devices. Experimental results show that MIXSyn can reduce the number of ambipolar transistors by 20.9% and 15.3%, on the average, with respect to state-of-art academic and commercial synthesis tools, respectively

Top-Down Fabrication of Gate-All-Around Vertically-Stacked Silicon Nanowire FETs with Controllable Polarity

Asthe currentMOSFET scaling trend is facing strong limitations, technologies exploiting novel degrees of freedom at physical and architecture level are promising candidates to enable the continuation of Moore's predictions. In this paper, we report on the fabrication of novel ambipolar Silicon nanowire (SiNW) Schottky-barrier (SB) FET transistors featuring two independent gate-all-around electrodes and vertically stacked SiNW channels. A top-down approach was employed for the nanowire fabrication, using an e-beam lithography defined design pattern. In these transistors, one gate electrode enables the dynamic configuration of the device polarity (n- or p-type) by electrostatic doping of the channel in proximity of the source and drain SBs. The other gate electrode, acting on the center region of the channel switches ON or OFF the device. Measurement results on silicon show I-on/I-off > 10(6) and subthreshold slopes approaching the thermal limit, SS approximate to 64 mV/dec (70 mV/dec) for p(n)-type operation in the same physical device. Finally, we show that the XOR logic operation is embedded in the device characteristic, and we demonstrate for the first time a fully functional two-transistor XOR gate

Polarity Control at Runtime:from Circuit Concept to Device Fabrication

Semiconductor device research for digital circuit design is currently facing increasing challenges to enhance miniaturization and performance. A huge economic push and the interest in novel applications are stimulating the development of new pathways to overcome physical limitations affecting conventional CMOS technology. Here, we propose a novel Schottky barrier device concept based on electrostatic polarity control. Specifically, this device can behave as p- or n-type by simply changing an electric input bias. This device combines More-than-Moore and Beyond CMOS elements to create an efficient technology with a viable path to Very Large Scale Integration (VLSI). This thesis proposes a device/circuit/architecture co-optimization methodology, where aspects of device technology to logic circuit and system design are considered. At device level, a full CMOS compatible fabrication process is presented. In particular, devices are demonstrated using vertically stacked, top-down fabricated silicon nanowires with gate-all-around electrode geometry. Source and drain contacts are implemented using nickel silicide to provide quasi-symmetric conduction of either electrons or holes, depending on the mode of operation. Electrical measurements confirm excellent performance, showing Ion/Ioff > 10^7 and subthreshold slopes approaching the thermal limit, SS ~ 60mV/dec (~ 63mV/dec) for n(p)-type operation in the same physical device. Moreover, the shown devices behave as p-type for a polarization bias (polarity gate voltage, Vpg) of 0V, and n-type for a Vpg = 1V, confirming their compatibility with multi-level static logic circuit design. At logic gate level, two- and four-transistor logic gates are fabricated and tested. In particular, the first fully functional, two-transistor XOR logic gate is demonstrated through electrical characterization, confirming that polarity control can enable more compact logic gate design with respect to conventional CMOS. Furthermore, we show for the first time fabricated four- transistors logic gates that can be reconfigured as NAND or XOR only depending on their external connectivity. In this case, logic gates with full swing output range are experimentally demonstrated. Finally, single device and mixed-mode TCAD simulation results show that lower Vth and more optimized polarization ranges can be expected in scaled devices implementing strain or high-k technologies. At circuit and system level, a full semi-custom logic circuit design tool flow was defined and configured. Using this flow, novel logic libraries based on standard cells or regular gate fabrics were compared with standard CMOS. In this respect, results were shown in comparison to CMOS, including a 40% normalized area-delay product reduction for the analyzed standard cell libraries, and improvements of over 2× in terms of normalized delay for regular Controlled Polarity (CP)-based cells in the context of Structured ASICs. These results, in turn, confirm the interest in further developing and optimizing CP devices, as promising candidates for future digital circuit technology

Multiple-Independent-Gate Field-Effect Transistors for High Computational Density and Low Power Consumption

Transistors are the fundamental elements in Integrated Circuits (IC). The development of transistors significantly improves the circuit performance. Numerous technology innovations have been adopted to maintain the continuous scaling down of transistors. With all these innovations and efforts, the transistor size is approaching the natural limitations of materials in the near future. The circuits are expected to compute in a more efficient way. From this perspective, new device concepts are desirable to exploit additional functionality. On the other hand, with the continuously increased device density on the chips, reducing the power consumption has become a key concern in IC design. To overcome the limitations of Complementary Metal-Oxide-Semiconductor (CMOS) technology in computing efficiency and power reduction, this thesis introduces the multiple- independent-gate Field-Effect Transistors (FETs) with silicon nanowires and FinFET structures. The device not only has the capability of polarity control, but also provides dual-threshold- voltage and steep-subthreshold-slope operations for power reduction in circuit design. By independently modulating the Schottky junctions between metallic source/drain and semiconductor channel, the dual-threshold-voltage characteristics with controllable polarity are achieved in a single device. This property is demonstrated in both experiments and simulations. Thanks to the compact implementation of logic functions, circuit-level benchmarking shows promising performance with a configurable dual-threshold-voltage physical design, which is suitable for low-power applications. This thesis also experimentally demonstrates the steep-subthreshold-slope operation in the multiple-independent-gate FETs. Based on a positive feedback induced by weak impact ionization, the measured characteristics of the device achieve a steep subthreshold slope of 6 mV/dec over 5 decades of current. High Ion/Ioff ratio and low leakage current are also simultaneously obtained with a good reliability. Based on a physical analysis of the device operation, feasible improvements are suggested to further enhance the performance. A physics-based surface potential and drain current model is also derived for the polarity-controllable Silicon Nanowire FETs (SiNWFETs). By solving the carrier transport at Schottky junctions and in the channel, the core model captures the operation with independent gate control. It can serve as the core framework for developing a complete compact model by integrating advanced physical effects. To summarize, multiple-independent-gate SiNWFETs and FinFETs are extensively studied in terms of fabrication, modeling, and simulation. The proposed device concept expands the family of polarity-controllable FETs. In addition to the enhanced logic functionality, the polarity-controllable SiNWFETs and FinFETs with the dual-threshold-voltage and steep-subthreshold-slope operation can be promising candidates for future IC design towards low-power applications