Modeling the Temperature Bias of Power Consumption for Nanometer-Scale CPUs in Application Processors

We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into account many of the physical effects that occur within such systems. Together with two algorithms described in the paper, our results can be used, for instance by engineers designing power or thermal management units, to cancel the temperature-induced bias on power measurements. This will help them gather temperature-neutral power data while running multiple instance of their benchmarks. Also power requirements and system failure rates can be decreased by controlling the CPU's thermal behavior. Even though it is usually assumed that the temperature/power relationship is exponentially related, there is however a lack of publicly available physical temperature/power measurements to back up this assumption, something our paper corrects. Via measurements on two pertinent platforms sporting nanometer-scale application processors, we show that the power/temperature relationship is indeed very likely exponential over a 20{\deg}C to 85{\deg}C temperature range. Our data suggest that, for application processors operating between 20{\deg}C and 50{\deg}C, a quadratic model is still accurate and a linear approximation is acceptable.Comment: Submitted to SAMOS 2014; International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV

Energy challenges for ICT

The energy consumption from the expanding use of information and communications technology (ICT) is unsustainable with present drivers, and it will impact heavily on the future climate change. However, ICT devices have the potential to contribute signi - cantly to the reduction of CO2 emission and enhance resource e ciency in other sectors, e.g., transportation (through intelligent transportation and advanced driver assistance systems and self-driving vehicles), heating (through smart building control), and manu- facturing (through digital automation based on smart autonomous sensors). To address the energy sustainability of ICT and capture the full potential of ICT in resource e - ciency, a multidisciplinary ICT-energy community needs to be brought together cover- ing devices, microarchitectures, ultra large-scale integration (ULSI), high-performance computing (HPC), energy harvesting, energy storage, system design, embedded sys- tems, e cient electronics, static analysis, and computation. In this chapter, we introduce challenges and opportunities in this emerging eld and a common framework to strive towards energy-sustainable ICT

A case study for NoC based homogeneous MPSoC architectures

The many-core design paradigm requires flexible and modular hardware and software components to provide the required scalability to next-generation on-chip multiprocessor architectures. A multidisciplinary approach is necessary to consider all the interactions between the different components of the design. In this paper, a complete design methodology that tackles at once the aspects of system level modeling, hardware architecture, and programming model has been successfully used for the implementation of a multiprocessor network-on-chip (NoC)-based system, the NoCRay graphic accelerator. The design, based on 16 processors, after prototyping with field-programmable gate array (FPGA), has been laid out in 90-nm technology. Post-layout results show very low power, area, as well as 500 MHz of clock frequency. Results show that an array of small and simple processors outperform a single high-end general purpose processo

High performance computing of explicit schemes for electrofusion jointing process based on message-passing paradigm

The research focused on heterogeneous cluster workstations comprising of a number of CPUs in single and shared architecture platform. The problem statements under consideration involved one dimensional parabolic equations. The thermal process of electrofusion jointing was also discussed. Numerical schemes of explicit type such as AGE, Brian, and Charlies Methods were employed. The parallelization of these methods were based on the domain decomposition technique. Some parallel performance measurement for these methods were also addressed. Temperature profile of the one dimensional radial model of the electrofusion process were also given