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2 research outputs found
Peeling condition analysis of biomimetic adhesive structure-A finite element study
Author
Publication venue
'Institute of Electrical and Electronics Engineers (IEEE)'
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Crossref
Peeling condition analysis of biomimetic adhesive structure – a finite element study
Author
Cheng Kuo Sung
Chih Yi Hung
Jagota A.
Van Oss C.J.
Publication venue
'Institution of Engineering and Technology (IET)'
Publication date
Field of study
No full text
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